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Amphenol Communications Solutions |
| Part No. |
98414-G06-50LF
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| Description |
Minitek®, Board/Wire to Board Connectors, Shrouded Header - Through Mount - Double row - 50 Positions - 2mm (0.079inch) - Vertical
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-106500950LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-106500900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
RJHSE706502
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| Description |
Modular Jack - Right Angle, Input Output Connectors 6P6C, RA, Without Shield, With LEDs.
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| Tech specs |
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Official Product Page
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VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
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| Part No. |
271F 271G MDP14 MDP16-01-101G MDP16-01-101J MDP16-03-101G MDP16-05221_271F MDP16-05221_271G MDP16 MDP16-01-101F MDP16-03-101F MDP16-03-101J MDP16-05221_271J MDP16-05221/271J MDP16-05221/271F MDP16-05221/271G
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| Description |
Dual Inline Package, Molded DIP, 01, 03, 05 Schematics, Rugged, Molded Case Construction, Highly Stable, Automatic Insert Compatible, Uniform Performance Characteristics, Available in Tube Pack
Thick Film Resistor Networks Dual-In-Line Molded DIP 01 03 05 Schematics
(MDP14 / MDP16) Thick Film Resistor Networks
Sound/Security Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:7 x 26; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Capacitance:65pF/ft RoHS Compliant: Yes
Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics 厚膜电阻网络，双列直插，模压浸，0135电路
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| File Size |
214.21K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
50006-5030ALF
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| Description |
High Pin Count, Backplane Connectors, Header, Vertical, Press-Fit, 3 Row, 30 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
51110-0650
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| Description |
2.00mm (.079) Pitch, Milli-Grid Crimp Housing, 6 Circuits, without Center Polarization Key, without Locking Ramp, Leadfree
2.00mm (.079") Pitch, Milli-Grid垄芒 Crimp Housing, 6 Circuits, without Center Polarization Key, without Locking Ramp, Leadfree
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| File Size |
110.92K /
2 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-806501000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
93690-106-50LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-108120650LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54242-806501050LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54122-106120650RLF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 12 position, 2.54mm (0.100in) pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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