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  73644-2016 Datasheet PDF File

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    73644-2016

Molex Electronics Ltd.
Part No. 73644-2016
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 164.19K  /  4 Page

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Murata Manufacturing Co Ltd
Part No. DFE2016CKA-2R2M=P2
Description Fixed IND 2.2uH 1400mA NONAUTO
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    HC2016 HC2016/4

auris-GmbH
Part No. HC2016 HC2016/4
Description Quartz SMD, Ceramic
File Size 50.83K  /  1 Page

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Murata Manufacturing Co Ltd
Part No. DFE2016CKA-1R0M=P2
Description Fixed IND 1uH 1800mA NONAUTO
Tech specs 　 　

Official Product Page

    73644-1203

Molex Electronics Ltd.
Part No. 73644-1203
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 159.58K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-1622LPCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
Tech specs 　 　

Official Product Page

    73644-2001

Molex Electronics Ltd.
Part No. 73644-2001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 72 Circuits
File Size 174.54K  /  4 Page

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Amphenol Communications Solutions
Part No. 68020-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2009

Molex Electronics Ltd.
Part No. 73644-2009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 67292-016LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs 　 　

Official Product Page

    73644-2018

Molex Electronics Ltd.
Part No. 73644-2018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 54122-809201650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-1621LPLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

    73644-1202

Molex Electronics Ltd.
Part No. 73644-1202
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 167.27K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127720-162LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs 　 　

Official Product Page

    73644-2017

Molex Electronics Ltd.
Part No. 73644-2017
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
File Size 164.18K  /  4 Page

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Amphenol Communications Solutions
Part No. 10127820-1622PLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs 　 　

Official Product Page

    73644-0005

Molex Electronics Ltd.
Part No. 73644-0005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 166.78K  /  4 Page

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Amphenol Communications Solutions
Part No. 67292-016
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs 　 　

Official Product Page

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