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327 Datasheet PDF File

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				MILL-MAX MFG CORP
Part No.	8993-0-15-01-34-27-04-0
OCR Text	...osition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is perm...
Description	BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
File Size	250.58K / 2 Page	View it Online	Download Datasheet

				MILL-MAX MFG CORP
Part No.	0814-0-15-01-34-27-04-0
OCR Text	...osition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is perm...
Description	BERYLLIUM COPPER ALLOY, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
File Size	128.37K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	22-27-2021
OCR Text	...ion vertical pc tail length 3.56mm pcb locator no pcb retention none pcb thickness - recommended 1.60mm packaging type bag p...27-2021 ...
Description	2.54mm Pitch KK? Wire-to-Board Header, Vertical, with Friction Lock, 2 Circuits, Tin (Sn) Plating
File Size	54.36K / 3 Page	View it Online	Download Datasheet

				MILL-MAX MFG CORP
Part No.	0529-0-15-15-10-27-10-0
OCR Text	.... 1 5 0 .080 . 0 8 0 .053 . 0 5 3 8210-0-15-15-04-27-04-0 press-fit in .024/.027 stepped hole 8210 0464-x-15-xx-10-xx-04-0 solder mount in .016 min. mounting hole 0464 9225-0-15-xx-10-xx-10-0 press-fit in .039 mounting hole 9225 0529-0-15-x...
Description	BERYLLIUM COPPER, GOLD (30) OVER NICKEL FINISH, PCB TERMINAL
File Size	85.60K / 1 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	22-27-2041
OCR Text	...ion vertical pc tail length 3.56mm pcb locator no pcb retention none pcb thickness - recommended 1.60mm packaging type bag p...27-2041 ...
Description	2.54mm Pitch KK? Wire-to-Board Header, Vertical, with Friction Lock, 4 Circuits, Tin (Sn) Plating
File Size	54.36K / 3 Page	View it Online	Download Datasheet

				EPIGAP optoelectronic GmbH
Part No.	ELC-870-27
OCR Text	...A Symbol VF VR e p 0.5 tr, tf 5 3.5 860 4.5 875 45 25 890 Min Typ 1.4 Max 1.7 Unit V V mW nm nm ns *Measured on bare chip on TO-18 header...27 Packing Chips on adhesive film with wire-bond side on top rev.09/02 EPIGAP Optoelektronik GmbH...
Description	LED - CHIP
File Size	84.62K / 1 Page	View it Online	Download Datasheet

				EPIGAP optoelectronic GmbH
Part No.	ELC-810-27
OCR Text	...5 5 2.5 1.6 1.9 V V 3.2 6 805 30 40 825 mW mW nm nm ns Measured on bare chip on TO-18 header with EPIGAP equipment Measure...27 Lot N e(typ) [mW] VF(typ) [V] Quantity Packing: Chips on adhesive film with wire-bond side on ...
Description	LED - Chip
File Size	80.67K / 1 Page	View it Online	Download Datasheet

				BEL[Bel Fuse Inc.]
Part No.	S558-3873-27 S553-3873-23
OCR Text	...ater applications with category 3, 4 or 5 UTP/STP media cable. * Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on tape and reel for high speed placement. Construction proce...
Description	HIGH SPEED LAN MAGNETICS
File Size	306.39K / 2 Page	View it Online	Download Datasheet

				EPIGAP optoelectronic GmbH
Part No.	ELC-740-27-1
OCR Text	...0 5 2.0 1.7 2.0 V V 3.0 6.0 740 30 40 750 mW mW nm nm ns Measured on bare chip on TO-18 header with EPIGAP equipment Measu...27-1 Lot N e(typ) [mW] VF(typ) [V] Quantity Packing: Chips on adhesive film with wire-bond side o...
Description	LED - Chip
File Size	80.59K / 1 Page	View it Online	Download Datasheet

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