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  package-8 Datasheet PDF File

For package-8 Found Datasheets File :: 337926    Search Time::5.422ms    
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    SO-8

STMicroelectronics
Part No. SO-8
OCR Text ....189 0.150 TYP. MAX. MIN. PACKAGE AND PACKING INFORMATION 8-LEAD SMALL OUTLINE PACKAGE Weight: not available 8 (max.) 0.1 0.04 SO-8 February 2005 1/5 SO-8 PACKAGE AND PACKING INFORMATION TUBE SHIPMENT INFORMATION ...
Description 8-LEAD SMALL OUTLINE PACKAGE

File Size 50.45K  /  5 Page

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    SGS Thomson Microelectronics
Part No. BTA12-8 BTA12-600CW
OCR Text ...tor btb: non insulated to-220ab package ordering information symbol parameter value unit r th(j-c) junction to case (ac) d 2 pak/to-220ab 1...8 1 0 1 2 1 4 1 6 p (w) it(rms)(a) 0 25 50 75 100 125 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 it(rms) (a)...
Description 12A TRIACS

File Size 105.34K  /  7 Page

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    SLVU2.8-8-T7

ProTek Devices
Part No. SLVU2.8-8-T7
OCR Text ...in one defined by dot on top of package 05181 pin configuration so-8 slvu2.8-8 2 05181.r3 3/07 www.protekdevices.com device characteristics electrical characteristics per line @ 25c unless otherwise specified peak pulse...
Description ULTRA LOW CAPACITANCE TVS ARRAY 600 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE

File Size 71.52K  /  5 Page

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    Atmel
Part No. ATAM862-8
OCR Text package fully-integrated 4-bit microcontroller with rf transmitter  low power consumption in sleep mode (< 1 a typically)  flash contr...8 is a single package dual-chip circuit. it combines a uhf ask/fsk transmitter with a 4-bit microco...
Description Microcontroller with UHF ASK/FSK Transmitter at 868 MHz and 915 MHz, 4 KB Flash, 3 Timer, SSI, 11 I/O Lines, 64 Byte EEPROM, VDD ...

File Size 1,121.93K  /  107 Page

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    Amphenol, Corp.
Part No. HYM7V75A801BLTZG-8 HYM7V75A801BLTZG-10S HYM7V75A801BLTZG-10P HYM7V75A801BTZG-10S HYM7V75A801BTZG-8 HYM7V75A801BTZG-10P
OCR Text ...drams in 400mil 54pin tsop - ii package and 2kbit eeprom in 8pin tssop package on a 144pin glass - epoxy prin ted circuit board. a 0.22uf a...8, or full page for sequential burst - . 1, 2, 4 or 8 for interleave burst progr ammable /c...
Description x72 SDRAM Module x72内存模块

File Size 304.33K  /  14 Page

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    HYNIX SEMICONDUCTOR INC
Part No. HYM71V16655ALT8M-8
OCR Text ...s drams in 400mil 54pin tsop-ii package, one 2kbit eeprom in 8pin tssop package on a 168pin glass-epoxy printed circuit board. one 0.0022uf...8 or full page for sequential burst - 1, 2, 4 or 8 for interleave burst ? programmable cas latency...
Description 16M X 64 SYNCHRONOUS DRAM MODULE, 6 ns, DMA168

File Size 233.13K  /  14 Page

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    TIM1414-8-252

Toshiba Semiconductor
Part No. TIM1414-8-252
OCR Text ...MATCHED FET HERMETICALLY SEALED PACKAGE RF PERFORMANCE SPECIFICATIONS CHARACTERISTICS Output Power at 1dB Gain Compression Point Power G...8.0 1.6 MAX. -5.0 10.4 2.5 gm VGSoff IDSS VGSO Rth(c-c) CONDITIONS VDS= 3V IDS= 4.0 A VDS=...
Description HIGH POWER P1dB=39.0 dBm at 13.75 GHz to 14.5 GHz

File Size 120.32K  /  4 Page

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    SENSITRON SEMICONDUCTOR
Part No. S16LCC03-8
OCR Text ...e asics so-16 surface mount package approximate weight: 0.13 grams marking: device number, date code, & logo pin #1 i ndicator...8/20 m s waveshape 300 w t j operating temperature -55 to +125 c t stg storage temperature -55 to...
Description 300 W, BIDIRECTIONAL, 8 ELEMENT, SILICON, TVS DIODE

File Size 84.69K  /  3 Page

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    Electronic Theatre Controls, Inc.
ETC[ETC]
TOYOCOM
Part No. TGX-8
OCR Text ...0,000 G min.) High reliable LCC package Glass seal package Application Digital still camera PC Specifications Type Frequency range ...8 Over 30.000MHz to 50.000MHz Fundamental 100 ppm (-10 C to +60 C, inclusive of frequency tolerance...
Description Ceramic Glass Seal

File Size 65.74K  /  1 Page

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