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Amphenol Communications Solutions |
| Part No. |
68466-117HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-4611 87911-6611 0879116611 0879114611
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 46 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 46 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 66 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
68466-112HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
926611C70H
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| Description |
XCede HD Plus, Backplane Connectors, Vertical Header, 6-pair, 6-column, Double End Wall, With Extra Ground.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-6211
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 62 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68466-113HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-5211
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 52 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10076266-111RLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, Post-Free, x4, 64 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
926-611J-70H
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| Description |
XCede HD Plus, Backplane Connectors, Vertical Header, 6-pair, 4-column, Double End Wall, With Extra Ground.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10076266-113FLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, Post-Free, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10144661-113Y0LF
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| Description |
PCI Express®x16 vertical Card Edge Connector, 164 Positions, 1mm (0.039inch) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10076266-113CLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, Post-Free, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10076266-113TLF
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| Description |
PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, Post-Free, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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