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Bel Fuse Inc. http:// Bel Fuse, Inc.
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Part No. |
3AG8-R 2JS2-R 3JS2-R 2JS2.5-R 3JS2.5-R 2JS200-R 3JS200-R 2JS250-R 3JS250-R 3AG3-R 3AG3.5-R 3AG300-R 3AP200-R 3AP300-R 3AG5-R 3AG160-R 3AG12-R 3AG125-R 2JS1-R 3JS1-R 2JS1.25-R 3JS1.25-R 2JS1.5-R 3JS1.5-R 2JS100-R 3JS100-R 2JS3-R 3JS3-R 2JS3.5-R 3JS3.5-R 2JS30-R 3JS30-R 2JS125-R 3JS125-R 3AG200-R 3AG6-R 3AG7-R 3AG750-R 3AP750-R 2JS40-R 3JS40-R 3AP125-R 2JS350-R 3JS350-R 3AG1.25-R 3AP500-R 2JS6-R 3JS6-R 2JS600-R 3JS600-R 3AP250-R 3AG4-R 3AG400-R 2JS5-R 3JS5-R 2JS500-R 3JS500-R 3AP12-R 3AG250-R 2JS150-R 3JS150-R 2JS800-R 3JS800-R 3AP5-R JS1.5-R 3AP7-R 3AG2-R 3AG2.5-R 3AG350-R 2JS7-R 3JS7-R 2JS700-R 3JS700-R 2JS750-R 3JS750-R 3AP1.6-R 3AP15-R JS1.25-R 3AP1.25-R 3AG100-R 3AG500-R 3AG1.6-R 3AG1-R 3AP350-R 3AP3.5-R 3AP4-R 3AP2.5-R 2JS4-R 3JS4-R 3AP100-R 3AP10-R 3AP160-R 3AP3-R 3AP400-R 3AP1-R 3AP2-R 3AP6-R 3AP8-R 3AG10-R 3AG15-R 3JS300-R
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Description |
Time-lag Fuse Series Fuses, RoHS 1.5A 350V SLOW 2AG TIME LAG BLOW ELECTRIC FUSE, 1.5A, 350VAC, 140VDC, 100A (IR), INLINE/HOLDER Fuses, RoHS 2.5A 350V SB 2AG LEADED TIME LAG BLOW ELECTRIC FUSE, 2.5A, 350VAC, 140VDC, 100A (IR), THROUGH HOLE Fuses, RoHS 100mA 350V SLOW 2AG TIME LAG BLOW ELECTRIC FUSE, 0.1A, 350VAC, 140VDC, 100A (IR), INLINE/HOLDER Fuses, RoHS 300mA 350V SB 2AG LEADED TIME LAG BLOW ELECTRIC FUSE, 0.3A, 350VAC, 140VDC, 100A (IR), THROUGH HOLE Fuses, RoHS 1.25A 350V SLOW 2AG Time-lag Fuse Series
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File Size |
473.35K /
2 Page |
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Renesas Electronics Corporation. Renesas Electronics, Corp.
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Part No. |
M38230G4-XXXFP M38230G4-XXXHP M38231G4-XXXHP M38232G4-XXXFP M38232G4-XXXHP M38233G4-XXXFP M38233G4-XXXHP M38234G4-XXXFP M38234G4-XXXHP M38235G4-XXXFP M38230G6-XXXFP M38230G6-XXXHP M38231G6-XXXFP M38231G6-XXXHP M38232G6-XXXFP M38232G6-XXXHP M38233G6-XXXFP M38233G6-XXXHP M38234G6-XXXFP M38234G6-XXXHP M38235G6-XXXFP M38235G6-XXXHP M38236G6-XXXHP M38237G6-XXXFP M38237G6-XXXHP M38238G6-XXXFP M38230G7-XXXFP M38230G7-XXXHP M38231G7-XXXFP M38231G7-XXXHP M38232G7-XXXFP M38232G7-XXXHP M38233G7-XXXFP M38233G7-XXXHP M38234G7-XXXFP M38234G7-XXXHP M38235G7-XXXFP M38235G7-XXXHP M38236G7-XXXFP M38236G7-XXXHP M38237G7-XXXFP M38237G7-XXXHP M38238G7-XXXFP M38238G7-XXXHP M38239G7-XXXFP M38239G7-XXXHP M38230G8-XXXFP M38230G8-XXXHP M38231G8-XXXFP M38231G8-XXXHP M38232G8-XXXFP M38232G8-XXXHP M38233G8-XXXFP M38233G8-XXXHP M38234G8-XXXFP M38234G8-XXXHP M38235G8-XXXFP M38235G8-XXXHP M38236G8-XXXFP M38236G8-XXXHP M38237G8-XXXFP M38237G8-XXXHP M38238G8-XXXFP M38238G8-XXXHP M38230GA-XXXFP M38230GA-XXXHP M38231GA-XXXFP M38231GA-XXXHP M38232GA-XXXFP M38232GA-XXXHP M38233GA-XXXFP M38233GA-XXXHP M38234GA-XXXFP M38234GA-XXXHP M38235GA-XXXFP M38235GA-XXXHP M38236GA-XXXFP M38236GA-XXXHP M38237GA-XXXFP M38237GA-XXXHP
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Description |
