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Amphenol Communications Solutions |
| Part No. |
10060018-10202TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10060018-10011TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x4, 64 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
59112-T40-18-140LF
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| Description |
Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Through Hole - Double row - 36 Positions - 2mm (0.079inch) - Vertical.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10060018-10212TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x8, 98 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10060018-10203TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10138980-1811LF
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| Description |
Minitek® Pwr 3.0 BMI, Dual Row, Vertical Through Hole Header, Tin plating, 18 Positions, Black Color, LCP, GW Compatible, Tray packing, With Kink Tails.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127720-181LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 18 Positions, 100u\\ Tin plating, Non GW Compatible LCP, With Pegs, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10060018-10213TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736562000 73656-2000
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76渭m (30渭")
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76μm (30μ)
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| File Size |
401.43K /
7 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10060018-10003TLF
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| Description |
PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, x16, 164 Positions, 1.00mm (0.039in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736562001 73656-2001
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76渭m (30渭")
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Power Module, Vertical, SMC,Power Receptacle, 3 Circuits, Gold (Au) 0.76μm (30μ)
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| File Size |
398.27K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
RJLSE4018101
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| Description |
Modular Jack - Right Angle, Input Output Connectors 6P6C, SMT, Shield, Without LEDs.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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