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  53612-S20-6 Datasheet PDF File

For 53612-S20-6 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

   
FCI connector
Part No. 53612-S26-8LF 53612-G40-6 53612-G40-4 53612-G10-2 53612-G50-7 53612-G50-8 53612-G50-2 53612-S40-6 53612-G14-1 53612-S20-4 53612-S20-6 53612-S20-2 53612-G20-7LF 53612-S50-4 53612-S40-4LF 53612-S40-2LF 53612-S20-1LF 53612-S20-2LF 53612-S10-1 53612-S10-2LF 53612-G34-4
Description 26 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
40 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
10 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
50 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
50 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SURFACE MOUNT
14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
20 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER
100/2.54cc EJECT LATCH SHOROUDED VERTICAL HEADER

File Size 197.81K  /  2 Page

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Amphenol Communications Solutions

Part No. 53612-S40-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 40 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    OKI[OKI electronic componets]
Part No. ML53612
Description 64-Channel Full Duplex H.100/H.110 CT Bus System Interface and Time-Slot Interchange

File Size 233.14K  /  68 Page

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Amphenol Communications Solutions

Part No. 53612-S26-7
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    OKI electronic components
Part No. ML53612
Description 64-Channel Full Duplex H.100/H.110 CT Bus System Interface and Time-Slot Interchange

File Size 239.04K  /  68 Page

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Amphenol Communications Solutions

Part No. 53612-G14-6
Description Quickie Header, Wire to Board Connector, Double Row, 14 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    Winbond Electronics
Part No. W536120P W536090P
Description MDPCM Voice/Melody w/8Kx20 ROM, 896*4 RAM, 1Kx22 Notes, SPK/DAC, 8 I/O, 12 I, 12O

File Size 85.78K  /  10 Page

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Amphenol Communications Solutions

Part No. 53612-S10-7
Description Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    HT2MOA3S20 HT2MOA3S20_E_1 HT2MOA3S20_E_3 HT2MOA3S20/E/3 HT2MOA3S20/E/1 HT2MOA2S20/E/3118

NXP Semiconductors N.V.
Philips Semiconductors
Part No. HT2MOA3S20 HT2MOA3S20_E_1 HT2MOA3S20_E_3 HT2MOA3S20/E/3 HT2MOA3S20/E/1 HT2MOA2S20/E/3118
Description HITAGTM2 Chip Module

File Size 158.03K  /  22 Page

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Amphenol Communications Solutions

Part No. 53612-S26-6
Description Quickie Header, Wire to Board Connector, Double Row, 26 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    Philips
Part No. HT2DC20S20_2 HT2DC20S20 HT2DC20S20/F
Description From old datasheet system
HITAG 2 stick transponder

File Size 61.11K  /  16 Page

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Amphenol Communications Solutions

Part No. 53612-S20-8LF
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.1 in.), Vertical Header 0.38 um (15 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    Winbond Electronics
Part No. W536120T W536030T W536060T
Description MDPCM Voice/Melody w/64x32 ~ 40x16 LCD, 512x4x2 LCD RAM, 1/16&1/32 Duty, 1/4&1/5 Bias, 64Kx20 ROM, 1

File Size 97.91K  /  12 Page

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Amphenol Communications Solutions

Part No. 53612-G16-4
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    HYNIX SEMICONDUCTOR INC
Part No. HYM536120ALW-60
Description 1M X 36 FAST PAGE DRAM MODULE, 60 ns, SMA72

File Size 211.77K  /  9 Page

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Amphenol Communications Solutions

Part No. 53612-G20-7
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    KMM5361205C2W

Samsung Semiconductor
Part No. KMM5361205C2W
Description 1MBx36 DRAM Simm Using 1MBx16 And 4MB Quad Cas Edo

File Size 277.25K  /  17 Page

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Amphenol Communications Solutions

Part No. 53612-G50-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    KMM5361203C2W

Samsung Semiconductor
Part No. KMM5361203C2W
Description 1MBx36 DRAM Simm Using 1MBx16 And 1MBx4 Quad Cas

File Size 268.35K  /  17 Page

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Amphenol Communications Solutions

Part No. 53612-G34-4LF
Description Quickie Header, Wire to Board Connector, Double Row, 34 Positions, 2.54 mm (0.1 in.), Vertical Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

For 53612-S20-6 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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