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Amphenol Communications Solutions |
| Part No. |
54112-107541100LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 54 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-408081150LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-5411 0879115411
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
54112-112401850LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-110401600LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-6211
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 62 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 62 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-804280900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-808260900LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-5211
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 52 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 52 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.70K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54112-812102450LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-112402500LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-807201050LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
54112-108201000LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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