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MACOM[Tyco Electronics]
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| Part No. |
MAAMGM0003-DIE
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
0.4W Variable Distributed Amplifier 1.0 - 15.0 GHz
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| File Size |
265.55K /
7 Page |
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it Online |
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http://
MACOM[Tyco Electronics]
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| Part No. |
MAAMGM0002-SMB MAAMGM0002 MAAMGM0002-DIE MAAMGM0002-DIE-SMB
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable.
6
Biasing Note: Must ... |
| Description |
Amplifier, Distributed, 0.1W 1.0-18.0 GHz
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| File Size |
181.88K /
6 Page |
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it Online |
Download Datasheet |
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MACOM[Tyco Electronics]
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| Part No. |
MA08509D
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable.
VGG
5000 pF 0.1 F
VD... |
| Description |
10W Power Amplifier Die Preliminary Release 8.0-11 GHz
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| File Size |
68.75K /
3 Page |
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it Online |
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Atmel
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| Part No. |
U5021M
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| OCR Text |
...et out state
time out t 5 OR wedge = 1 Note: "mode" and "trg" are the debounced input signals from the pins MODE and TRG trg_ok = 1 after the rising edge of the trg signal trg_err = 1 when the trg signal low period is too long
trg = 0... |
| Description |
Digital Window Watchdog Timer
From old datasheet system
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| File Size |
64.38K /
9 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MA03503D_1 MA03503D1
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
Control Chip, Parallel Input Gain/Phase Control 8.0-11.0 GHz
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| File Size |
500.47K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MA01503D_1
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| OCR Text |
...ard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply ne... |
| Description |
X-Band Limiter/Low Noise Amplifier 8.5 -12.0 GHz
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| File Size |
344.64K /
7 Page |
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it Online |
Download Datasheet |
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Price and Availability
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