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  87914-0807 Datasheet PDF File

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    87914-0807

Molex Electronics Ltd.
Part No. 87914-0807
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging

File Size 3,776.34K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87914-4016

Molex Electronics Ltd.
Part No. 87914-4016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 40 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 54201-G0807ALF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1416

Molex Electronics Ltd.
Part No. 87914-1416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 14 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Amphenol Communications Solutions

Part No. 54201-S0807LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Single Row, 7 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1816

Molex Electronics Ltd.
Part No. 87914-1816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 18 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.50K  /  48 Page

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Amphenol Communications Solutions

Part No. 54202-S0807PA06LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-0806

Molex Electronics Ltd.
Part No. 87914-0806
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.54μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 759.80K  /  11 Page

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Amphenol Communications Solutions

Part No. G832MB030807222HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 15.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, 30u\\ Gold White.
Tech specs    

Official Product Page

    87914-4216

Molex Electronics Ltd.
Part No. 87914-4216
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 42 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 54202-T0807LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-4616

Molex Electronics Ltd.
Part No. 87914-4616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 46 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.74K  /  48 Page

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Amphenol Communications Solutions

Part No. 54202-G0807ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double row , 14 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    87914-1016

Molex Electronics Ltd.
Part No. 87914-1016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 10 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.32K  /  48 Page

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Amphenol Communications Solutions

Part No. 52601-S10-80714TLF
Description Quickie® IDC Cable-to-Board Connector System, Shrouded Vertical Header, Surface Mount, Low Profile, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-1616

Molex Electronics Ltd.
Part No. 87914-1616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 16 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 54101-G0807LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 7 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

   
Part No. 80807
Description Temp Sensor & Brushless DC Fan Controller / Over Temp Alert, -40C to 125C, 8-MSOP, TUBE

File Size 225.73K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MB010807022HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 15.7 mm, 80 Positions, Dual Row, BTB Vertical Receptacle SMT, Gold Flash Black.
Tech specs    

Official Product Page

For 87914-0807 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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