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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP175A
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| Description |
Photorelay (MOSFET output, 1-form-a), 60 V/0.1 A, 3750 Vrms, 4pin SO6
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10088054-003LF
|
| Description |
HCI® Connector System, Power Supply Connectors, 10DC+24S Right Angle Header.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67954-003LF
|
| Description |
PV® Wire-to-Board Connector System, Wire to Board, 2.54mm (0.1inch) Centerline Crimp-to-Wire PV Receptacle Housing, Single Row, Polarized.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69254-003LF
|
| Description |
Modular Jack, Input Output Connectors, Cat 3, Vertical, Through Mount, Unshielded Diamond Peg, 6 Positions, 1 Port
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
TMP175AIDR
|
| Description |
Temperature Sensor with 27 I2C/SMBus Addresses in Industry Standard LM75 Form Factor & Pinout 8-SOIC -40 to 125
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| Tech specs |
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Get Free Sample |
Official Product Page
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|
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Texas Instruments |
| Part No. |
TMP175AID
|
| Description |
Temperature Sensor with 27 I2C/SMBus Addresses in Industry Standard LM75 Form Factor & Pinout 8-SOIC -40 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
TMP175AQDGKRQ1
|
| Description |
Automotive Temp. Sensor with 27 I2C/SMBus Addresses in Industry Standard LM75 Form Factor & Pinout 8-VSSOP -40 to 125
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| Tech specs |
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Official Product Page
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Texas Instruments |
| Part No. |
TMP175AQDRQ1
|
| Description |
Automotive Temp. Sensor with 27 I2C/SMBus Addresses in Industry Standard LM75 Form Factor & Pinout 8-SOIC -40 to 125
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| Tech specs |
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Official Product Page
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