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  C67076-A2013-A70 Datasheet PDF File

For C67076-A2013-A70 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
Part No. C67076-A2112-A70
Description 210 A, 1200 V, N-CHANNEL IGBT

File Size 242.85K  /  9 Page

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Amphenol Communications Solutions

Part No. G881MA20132S1EU
Description Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Vertical, Dual row, 3.0mm pitch, 20 positions , 30u\\ Au, LCP, Black, REEL
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. C67076-A2106-A70
Description 105 A, 1200 V, N-CHANNEL IGBT

File Size 240.67K  /  9 Page

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Texas Instruments

Part No. TPA2013D1RGPR
Description 2.7-W Constant Output Power Mono Class-D Audio Amplifier with Integrated Boost Converter (TPA2013) 20-QFN -40 to 85
Tech specs    

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    SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. BSM150GAL120DN2 150L12N2 C67076-A2013-A70 BSM100GAL120DN2 C67076-A2012-A70
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:18; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug IGBT功率模块(单用菜刀包括快速续流二极管二极管开关)
From old datasheet system
IGBT Power Module (Single switch with chopper diode Including fast free-wheeling diodes)

File Size 80.48K  /  5 Page

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Texas Instruments

Part No. TPA2013D1YZHR
Description 2.7-W Constant Output Power Mono Class-D Audio Amplifier with Integrated Boost Converter (TPA2013) 16-DSBGA -40 to 85
Tech specs    

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Official Product Page

    SIEMENS AG
SIEMENS[Siemens Semiconductor Group]
Part No. C67076-A2106-A70 BSM75GB120DN2
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; Number of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug IGBT功率模块(半桥包括快速续流二极管的绝缘金属基片包
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)

File Size 112.10K  /  9 Page

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    SIEMENS AG
Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. BSM50GB120DN2 C67076-A2105-A70
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; No. of Contacts:18; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)

File Size 111.59K  /  9 Page

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    BSM25GB120DN2 C67076-A2109-A70

Siemens Semiconductor G...
SIEMENS[Siemens Semiconductor Group]
SIEMENS AG
SIEMENS A G
Part No. BSM25GB120DN2 C67076-A2109-A70
Description IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
Circular Connector; No. of Contacts:19; Series:; Body Material:Aluminum; Connecting Termination:Solder; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Right Angle Plug; Insert Arrangement:14-19 IGBT功率模块(半桥包括快速续流二极管的绝缘金属基片包

File Size 111.41K  /  9 Page

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    CXA2013

Sony Corporation
Part No. CXA2013
Description CAP, SMT(V), FILM, 1UF, 100V, 10%

File Size 199.84K  /  23 Page

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Part No. C67076-A2504-A67
Description 25 A, 1200 V, N-CHANNEL IGBT

File Size 242.35K  /  9 Page

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Part No. C67076-S1013-A20
Description 200 A, 100 V, 0.0085 ohm, N-CHANNEL, Si, POWER, MOSFET

File Size 230.25K  /  7 Page

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Part No. C67076-S1101-A20
Description 81 A, 200 V, 0.03 ohm, 2 CHANNEL, N-CHANNEL, Si, POWER, MOSFET

File Size 216.21K  /  7 Page

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For C67076-A2013-A70 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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