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For in-unsawn Found Datasheets File :: 206 Search Time::2.156ms
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				STMicroelectronics ST Microelectronics
Part No.	XRA00 XRA00-SBN18I XRA00-W4I
OCR Text	...cost integrated circuit for use in radio frequency identification (RFID) transponders (tags) operating in the UHF band of frequencies. It is...Unsawn Inkless Wafer SBN18I = 180m 15 m Bumped and Sawn Inkless Wafer on 8-inch Frame Customer Code...
Description	UHF, EPCglobal, Contactless Memory IC 96 bit ePC with Inventory and Kill Function UHF/ EPCglobal/ Contactless Memory IC 96 bit ePC with Inventory and Kill Function EEPROM (Electrically-Erasable PROM) - Datasheet Reference From old datasheet system
File Size	93.13K / 4 Page	View it Online	Download Datasheet

				PLX Technology, Inc. NXP Semiconductors
Part No.	PCF8564ACX9_1 PCF8564ACX9_B_1 PCF8564A PCF8564AU_10AA_1 PCF8564AU_10AB_1 PCF8564AU_5BB_1 PCF8564AU_5BD_1 PCF8564AU_5GB_1 PCF8564AU_5GE_1 PCF8564ACX9/1 PCF8564ACX9/B/1 PCF8564AU/10AA/1 PCF8564AU/5BD/1 PCF8564AU/5GB/1 PCF8564AU/5GE/1 PCF8564AU/10AB/1 PCF8564AU/5BB/1
OCR Text	... speed is 400 kbit/s. The built-in word address register is incremented automatically after each written or read data byte. 2. Features ...unsawn wafer; thickness 280 m unsawn wafer; thickness 687 m wafer sawn on FFC; thickness 200 m unsaw...
Description	REAL TIME CLOCK, UUC9 DIE-9 Real time clock and calendar
File Size	198.23K / 44 Page	View it Online	Download Datasheet

				INFINEON TECHNOLOGIES AG
Part No.	SLE4406SPEC SLE4406SPEMFC3 SLE4406SPEM3
OCR Text	...tact: infineon technologies ag in munich, germany, chip card & security ics, tel +49 (0)89 234-80000 fax +49 (0)89 234-81000 e-mail...unsawn sle 4406sp d die (on wafer) sawn sle 4406sp m3 t-m3.2-6 sle 4406sp mfc3 s-mfc3.1-6-1 ...
Description	512 X 1 EEPROM 5V, UUC 512 X 1 EEPROM 5V, DMA
File Size	257.30K / 6 Page	View it Online	Download Datasheet

				意法半导 ST Microelectronics STMICROELECTRONICS[STMicroelectronics]
Part No.	STDELIV SMARTCARD ST19SF08CD45XXXZ
OCR Text	...ous components and technologies in order to issue a finished product: - micromodules, - flat packages, - wafers. MICROMODULES Dedicated pack...unsawn wafers deliveries, listed in Table 3. Figure 1. Delivery form s 4 4 Table 1. Micromodule...
Description	ORDERING INFORMATION FOR PACKAGE AND DELIVERY ORDERING INFORMATION FOR PACKAGE AND DELIVERY
File Size	31.03K / 2 Page	View it Online	Download Datasheet

				Atmel
Part No.	T2527 T2527N740-DDW
OCR Text	in the Range of 30 kHz to 56 kHz; * * * * * * * Adjusted by Zener-diode Fusing Enhanced Bandpass Filter Accuracy of 1.25% ESD: 4 kV HBM, 40...unsawn wafers (DDW) in box, SO8 (150 mil) and TSSOP8 (3 mm body). Extended Type Number T2527N0xx -y...
Description	Low-voltage Highly Selective IR Receiver IC Low-voltage highly selective IR receiver IC. Carrier frequency 40 kHz.
File Size	126.49K / 11 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. Philips Semiconductors
Part No.	SL1ICS3001U SL1ICS3001W SL1ICS3001U/N5D SL1ICS3001U/L6D SL1ICS3001W/N5D
OCR Text	INTEGRATED CIRCUITS SL1 ICS30 01 I*CODE1 Label IC Chip Specification Product Specification Revision 2.1 Public 2000-05-02 Philips S...Unsawn Wafers..........................................................................................
Description	I.CODE1 Label IC Chip Specification SPECIALTY CONSUMER CIRCUIT, UUC4 5015 RR 3#8 SKT RECP 5015 RR 2#8 3#12 PIN RECP 5015 RR 3#8 PIN RECP
File Size	369.64K / 22 Page	View it Online	Download Datasheet

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