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				ONSEMI[ON Semiconductor] MOTOROLA[Motorola Inc] Motorola, Inc
Part No.	MMBT5551LT1 MMBT5550LT1_D MMBT5550LT1 ON2126
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	High Voltage Transistors(NPN Silicon) *Motorola Preferred Device From old datasheet system
File Size	199.67K / 6 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. MOTOROLA[Motorola, Inc] http://
Part No.	2N7002LT1 ON0106
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	CASE 318-08, STYLE 21 SOT-23 (TO-236AB) 115 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236AB From old datasheet system
File Size	92.99K / 6 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	MUN5216 MUN5216DW1T1 MUN5211 MUN5215 MUN5215DW MUN5215DW1T1 MUN5213 MUN5213DW1T1 MUN5230 MUN5230DW1T1 MUN5231 MUN5231DW1T1 MUN5232 MUN5232DW1T1 MUN5233 MUN5234 MUN5234DW1T1 MUN5235 MUN5235DW1 MUN5235DW1T1 MUN5212 MUN5212DW1T1 MUN5214 MUN5214DW1T1 MUN5211DW1T1 MUN52XXDW1T1 MUN5233DW1T1 MUN5236DW1T1 MUN5237DW1T1 MUN5211DW1 MUN5212DW1 MUN5214DW1 MUN5231DW1
OCR Text	...S Characteristic (One Junction heated) Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance - Junction-to-Ambient Characteristic (Both Junctions heated) Total Device Dissipation TA = 25C Derate above 25C Thermal Resistance...
Description	Dual Bias Resistor Transistors
File Size	151.63K / 20 Page	View it Online	Download Datasheet

				NXP Semiconductors PHILIPS[Philips Semiconductors]
Part No.	PCF1303 PCF1303T
OCR Text	... example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding ag...
Description	18-element bar graph LCD driver
File Size	59.49K / 10 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	PCF2100 PCF2100C PCF2100CP PCF2100CT PCF2111 PCF2111C PCF2111CP PCF2111CT PCF2112C PCF2112CP PCF2112CT
OCR Text	...nd-held soldering iron or pulse-heated solder tool) DEFINITIONS LIFE SUPPORT APPLICATIONS PCF21xxC family 1997 Mar 28 2 Philips Semiconductors Product specification LCD drivers 1 FEATURES 2 PCF21xxC family GENERAL DES...
Description	LCD drivers
File Size	202.75K / 24 Page	View it Online	Download Datasheet

				Motorola, Inc. ON Semiconductor
Part No.	BAS40-04LT1 ON0119
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	Dual Series Schottky Diode(高速开关应用，-0.50V正向电压，反向电0V的双肖特基势垒二极管) From old datasheet system SCHOTTKY BARRIER DIODES
File Size	73.00K / 4 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	BAS40-06LT1 BAS40-06LT1/D
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	PSoC® Mixed-Signal Array SCHOTTKY BARRIER DIODE
File Size	74.38K / 4 Page	View it Online	Download Datasheet

				Motorola, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS4004LT1
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	CASE 318 08/ STYLE 12 SOT 23 (TO 236AB) CASE 318 08, STYLE 12 SOT 23 (TO 236AB)
File Size	73.08K / 4 Page	View it Online	Download Datasheet

				Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS4006LT1
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	CASE 318-08/ STYLE 11 SOT-23 (TO-236AB) CASE 318-08, STYLE 11 SOT-23 (TO-236AB)
File Size	74.33K / 4 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. Motorola Inc MOTOROLA[Motorola, Inc]
Part No.	BAS40LT1 ON0121 BAS4
OCR Text	...vice. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress...
Description	CASE 318-08, STYLE 8 SOT-23 TO-236AB SILICON, SIGNAL DIODE, TO-236AB CASE 318-08/ STYLE 8 SOT-23 TO-236AB From old datasheet system
File Size	71.42K / 4 Page	View it Online	Download Datasheet

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