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Murata Manufacturing Co...
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| Part No. |
GRM155C81C105KE15A
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
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| File Size |
636.30K /
30 Page |
 View
it Online |
Download Datasheet
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Murata Manufacturing Co...
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| Part No. |
GRM1555C2A6R6DA01
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| OCR Text |
... material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm (grm02/grm03/grm15: t:0.8mm) copper foil thickness : 0.035mm : solder resist ... |
| Description |
Chip Monolithic Ceramic Capacitor for General
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| File Size |
631.74K /
30 Page |
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it Online |
Download Datasheet |
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Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
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| Part No. |
LN30 LN15
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| OCR Text |
...e barrier with aluminum/polymer laminated tape (LN15)
Cable Drawing
Colored optical fiber Gel-filled buffer tube Steel central member Dielectric central member Water swellable yarn Water swellable tape laminated aluminum tape Rip cord O... |
| Description |
Single Jacket Non-Armored 单夹克非装甲
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| File Size |
104.77K /
2 Page |
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it Online |
Download Datasheet |
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Murata Manufacturing Co...
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| Part No. |
GRM0225C1H6R6DA03
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
615.37K /
30 Page |
View
it Online |
Download Datasheet |
| |
|
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Murata Manufacturing Co...
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| Part No. |
GRM0225C1C6R6DA03
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
616.28K /
30 Page |
View
it Online |
Download Datasheet |
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Murata Manufacturing Co...
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| Part No. |
GRM0222C1H6R6DA03
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
615.21K /
30 Page |
View
it Online |
Download Datasheet |
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|
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Murata Manufacturing Co...
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| Part No. |
GRM0222C1E6R6DA03
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| OCR Text |
...erial : jis c 6484 copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 0.8mm copper foil thickness: 0.035mm kind of solder : sn-3.0ag-0.5cu fig.1 (in mm) ? pressurization method fig.2 (in mm) adhesive str... |
| Description |
Chip Multilayer Ceramic Capacitors for General Purpose
|
| File Size |
616.28K /
30 Page |
View
it Online |
Download Datasheet |
|
Price and Availability
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