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NXP Semiconductors N.V.
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| Part No. |
BYD47-20135 BYD47-20/T3
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| OCR Text |
sod87 package through implotec? technology. this package is hermetically sealed and fatigue free as coef?cients of expansion of all used parts are matched. 1.2 features n glass passivated n high maximum operating temperature n low leakage c... |
| Description |
0.34 A, 2000 V, SILICON, SIGNAL DIODE HERMETICAL SEALED, GLASS PACKAGE-2
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| File Size |
54.30K /
10 Page |
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