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  steel Datasheet PDF File

For steel Found Datasheets File :: 10055    Search Time::1.297ms    
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    PZT751T1 ON2781 PZT751T1_D PZT751T3

MOTOROLA INC
ON Semi
MOTOROLA[Motorola, Inc]
Part No. PZT751T1 ON2781 PZT751T1_D PZT751T3
OCR Text ...l is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SOT-223 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. SOLDERING PRECAUT...
Description 2000 mA, 60 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-261AA
SOT-223 PACKAGE HIGH CURRENT PNP SILICON TRANSISTOR SURFACE MOUNT
From old datasheet system

File Size 119.34K  /  6 Page

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    LA6523

SANYO[Sanyo Semicon Device]
Part No. LA6523
OCR Text ... Ta 1 Copper heatsink (Fin1) 2 steel heatsink (Fin1) 3 steel heatsink (Fin2) 1 2 3 Independent IC (Unit: mm) Ambient temperature, Ta - C Block Diagram No.4959-3/5 LA6523 Test Circuit Oscilloscope 10 Vp-p Rectang...
Description 3-Output Power Operational Amplifier

File Size 217.50K  /  5 Page

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    DS1990 DS1990A DS1990A-F3 DS1990A-F5

MAXIM - Dallas Semiconductor
DALLAS[Dallas Semiconducotr]
DALLAS[Dallas Semiconductor]
Part No. DS1990 DS1990A DS1990A-F3 DS1990A-F5
OCR Text ...shaped probes Durable stainless steel case engraved with registration number withstands harsh environments Easily affixed with self-stick adhesive backing, latched by its flange, or locked with a ring pressed onto its rim Presence detector ...
Description Serial Number iButton

File Size 150.76K  /  10 Page

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    M1MA151AT1 ON0327 M1MA152AT1

Motorola Inc
Motorola, Inc.
MOTOROLA[Motorola, Inc]
Part No. M1MA151AT1 ON0327 M1MA152AT1
OCR Text ...l is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SC-59 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. TYPICAL SOLDER HEAT...
Description SC-59 PACKAGE SINGLE SILICON SWITCHING DIODES 40/80 V-100 mA SURFACE MOUNT
From old datasheet system

File Size 79.97K  /  6 Page

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    MMBD1000LT1 MMSD1000LT1 MMBD2000T1

MOTOROLA[Motorola, Inc]
MOTOROLA[Motorola Inc]
Part No. MMBD1000LT1 MMSD1000LT1 MMBD2000T1
OCR Text ...l is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. TYPICAL S...
Description Switching Diode

File Size 171.22K  /  8 Page

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    MMFT107T1D MMFT107T3 MMFT107T1 MMFT107 MMFT107T1-D

ONSEMI[ON Semiconductor]
Part No. MMFT107T1D MMFT107T3 MMFT107T1 MMFT107 MMFT107T1-D
OCR Text ...STENCIL GUIDELINES or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SOT-223 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. SOLDERING PRECAUT...
Description Power MOSFET 250 mA, 200 Volts N-Channel SOT-223
Power MOSFET 250 mA / 200 Volts
Power MOSFET 250 mA, 200 Volts 250 mA, 200 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA

File Size 78.70K  /  8 Page

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    MMFT107T1 ON2213

MOTOROLA[Motorola, Inc]
Part No. MMFT107T1 ON2213
OCR Text ...l is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the SOT-223 package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration. SOLDERING PRECAUT...
Description MEDIUM POWER TMOS FET 250 mA / 200 VOLTS
MEDIUM POWER TMOS FET 250 mA, 200 VOLTS
From old datasheet system

File Size 116.30K  /  6 Page

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For steel Found Datasheets File :: 10055    Search Time::1.297ms    
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