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 512Kb x 36; Vcc (V): 3.1 to 3.6 V 36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 2.4 to 2.6 V 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 3.1 to 3.6 V 18-Mbit (512K x 36/1M x 18) Pipelined SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 36-Mbit (1M x 36/2 M x 18/512K x 72) Flow-Through SRAM with NoBL(TM) Architecture; Architecture: NoBL, Flow-through; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 2.4 to 2.6 V 72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 3.1 to 3.6 V 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 36 Mb; Organization: 512Kb x 72; Vcc (V): 3.1 to 3.6 V 72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 1Mb x 72; Vcc (V): 3.1 to 3.6 V 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture (2.5 Cycle Read Latency); Architecture: QDR-II , 4 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 72-Mbit DDR-II SRAM 2-Word Burst Architecture (2.0 Cycle Read Latency); Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined Sync SRAM; Architecture: Standard Sync, Pipeline SCD; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机 72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机 18-Mbit (512K x 36/1M x 18) Flow-Through SRAM; Architecture: Standard Sync, Flow-through; Density: 18 Mb; Organization: 1Mb x 18; Vcc (V): 3.1 to 3.6 V 单芯位CMOS微机 SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯位CMOS微机 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL(TM) Architecture; Architecture: NoBL, Pipeline; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 2.4 to 2.6 V 单芯位CMOS微机 72-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机 72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机 36-Mbit QDR(TM)-II SRAM 4-Word Burst Architecture; Architecture: QDR-II, 4 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机 SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER 单芯8位CMOS微机 Sync SRAM; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机 36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 1Mb x 36; Vcc (V): 1.7 to 1.9 V 单芯位CMOS微机 72-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 36-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
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File Size |
901.80K /
76 Page |
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it Online |
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Murata Manufacturing Co., Ltd. http:// MURATA MANUFACTURING CO LTD Murata Manufacturing Co., L... Murata Manufacturing Co...
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Part No. |
BLM03AG700SN1 BLM15AG100SN1 BLM15AG700SN1 BLM15BB050SN1 DLP31DN201ML4 DLP31DN321ML4 DLP31DN441ML4 BLM21BB750SN1 BLM18AG151SN1 BLM18BD121SN1 NFM41PC204F1H3 BLM18BB470SN1 BLM15BB470SN1 BLM18BA470SN1 BLM18PG300SN1 BLM18PG330SN1 BLM18PG181SN1 BLM18EG101TN1 DLP31DN131ML4 NFL21SP706X1C3 BLM18PG121SN1 NFA31GD4701014 NFA31GD1014704 NFA31GD1001014 BLM15BD750SN1 NFE31PTXXX NFE31PT222Z1E9 NFE61PT102E1H9 BLM18HD601SN1 BLM18BD601SN1 BLM15AG601AN1 BLM15HD102SN1 BLM41PG102SN1 BLM03AG100SN1 BLM15BD601SN1 BLM18EG331TN1 DLW5BSN302SQ2 BLM15AG221SN1 BLM15AG102SN1 NFW31SP207X1E4 BLM15PG100SN1 DLW5BSN191SQ2 BLM15EG121SN1 BLM15HG102SN1 DLW5BSN152SQ2 BLM21BD471SN1 BLM21BD151SN1 BLM18HK601SN1 NFA31CC221S1E4 NFL21SP506X1C3 DLP11SN900SL2 BLM18HK471SN1 BLM18HG471SN1 BLM21BB050SN1 BLM15AG601SN1 BLM15AG102AN1 NFM21CC220U1H3 NFM21CC221R1H3 NFM21CC222R1H3 NFA31CC223R1C4 BLM15BB121SN1 DLW5AHN402SQ2 DLW5BSN351SQ2 BLM18BA050SN1 NFM18CC223R1C3 DLW21SN670SQ2 BD331SN1 BLM18GG471SN1 BLM15EG221SN1 BLM18HB121SN1 BLM18HB221SN1 BLM18EG471SN1
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Description |
