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  87834-5021 Datasheet PDF File

For 87834-5021 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    87834-5021

Molex Electronics Ltd.
Part No. 87834-5021
Description 2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13渭m (5渭) Gold (Au) Flash Plating, Nylon Housin
2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.27K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136655-0211LF
Description Minitek® Pwr 3.0, Single Row, Right Angle SMT Tails and Hold Down Header, Tin plating, 2 Positions, Black Color, GW Compatible LCP, Tape and Reel packing.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-3019

Molex Electronics Ltd.
Part No. 87834-3019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 30 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.08K  /  3 Page

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Amphenol Communications Solutions

Part No. 62684-502100ALF
Description 0.50mm Flex Connector, OPU Series, 50 Position , Side Entry, Upper Side Contact, Surface Mount, ZIF
Tech specs    

Official Product Page

    87834-4143

Molex Electronics Ltd.
Part No. 87834-4143
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator

File Size 93.21K  /  3 Page

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Amphenol Communications Solutions

Part No. 86130502123345E1LF
Description 8613 M CNR LF
Tech specs    

Official Product Page

    87834-4419

Molex Electronics Ltd.
Part No. 87834-4419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded, 44 Circuits, 0.13楼矛m (5楼矛) Gold (Au) Plating, Black, without PCB Locator

File Size 115.14K  /  3 Page

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Amphenol Communications Solutions

Part No. 95278-502-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 87834-3041
Description CGrid Hdr W/Pg/Slt 1PdNiAuLF 30Ckt 30 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 94.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 84502-101LF
Description 300 Position BGA Receptacle, 5.5mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    87834-4411

Molex Electronics Ltd.
Part No. 87834-4411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window
2.54mm (.100) Pitch C-Grid垄莽 Header, Dual Row, Low Profile, Vertical, Shrouded Lead-free, 44 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.58K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF2502104
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 25 Socket, Bright Tin Shell, 0.76um(30 in) Gold, M3 Threaded Rear Insert, Without Boardlock
Tech specs    

Official Product Page

    87834-4095

Molex Electronics Ltd.
Part No. 87834-4095
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.34K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF1502100
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Socket, Bright Tin Shell, 0.76um(30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Boardlock
Tech specs    

Official Product Page

    87834-4092

Molex Electronics Ltd.
Part No. 87834-4092
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows

File Size 100.59K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF2502112
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 25 Socket, Bright Tin Shell, 0.76um(30 in) Gold, 4-40 Threaded Boardlock with 4-40 Front Screwlock Installed
Tech specs    

Official Product Page

    87834-4045

Molex Electronics Ltd.
Part No. 87834-4045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 40 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.86K  /  3 Page

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Amphenol Communications Solutions

Part No. L17TF1502102
Description Dsub, Stamped Signal 3A, Straight PCB Press-Fit, 15 Socket, Bright Tin Shell, 0.76um(30 in) Gold, 4-40 Threaded Rear Insert with 4-40 Screwlock Installed, Without Boardlock
Tech specs    

Official Product Page

    87834-2619

Molex Electronics Ltd.
Part No. 87834-2619
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 26 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136655-0212LF
Description Minitek® Pwr 3.0, Single Row, Right Angle SMT Tails and Hold Down Header, Tin plating, 2 Positions, Black Color, Non GW Compatible LCP, Tape and Reel packing.
Tech specs    

Official Product Page

For 87834-5021 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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