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  35760-7210 Datasheet PDF File

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    0357607210 35760-7210

Molex Electronics Ltd.
Part No. 0357607210 35760-7210
Description Wire Splice, 12-16 AWG, Post-Tin Plating

File Size 108.56K  /  2 Page

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Amphenol Communications Solutions

Part No. 10127721-041LF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 4 Position, 3.2mm Kink Tail (100u\\ Tin) plating, Non GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

Official Product Page

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    35760-7310

Molex Electronics Ltd.
Part No. 35760-7310
Description Wire Splice, 10-12 AWG, Post-Tin Plating

File Size 100.66K  /  2 Page

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Amphenol Communications Solutions

Part No. 10127721-084LF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 8 Position, 3.2mm Kink Tail (30u\\ Gold) plating, Non GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

Official Product Page

    35760-2710

Molex Electronics Ltd.
Part No. 35760-2710
Description JOINT-H/D

File Size 248.72K  /  2 Page

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Amphenol Communications Solutions

Part No. 89007-210LF
Description Metral® Board Connectors, Backplane Connectors, 5 Row Signal Header, Straight, Press-Fit, Wide body.
Tech specs    

Official Product Page

    35760-7100

Molex Electronics Ltd.
Part No. 35760-7100
Description Wire Splice, 16-20 AWG, Un-Plated

File Size 150.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 95157-210VLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0357607400 35760-7400

http://
Molex Electronics Ltd.
Part No. 0357607400 35760-7400
Description Wire Splice, 8-10 AWG, Un-plated

File Size 97.26K  /  2 Page

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Amphenol Communications Solutions

Part No. 67997-210HTLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 10Positions, 2.54 mm (0.100in) Pitch
Tech specs    

Official Product Page

    0357600700 35760-0700

Molex Electronics Ltd.
Part No. 0357600700 35760-0700
Description Button Contact , 18-20 AWG

File Size 70.94K  /  2 Page

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Amphenol Communications Solutions

Part No. 95157-210LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 10 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0357607110 35760-7110

http://
Molex Electronics Ltd.
Part No. 0357607110 35760-7110
Description Wire Splice, 16-20 AWG, Post-Tin Plating

File Size 108.70K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-G12-17-210LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0357607500 35760-7500

Molex Electronics Ltd.
Part No. 0357607500 35760-7500
Description Wire Splice, 12-14 AWG, Un-Plated

File Size 100.65K  /  2 Page

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Amphenol Communications Solutions

Part No. 98426-S12-17-210LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Stacking Header, Through Hole, Double Row, 34 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0357607300 35760-7300

Molex Electronics Ltd.
Part No. 0357607300 35760-7300
Description Wire Splice, 10-12 AWG, Un-plated

File Size 100.65K  /  2 Page

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Amphenol Communications Solutions

Part No. 10135572-107500ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 4 pair, 13 column, 182 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs    

Official Product Page

    35760-7200 0357607200

Molex Electronics Ltd.
Part No. 35760-7200 0357607200
Description Wire Splice, 12-16 AWG, Un-Plated

File Size 150.82K  /  3 Page

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Amphenol Communications Solutions

Part No. 10127721-021GLF
Description Minitek® Pwr 3.0, Dual Row, Vertical Through Hole Header, 2 Position, 3.2mm Kink Tail (100u\\ Tin) plating, GW Compatible LCP, Black Color,Tray Packing.
Tech specs    

Official Product Page

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