|
|
|
Renesas Electronics Corporation |
Part No. |
7MPV6253-000
|
Description |
SRAM MODULE
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
DA14530-00FXDB-P
|
Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
DA14530-00FXDEVKT-P
|
Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Renesas Electronics Corporation |
Part No. |
DA14530-00000FX2
|
Description |
SmartBond™ Low Power Bluetooth 5.1 System-on-Chip
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
55530-001
|
Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, Polarized, 44 Positions ,2.00mm (0.079in) Pitch
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
FLSC80353000
|
Description |
DOME COVER 80 mm DIA, 35 mm high, FLS Series - RED
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
10119109-530007LF
|
Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
FLSC80753000
|
Description |
DOME COVER 80 mm DIA, 75 mm high, FLS Series - RED
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
48253-000LF
|
Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
|
Tech specs |
|
|
|
Official Product Page
|
|
|
|
Amphenol Communications Solutions |
Part No. |
84530-002
|
Description |
200 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array
|
Tech specs |
|
|
|
Official Product Page
|
|
Bom2Buy.com
Price and Availability
|