Part Number Hot Search : 
LA4278 LB1869M SI53112 P28SA SFS1828 K1149BA A8182SL DG407
Product Description
Full Text Search
  73644-2017 Datasheet PDF File

For 73644-2017 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    73644-2017

Molex Electronics Ltd.
Part No. 73644-2017
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
File Size 164.18K  /  4 Page

View it Online

Download Datasheet
　 　

Toshiba Electronic Devices & Storage Corporation
Part No. TPD2017FN
Description Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73644-3210

Molex Electronics Ltd.
Part No. 73644-3210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 144 Circuits
File Size 164.13K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 54242-108201750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2109

Molex Electronics Ltd.
Part No. 73644-2109
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 163.64K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 75844-201-72LF
Description BERGSTIK
Tech specs 　 　

Official Product Page

    73644-2116

Molex Electronics Ltd.
Part No. 73644-2116
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits
File Size 163.64K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 54122-110201700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    73644-2117

Molex Electronics Ltd.
Part No. 73644-2117
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 163.63K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 59202-F40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs 　 　

Official Product Page

    73644-1203

Molex Electronics Ltd.
Part No. 73644-1203
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 159.58K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 59202-G40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs 　 　

Official Product Page

    73644-1205

Molex Electronics Ltd.
Part No. 73644-1205
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position C, 144 Circuits
File Size 167.28K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 54112-109201700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-1204

Molex Electronics Ltd.
Part No. 73644-1204
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 144 Circuits
File Size 167.28K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 67292-017
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs 　 　

Official Product Page

    73644-1206

Molex Electronics Ltd.
Part No. 73644-1206
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 144 Circuits
File Size 159.58K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 72017-212LF
Description 5 Row Signal Receptacle, 150 Position, Straight, Solder to Board
Tech specs 　 　

Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 167.27K  /  4 Page

View it Online

Download Datasheet
　 　

Amphenol Communications Solutions
Part No. 90312-017LF
Description Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 17 Position
Tech specs 　 　

Official Product Page

For 73644-2017 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲
 



Bom2Buy.com



Price and Availability
 
Price & Availability of 73644-2017

All Rights Reserved © IC-ON-LINE 2003 - 2022  
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]
 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.31462693214417