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Amphenol Communications Solutions |
| Part No. |
L17H2EE1120TM
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| Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 37/37 (Socket/Socket), 0.38m (15 in) Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 2*Arrowhead Boardlock, BL FP=16.41, Row Space=4.07mm
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
L17H1EE1134
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| Description |
Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=15.88mm (0.625in), 37/37 (Socket/Socket), 0.38m (15 in) Gold, Bright Tin Shell, M3 Threaded Rear Insert, 4*Arrowhead Boardlock
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| Tech specs |
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Official Product Page
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Intel, Corp.
Samtec, Inc.
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| Part No. |
EE3700 EE3600 EE5700 EE5500 EE1100
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| Description |
3.2 Microsecond Sample and Hold Amplifiers; Temperature Range: 0°C to 70°C; Package: 14-CerDIP
3.2 Microsecond Sample and Hold Amplifiers; Temperature Range: -55°C to 125°C; Package: 14-CerDIP
1 Microsecond Precision Sample and Hold Amplifier; Temperature Range: 0°C to 70°C; Package: 14-CerDIP
Low Noise, High Performance, Quad Operational Amplifier; Temperature Range: -55°C to 125°C; Package: 14-CerDIP 模拟IC
100MHz 100mA VCOM Amplifiers; Temperature Range: -40°C to 85°C; Package: 5-SOT-23 T&R 模拟IC
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| File Size |
94.36K /
1 Page |
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it Online |
Download Datasheet
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