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Pasternack Enterprises, Inc.
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| Part No. |
PE44211
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| OCR Text |
launch pcb, .250 inch diameter, .030 inch diameter sma female bulkhead connector solder attachment 0.042 inch end launch pcb, .250 inch diameter, .030 inch diameter confguration connector sma female connector interface type 0.042 inch... |
| Description |
SMA Female Bulkhead Connector Solder Attachment 0.042 inch End launch PCB, .250 inch Diameter, .030 inch Diameter
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| File Size |
224.55K /
2 Page |
 View
it Online |
Download Datasheet
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Maxim Integrated Products, Inc.
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| Part No. |
MAX35101
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| OCR Text |
...x units output voltage high (launch_up, launch_dn) v ohlauch v cc = 3.3v, i out = -50ma 2.8 3.0 v output voltage low ( wdo, int, dout, cmp_out/up_dn) v ol 4ma 0.2 x v cc v pulldown resistance (tc) r tc 650 1000 1500 ? input voltage lo... |
| Description |
Time-to-Digital Converter with Analog Front-End
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| File Size |
361.31K /
8 Page |
View
it Online |
Download Datasheet |
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Pasternack Enterprises, Inc.
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| Part No. |
PE44138
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| OCR Text |
launch pcb, .020 inch x .010 inch contact confguration connector smc jack connector interface type 0.042 inch end launch cable attachment method (shield/contact) solder body style straight electrical specifcations impedance, ohms ... |
| Description |
SMC Jack Connector Solder Attachment 0.042 inch End launch PCB, .020 inch x .010 inch Contact
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| File Size |
234.27K /
2 Page |
View
it Online |
Download Datasheet |
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RF MICRO DEVICES INC
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| Part No. |
RFSW2040D
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| OCR Text |
... ceramic coplanar to microstrip launch. the launch was then wire bonded to the die using two 1 mil bondwires. the spacing between the launch and the die was 200um, and the bondwire loop height was 100um. the thickness of the test interface... |
| Description |
0 MHz - 25000 MHz RF/MICROWAVE SGL POLE SGL THROW SWITCH, 1.4 dB INSERTION LOSS
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| File Size |
497.92K /
6 Page |
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it Online |
Download Datasheet |
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RF MICRO DEVICES INC
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| Part No. |
RFSW2041DSQ
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| OCR Text |
... ceramic coplanar to microstrip launch. the launch was then wire bonded to the die using two 1 mil bondwires. the spacing between the launch and the die was 200um, and the bondwire loop height was 100um. the thickness of the test interface... |
| Description |
0 MHz - 25000 MHz RF/MICROWAVE SGL POLE DOUBLE THROW SWITCH, 1.8 dB INSERTION LOSS
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| File Size |
548.49K /
6 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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