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  1140-4012 Datasheet PDF File

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    1140-4012 830202 11-40-4012 0011-40-4012

Molex Electronics Ltd.
Part No. 1140-4012 830202 11-40-4012 0011-40-4012
Description Conductor Punch

File Size 14.40K  /  1 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    RX1 RX114012

Tyco Electronics
Part No. RX1 RX114012
Description Power PCB Relay
   Power PCB Relay

File Size 269.73K  /  4 Page

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Amphenol Communications Solutions

Part No. 77311-401-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    3M Company
Part No. CFAK12P1140/KS35L
Description PROXIMITY SENSOR-CAPACITIVE, 200mA, CYLINDRICAL

File Size 91.38K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-111401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    IEC-1140

Level One
Part No. IEC-1140
Description    10/100 Industrial Media Converter, SC SM 40KM

File Size 166.22K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-111401200LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    1140-4129

Molex Electronics Ltd.
Part No. 1140-4129
Description Barrel Form Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4027

Molex Electronics Ltd.
Part No. 1140-4027
Description Conductor Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-411401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4028

Molex Electronics Ltd.
Part No. 1140-4028
Description Insulation Punch

File Size 11.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-21LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4018

Molex Electronics Ltd.
Part No. 1140-4018
Description Conductor Punch

File Size 14.32K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4126

Molex Electronics Ltd.
Part No. 1140-4126
Description Barrel Form Punch

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-811401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4031

Molex Electronics Ltd.
Part No. 1140-4031
Description Conductor Punch

File Size 14.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 1140-4012 Found Datasheets File :: 150+       Page :: | <1> | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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