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non-solder Datasheet PDF File

For non-solder Found Datasheets File :: 32327 Search Time::1.672ms
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				PROTEC[Protek Devices]
Part No.	SFC05-4-T75-1 SFC05-4-T75-2 SFC05-4_07 SFC05-4 SFC05-4-LF-T75-2 SFC05-407
OCR Text	...erature VALUE 0.275mm Round non-solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240...
Description	FLIP CHIP ARRAY
File Size	85.31K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PESD1CAN-U
OCR Text	... [1] device stressed with ten non-repetitive current pulses (8/20 ? s exponential decay waveform according to iec 61000-4-5 and iec 61643...solder lands solder resist occupied area solder paste sot323_fr 2.65 2.35 0.6 (3) 0.5 (3) 0.55 (3) 1...
Description	CAN bus ESD protection diode
File Size	409.56K / 12 Page	View it Online	Download Datasheet

				http:// PROTEC[Protek Devices]
Part No.	ULLC0402FC05C-T710-2 ULLC0402FC05C-T75-1 ULLC0402FC05C06 ULLC0402FC05C
OCR Text	...erature VALUE 0.275mm Round non-solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240...
Description	UNBUMPED LOW CAPACITANCE FLIP CHIP ARRAY
File Size	72.18K / 5 Page	View it Online	Download Datasheet

				Lumberg
Part No.	0306-2
OCR Text	...et lhumidit ip 67: tanche ltat non enfich (swum?); ni poussire ni humidit ne peuvent entrer dans lappareil au travers dun connecteur non enfich et non protg par ngligence exigences ip x8 aprs entente entre utilisateur et fabricant 3 suiva...
Description	Leiterplattenlayouts siehe Seite 3.63
File Size	177.40K / 3 Page	View it Online	Download Datasheet

				Mill-Max Mfg. Corp. MILL-MAX MFG CORP
Part No.	310-93-120-41-001000 311-44-117-41-001000 315-43-117-41-003000 311-41-122-41-001000 315-41-122-41-003000 311-93-127-41-001000 315-44-143-41-003000 311-44-143-41-001000 311-93-111-41-001000 311-99-153-41-001000 315-41-103-41-003000 315-99-115-41-001000 315-99-115-41-003000 315-99-110-41-003000
OCR Text	... plating code. 41 & 91 platings non-standard 41 & 91 platings non-standard 41 & 91 platings non-standard
Description	SINGLE-IN-LINE SOCKETS .100 Grid Solder Tail Single Row SIP17, IC SOCKET SIP22, IC SOCKET SIP27, IC SOCKET SIP43, IC SOCKET SIP11, IC SOCKET SIP53, IC SOCKET SIP3, IC SOCKET SIP15, IC SOCKET SIP10, IC SOCKET
File Size	139.85K / 1 Page	View it Online	Download Datasheet

				Delta Electronics, Inc.
Part No.	DVETR2812D
OCR Text	..., sc01 and cs02 flanged and non-flanged versions available mil-prf-38534 element evaluated components ...solder temperature (10 seconds) 270c power dissipation (full load, t case = +125c) 14 watts weight ...
Description	Standard DC-DC Converters with Integral EMI Filter - Hybrid Technology. Hermetic Packaging 标准的DC - DC与积分EMI滤波混合动力技术的转换器。密封包
File Size	253.80K / 13 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	PKFC3.3C PKFC36C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC33C
OCR Text	...erature VALUE 0.275mm Round non-solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240...
Description	PACKAGED FLIP CHIP ARRAY
File Size	76.68K / 5 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers
Part No.	DK0034T DK0033T DK0032T DK0035T ATC600F
OCR Text	non- magnetic barrier * w = tin/lead solder plated over nickel barrier solderability: solder coverage > 90% of end termination terminal strength: 4 lbs. typ., 2 lbs. min. mechanical specifications environmental specifications capacitance:...
Description	Ultra-Low ESR, High Q, NPO RF & Microwave Capacitors
File Size	351.44K / 4 Page	View it Online	Download Datasheet

				PROTEC[Protek Devices]
Part No.	P0408FC3.3C P0408FC12C P0408FC08C P0408FC05C P0408FC36C P0408FC15C P0408FC24C P0408FC33C
OCR Text	...erature VALUE 0.275mm Round non-solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240...
Description	DEVICE CHARACTERISTICS
File Size	117.23K / 6 Page	View it Online	Download Datasheet

For non-solder Found Datasheets File :: 32327 Search Time::1.672ms
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