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Vishay Intertechnology,Inc.
Vishay Intertechnology, Inc.
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| Part No. |
PL342 PL34120191000GDDC PL34120191000KKEX PL34120191000KXDD PL34120191000KXDF PL34120191000GDBX PL34120191000GDDD PL34120191000CFDG PL34120191000MDEG PL34120191000MDBG PL34120191000MHDG PL34120191000MFDG PL34120191000MJDG PL34120191000CFBG PL34120191000CFEG PL34120191000DFDG PL34120191000DFEG PL34120191000MFEG PL34120191000MJBG PL34120191000MHEG PL34120191000MHBG PL34120191000MDDG PL34120191000MFBG PL34120191000GFBC PL34220191000CFBG PL34120191000DHDX PL34120191000DHEX PL34220191000DHBX PL34220191000DHDX PL34220191000DHEX PL34120191000DHBX PL34120191000DHBD PL34120191000DHBC PL34220191000DKBC PL34220191000DJBC PL34220191000BJBC PL34120191000DJBG PL34220191000CXBG PL34220191000FHBG PL34220191000DXBC PL34220191000BHBC PL34120191000DKBG PL34220191000CFBC PL34120191000DXBG PL34220191000CJBC PL34120191000CJBG PL34120191000FHBG PL34220191000CJBG PL34220191000BKBG PL34220191000DHBG PL34120191000CXBG PL34120191000DHBG PL34220191000BHBG PL34220191000BXBG PL34220191000DJBG PL34220191000DXBG PL34220191000FJBG PL34220191000BJBG PL34220191000CDBC PL34220191000CXBC PL34220191000DHBC PL34220191000DKBG PL34120191000MDBD PL34120191000MDBC PL34120191000MDBF PL34120191000MDBX PL34120191000DHEF PL3412
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| Description |
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±14; Dark
Infrared Light Emitting Diodes Top View Type; Type: Surface Mount Type (Sideview); Peak light emitting wavelength P (nm): 950; Half viewing angle
Infrared Light Emitting Diodes Top View Type; Type: Sideview Resin; Peak light emitting wavelength P (nm): 950; Half viewing angle 1/2 (deg): ±
High Sensitivity Chip Sensors Sideview Type; Type: Sideview Resin; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±32; Dark
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 3.0x2.5(t=2.5); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 1;
Schottky Barrier Diodes; Package: TO220FN; Constitution materials list: Packing style: Bulk; Package quantity: 500;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 81.3; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 56; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Distribution or Food Labels; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 250; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 2.6x1.6(t=0.8); Number of terminal: 2; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 0.7;
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 1.9x1.3(t=0.6); Number of terminal: 2; Reverse voltage VR(V): 100; Average rectified forward current IO(A): 0.5;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 54.2; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 203; Print width (mm): 112; Resistance tolerance (O): 550; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
Printheads for Packaging High-Speed Printers; Resolutions (dpi): 300; Print width (mm): 108.4; Resistance tolerance (O): 850; Platen diameter (max.)(f): 50; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24;
High Sensitivity Chip Sensors Sideview Type; Type: Surface Mount Type; Peak sensitivity wavelength P (nm): 800; Viewing angle 1/2 (deg): ±12; Dark current ICEO (Max.)(µA): 0.5; Response time tr·tf (µA): 10; Yes;
Reflective Type Photosensors (Photoreflectors); Type: Cased Type; Light Emitting Diode: 630; Phototransistor: 600; Collector current IC (Min.)(mA): 0.08; Response time tr·tf (µs): 10;
Photointerrupter General Type; Packing style: Plastic bag; Package quantity: 400; 塑料无引线芯片载
Plastic Leadless Chip Carrier 塑料无引线芯片载
Printheads for Distribution or Food Labels; Resolutions (dpi): 203; Print width (mm): 80; Resistance tolerance (O): 550; Platen diameter (max.)(f): 20; Print speed (mm/s): 100 to 300; Logic voltage (V): 4.75 to 5.25; Supply voltage (V): 24; 塑料无引线芯片载
