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amkor Datasheet PDF File

For amkor Found Datasheets File :: 698 Search Time::2.375ms
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				M/A-COM Technology Solutions, Inc.
Part No.	628702A
OCR Text	...cations are ase in malaysia and amkor in the philippines. there are no changes to the test equipment, test hardware, and test programs used for these produc ts. where possible, mindspeed will utilize both ase in malaysia and amkor in t...
Description	Test Site Transfer
File Size	19.64K / 2 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc. M/A-COM Technology Solution...
Part No.	28229-PCN-001-A 28973-DSH-001-A-15
OCR Text	...location conexant, san di ego amkor, philippines sep 15, 2003 ship location skyworks, mexico amkor, philippines sep 15, 2003 cx28225-14 test location conexant, san di ego amkor, philippines sep 15, 2003 ship location sk...
Description	Test and Ship Location Change for CX28224/5/9 Inverse Multiplexing Single-Chip SDSL/HDSL Transceiver
File Size	78.06K / 2 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	CPGA
OCR Text	amkor.com visit amkor technology online for locations and to view the most current product information ceramic pin grid array package (cpga) amkor technology is committed to continuing to service this long established standard industry pack...
Description	Ceramic Pin Grid Array Package
File Size	528.64K / 1 Page	View it Online	Download Datasheet

				Amkor Technology, Inc.
Part No.	MQFP
OCR Text	amkor's MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. amkor employs the most up-to-date, advanced equipment, material and proc...
Description	amkor’s MQFP IC package portfolio provides
File Size	385.48K / 2 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	FCCSP
OCR Text	... nsmd pad size fc csp packages: amkor technology is now offering the flip chip csp ( fc csp) package ? a flip chip solution in a csp package format. this package construction utilizes eutectic tin/lead (63sn/37pb) flip chip interconnect te...
Description	a flip chip solution in a CSP package format.
File Size	116.26K / 2 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	CVBGA
OCR Text	...7.04 n/a n/a amkor assures reliable performance by continuously monitoring key indices: ? moisture sensitivity jedec level 2 @ 240 c characterization jedec level 3 @ 260 c 85 c/85% rh, 168 hours ? temp/humidity 85 c/8...
Description	ChipArray? Packages
File Size	301.63K / 2 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	CSSOP
OCR Text	amkor.com visit amkor technology online for locations and to view the most current product information ceramic shrink small outline package (cssop) this is a ceramic version of the plastic ssop package. the cssop is a hermetic package con...
Description	Ceramic Shrink Small Outline Package
File Size	299.75K / 1 Page	View it Online	Download Datasheet

				Amkor Technology, Inc.
Part No.	CLGA
OCR Text	...nd expanding package offerings, amkor provides a platform from prototype-to-production. * Flexible land grid array lead counts * Variety of body sizes * 50 mil staggered & 100 mil matrix land * Heat plate / heat slug / heat sink * Exceptio...
Description	Ceramic Land Grid Array Package
File Size	353.10K / 1 Page	View it Online	Download Datasheet

				Amkor Technology
Part No.	LQFP
OCR Text	amkor's LQFP packaging portfolio provides: * 7 x 7 mm to 28 x 28 mm body size * 32 to 256 lead counts * Copper leadframes * Broad selection of die pad sizes * Custom leadframe design available * 1.4 mm body thickness * Low stress die attach...
Description	Low Profile Quad Flat Pack (LQFP) Packages
File Size	652.51K / 2 Page	View it Online	Download Datasheet

For amkor Found Datasheets File :: 698 Search Time::2.375ms
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