Circular Connector; No. of Contacts:32; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:19; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:19-32 RoHS Compliant: No 20 Characters x 2 Lines, 5x7 Dot Matrix Character and Cursor LJT 32C 32#20 PIN WALL RECP TOOLS,HEX BITS,SETS,FOLD UP TOOL SET, GORILLA GRIP, NUMBER OF PIECE-12, SIZE 1.5, 2, 2.5, 3, 4, 5MM, 5/64IN. 3, 3/32IN. , 7/64IN. T, 1/8IN. F, 9/64IN. 1, 5/32IN. P,HAND TOOLS,GORILLA GRIP® FOLD-UP TOOL SETS ,BONDHUS TOOLS,HEX BITS,SETS,FOLD UP TOOL SET, GORILLA GRIP, NUMBER OF PIECE-9, SIZE 5/64IN. - 1/4IN. O,HAND TOOLS,GORILLA GRIP® FOLD-UP TOOL SETS ,BONDHUS RoHS Compliant: NA TOOLS,HEX BITS,SETS,FOLD UP TOOL SET, GORILLA GRIP, NUMBER OF PIECE-9, SIZE .050IN. , 3/16IN. O,HAND TOOLS,GORILLA GRIP® FOLD-UP TOOL SETS ,BONDHUS ECONOLINE: RM & RL - Single Output Rail- Industry Standard Pinout- 1kVDC & 2kVDC Isolation- High Efficiency for Low Power Applications- UL94V-0 Package Material- Toroidal Magnetics- Fully Encapsulated- Efficiency to 80% SCREW MACH PHIL 6-32X5/8 NYLON SCREW MACH PHIL 8-32X1 NYLON Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT02; Number of Contacts:8; Connector Shell Size:16; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle On-Board Type (DC) EMI Suppression Filters 4 FUNCTIONS, 10 V, 0.12 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 16 V, 0.15 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 2 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 4 FUNCTIONS, 6 V, 0.015 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 4 FUNCTIONS, 6 V, 0.02 A, DATA LINE FILTER 20 characters x 2 Lines, 5x7 Dot Matric Character and Cursor 1 FUNCTIONS, 0.3 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 板上型(DC)的EMI静噪滤波 640 x 480 pixel format, CFL Backlight with power harness 1 FUNCTIONS, 25 V, 6 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 50 V, 2 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 0.1 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 0.2 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 0.3 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 0.25 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 1.5 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 0.5 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 2 FUNCTIONS, 50 V, 0.5 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 1 FUNCTIONS, 25 V, 0.2 A, DATA LINE FILTER 20 characters x 2 Lines, 5x7 Dot Matric Character and Cursor 1 FUNCTIONS, 1 A, FERRITE CHIP On-Board Type (DC) EMI Suppression Filters 2 FUNCTIONS, 50 V, 5 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 2 FUNCTIONS, 50 V, 1 A, DATA LINE FILTER On-Board Type (DC) EMI Suppression Filters 4 FUNCTIONS, 25 V, 0.2 A, FEED THROUGH CAPACITOR On-Board Type (DC) EMI Suppression Filters 2 FUNCTIONS, 5 V, 0.16 A, DATA LINE FILTER Circular Connector; No. of Contacts:66; Series:MS27472; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:18; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No ECONOLINE: RM & RL - Single Output Rail- Industry Standard Pinout- 1kVDC & 2kVDC Isolation- High Efficiency for Low Power Applications- UL94V-0 Package Material- Toroidal Magnetics- Fully Encapsulated- Efficiency to 80% On-Board Type (DC) EMI Suppression Filters
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File Size |
283.78K /
18 Page |
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Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
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Part: 3A24V继电器 |
Maker: N/A |
Pack: N/A |
Stock: 139 |
Unit price
for : |
50: $0.46 |
100: $0.44 |
1000:
$0.42 |
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