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  35572-1300 Datasheet PDF File

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    35572-1300 0355721300

Molex Electronics Ltd.
Part No. 35572-1300 0355721300
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon
File Size 105.88K  /  2 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. XPN1300ANC
Description N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    35572-0500

Molex Electronics Ltd.
Part No. 35572-0500
Description 2.50mm Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6
File Size 30.68K  /  1 Page

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Amphenol Communications Solutions
Part No. 10135572-114400ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 4 pair, 13 column, 182 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs 　 　

Official Product Page

    http://
Part No. 35572-0500
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6 Material, 5 Circuits
File Size 105.88K  /  2 Page

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Amphenol Communications Solutions
Part No. 10135572-119500ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 4 pair, 13 column, 182 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs 　 　

Official Product Page

    35572-1100

Molex Electronics Ltd.
Part No. 35572-1100
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6 Material, 11 Circuits
File Size 105.88K  /  2 Page

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Amphenol Communications Solutions
Part No. 10135572-107500ULF
Description ExaMEZZ® 56Gbps High Speed Mezzanine Connector System, Mezzanine, Vertical, 4 pair, 13 column, 182 Positions, Press-Fit termination, 2.00mm (0.078in) Pitch.
Tech specs 　 　

Official Product Page

    35572-0800

Molex Electronics Ltd.
Part No. 35572-0800
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6 Material, 8 Circuits
File Size 105.60K  /  2 Page

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Texas Instruments
Part No. 5962-8513001VRA
Description Octal Buffers And Line Drivers With 3-State Outputs 20-CDIP -55 to 125
Tech specs 　 　

Official Product Page

    35572-0300

Molex Electronics Ltd.
Part No. 35572-0300
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6 Material, 3 Circuits
File Size 105.88K  /  2 Page

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Texas Instruments
Part No. LMP91300YZRR
Description Inductive Proximity Sensor AFE 20-DSBGA -40 to 125
Tech specs 　 　

Official Product Page

    35572-1200

Molex Electronics Ltd.
Part No. 35572-1200
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6 Material, 12 Circuits
File Size 105.88K  /  2 Page

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Texas Instruments
Part No. 5962-8513001VSA
Description Octal Buffers And Line Drivers With 3-State Outputs 20-CFP -55 to 125
Tech specs 　 　

Official Product Page

    35572-1500

Molex Electronics Ltd.
Part No. 35572-1500
Description 2.50mm (.098) Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6 Material, 15 Circuits
File Size 97.84K  /  2 Page

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Texas Instruments
Part No. TPS61300YFFT
Description 1.5A/4.1A Multiple LED Camera Flash Driver With I2CTM Compatible Interface 20-DSBGA -40 to 85
Tech specs 　 　

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Official Product Page

    35572-0300

Molex Electronics Ltd.
Part No. 35572-0300
Description 2.50mm Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6
File Size 30.67K  /  1 Page

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Texas Instruments
Part No. ADC09DJ1300AAVTQ1
Description Automotive dual-channel, 9-bit, 1.3-GSPS analog-to-digital converter (ADC) with JESD204C interface 144-FCCSP -40 to 125
Tech specs 　 　

Official Product Page

    35572-0700

Molex Electronics Ltd.
Part No. 35572-0700
Description 2.50mm Pitch Wire-to-Wire and Wire-to-Board Housing, Positive Lock, Nylon 6/6
File Size 30.68K  /  1 Page

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Texas Instruments
Part No. LMP91300NHZJ
Description Inductive Proximity Sensor AFE 24-WQFN -40 to 125
Tech specs 　 　

Get Free Sample

Official Product Page

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