| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10132450-1611GLF
|
| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 16 Positions, GW Compatible PA9T, Tray packing.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
67045-016LF
|
| Description |
Quickie®, Wire To Board, Strain Relief, 16 Positions
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
66245-016LF
|
| Description |
Quickie® IDC Cable-to-Board Connector System, Backplane - Double row - 16 Positions - 2.54 mm (0.100in) .
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10132450-1621GLF
|
| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 16 Positions, GW Compatible PA9T, Tray packing.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |
Amphenol Communications Solutions |
| Part No. |
10132450-1621GRSLF
|
| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, 16 Positions, Tin plating, Black Color, GW Compatible PA9T, Tape and Reel, with Straight Tail.
|
| Tech specs |
|
|
|
Official Product Page
|
| |
|
 |

Molex Electronics Ltd.
|
| Part No. |
0879145016 87914-5016
|
| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
| File Size |
3,779.55K /
48 Page |
View
it Online |
Download Datasheet
|
|

Bom2Buy.com

Price and Availability
|