Lead Frame Remote Control Receiver Modules (5V Type); Packing style: Stick; Package quantity: 1000; 塑料无引线芯片载
660/780nm Dual Wave Low Power Lasers; Packing style: Tray; Package quantity: 500; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Leaded type; Package size: 15x10(t=4.5); Number of terminal: 3; Reverse voltage VR(V): 400; Average rectified forward current IO(A): 20; 塑料无引线芯片载
Fast Recovery Diodes; Mounting style: Surface mount; Package size: 5.5x6.5(t=2.3); Number of terminal: 3; Reverse voltage VR(V): 200; Average rectified forward current IO(A): 6;
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| File Size |
127.83K /
2 Page |
 View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
| Part No. |
R5F100GDANA#W0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R5F100GDGNA#W0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R5F100GDAFB#X0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications, LQFP, /Tray/Embossed tape
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| Tech specs |
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Official Product Page
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http://
Vishay Siliconix
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| Part No. |
MDP01 MDP14031M00SD04 MDP14031M00SE04 MDP1403680KFE04 MDP1403680KGD04 MDP1403680KGE04 MDP1403680KJD04 MDP1403KFE04 MDP1403KGD04 MDP1403KGE04 MDP1403KJD04 MDP1401KJD04 MDP1600KJD04 MDP1400RFD04 MDP1401RFD04 MDP1403RFD04 MDP1600RFD04 MDP1601RFD04 MDP1603RFD04 MDP1401KFE04 MDP1600KFE04 MDP1400RSD04 MDP1401RSD04 MDP1403RSD04 MDP1600RSD04 MDP1601RSD04 MDP1603RSD04 MDP1401MGE04 MDP1403MGE04 MDP1601MGE04 MDP1603MGE04 MDP1401KGD04 MDP1401KGE04 MDP14011M00FD04 MDP14011M00FE04 MDP14011M00GD04 MDP14011M00GE04 MDP140110R0FD04 MDP140110R0FE04 MDP140110R0GD04 MDP140110R0GE04 MDP140110R0JD04 MDP140110R0JE04 MDP140110R0SD04 MDP140110R0SE04 MDP14011M00JD04 MDP14011M00JE04 MDP14011M00SD04 MDP14011M00SE04 MDP1600MFD04 MDP1600MSE04 MDP1400RFE04 MDP1401RFE04 MDP1403RFE04 MDP1600RFE04 MDP1601RFE04 MDP1603RFE04 MDP1400RGD04 MDP1401RGD04 MDP1403RGD04 MDP1600RGD04 MDP1601RGD04 MDP1603RGD04 MDP1603KJE04 MDP140310R0GD04 MDP140310R0JD04 MDP140310R0SE04 MDP14031M00GD04 MDP140310R0FD04 MDP140310R0GE04 MDP14031M00GE04 MDP140310R0JE04 MDP140310R0SD04 MDP14031M00FE04 MDP140310R0FE04 MDP14031M00FD04 MDP14031M00JD04 MDP1600KGD04 MDP1600KGE04 MDP1601MFD04 MDP1601MGD04 MDP1400RJD04 MDP1401RJD04 MDP1403RJD04 MDP1600RJD
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| Description |
Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics
Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics
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| File Size |
298.97K /
5 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
R5F100GDGFB#V0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R5F100GDAFB#V0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R5F100GDDNA#U0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R5F100GDGNA#U0
|
| Description |
Low Power, High Function Microcontrollers for General Purpose Applications
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| Tech specs |
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|
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R5F100GDDFB#V0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
R5F100GDGFB#X0
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| Description |
Low Power, High Function Microcontrollers for General Purpose Applications, LQFP, /Tray/Embossed tape
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 000-6181-37R |
| Maker: N/A |
| Pack: N/A |
| Stock: 300057 |
| Unit price
for : |
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50: $2.07 |
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100: $1.96 |
| 1000:
$1.86 |
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Email: oulindz@gmail.com |
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