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Texas Instruments |
Part No. |
TLV70736PDQNT
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Description |
200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 125
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
TLV70736PDQNR
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Description |
200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 125
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Tech specs |
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Get Free Sample |
Official Product Page
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Texas Instruments |
Part No. |
TLV70736DQNR
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Description |
200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 125
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Tech specs |
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Get Free Sample |
Official Product Page
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Texas Instruments |
Part No. |
TLV70736DQNT
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Description |
200mA Low-Iq Low-Noise Low-Dropout (LDO) Regulator for Portable Devices 4-X2SON -40 to 125
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
DA9073-62V32
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Description |
Highly Integrated PMIC for Wearables and Home Automation
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Tech specs |
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Official Product Page
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Molex Electronics Ltd. http://
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Part No. |
0736446217 73644-6217
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Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits
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File Size |
179.64K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
Part No. |
DA9073-62V36
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Description |
Highly Integrated PMIC for Wearables and Home Automation
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
75160-107-36LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical header, through hole, single Row,36 position, 2.54mm pitch
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0736443008 73644-3008
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Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits
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File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
75168-807-36LF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0736443011 73644-3011
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Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position F, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position F, 144 Circuits
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File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
75168-107-36LF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0736443013 73644-3013
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Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position G, 144 Circuits 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position G, 144 Circuits
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File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
77315-807-36LF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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