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  solder Datasheet PDF File

For solder Found Datasheets File :: 91744    Search Time::1.547ms    
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    ECLIPTEK CORP
Part No. E1SLA32-15.000M
OCR Text ...ler ances are 0.1 sug g ested solder p ad la y out solder land (x2) all dimensions in millimeters t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recomm...
Description QUARTZ CRYSTAL RESONATOR, 15 MHz

File Size 120.75K  /  4 Page

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    Vishay Sprague
Part No. CWR11FH336KCTR CWR11CH156JB CWR11CH156JC
OCR Text ...s a, b and c ? termination: h = solder plated, k = solder fused ? molded case available in four case codes ? compatible with high volume automatic pick and place equipment applications ? military/aerospace ? general purpose ? high reliabi...
Description CWR11 Solid Tantalum Surface Mount Capacitors Tantamount&#174; Molded Case, Military MIL-PRF-55365/8 Qualified
CAPACITOR, TANTALUM, SOLID, POLARIZED, 4 V, 15 uF, SURFACE MOUNT, 1411, CHIP

File Size 823.02K  /  17 Page

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    BF36A1M

ETC
Part No. BF36A1M
OCR Text ...0min. 5min. 30min. < 1.0 solder temperature test sold temp.260c for 10 sec. < 1.0 soldering immerse the pins melt solder at 260c+5/- 0c for 5 sec. more then 95% of total area of t...
Description SAW filter

File Size 511.74K  /  6 Page

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    AF389A4M

ETC
Part No. AF389A4M
OCR Text ...cycle 30m 10m 30m < 1.0 solder temperature test sold temp.260?? for 10 sec. < 1.0 soldering immerse the pins melt solder at 260??+5/- 0?? for 5 sec. more then 95% of total area of...
Description SAW filter

File Size 415.44K  /  7 Page

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    Microdc power Technology Co., Ltd
Microdc power Technolog...
Part No. A0503XT A0303XT A0305NXT A0305XT A0309XT
OCR Text ...requested by lead-free ref l ow solder processes. with the small footprint, these converters are the ideal solution for board level power distribution,mainly for applications in the industrial and telecom field. for automated smd production...
Description 1W, FIXED INPUT, ISOLATED DUAL OUTPUT SMD DC-DC CONVERTER

File Size 979.40K  /  6 Page

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    74AHCT1G00 74AHCT1G00GW 74AHC1G00 74AHC1G00GW

Philips Semiconductors
Part No. 74AHCT1G00 74AHCT1G00GW 74AHC1G00 74AHC1G00GW
OCR Text ...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description 2-input NAND gate

File Size 80.05K  /  12 Page

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    74AHCT1G02 74AHCT1G02GW 74AHC1G02 74AHC1G02GW

Philips Semiconductors
Part No. 74AHCT1G02 74AHCT1G02GW 74AHC1G02 74AHC1G02GW
OCR Text ...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description 2-input NOR gate

File Size 80.65K  /  12 Page

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    74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW

Philips Semiconductors
Part No. 74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW
OCR Text ...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description Inverter

File Size 79.87K  /  12 Page

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    74AHCT1G08 74AHCT1G08GW 74AHC1G08 74AHC1G08GW

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. 74AHCT1G08 74AHCT1G08GW 74AHC1G08 74AHC1G08GW
OCR Text ...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description 2-input AND gate

File Size 80.01K  /  12 Page

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    74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1

NXP Semiconductors N.V.
PHILIPS[Philips Semiconductors]
Part No. 74AHCT1G32 74AHCT1G32GW 74AHC1G32 74AHC1G32GW 74AHC1G32GW/T1
OCR Text ...ering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement....
Description IC-SM-CMOS LOGIC
2-input OR gate

File Size 80.51K  /  12 Page

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For solder Found Datasheets File :: 91744    Search Time::1.547ms    
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