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  package-8 Datasheet PDF File

For package-8 Found Datasheets File :: 343968    Search Time::2.547ms    
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    Intersil, Corp.
HARRIS SEMICONDUCTOR
Part No. HS9-6617RH-8 HS1-6617RH-8
OCR Text ...ceramic dual-in-line metal seal package (sbdip) mil-std-1835 cdip2-t24 top view 24 lead ceramic metal seal flatpack package (flatpack) mil-s...8 9 10 11 12 a7 a6 a5 a4 a3 a2 a1 a0 q0 q1 q2 gnd 16 17 18 19 20 21 22 23 24 15 14 13 vdd a9 p g a10...
Description Radiation Hardened 2K x 8 CMOS PROM 2K X 8 OTPROM, 120 ns, CDFP24

File Size 130.79K  /  14 Page

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    KM4132G271BTQ-8 KM4132G271BTQ_R-8 KM4132G271B KM4132G271BQ_R-10 KM4132G271BQ_R-7 KM4132G271BQ_R-8 KM4132G271BTQ_R-10 KM4

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. KM4132G271BTQ-8 KM4132G271BTQ_R-8 KM4132G271B KM4132G271BQ_R-10 KM4132G271BQ_R-7 KM4132G271BQ_R-8 KM4132G271BTQ_R-10 KM4132G271BTQ_R-7 KM4132G271BTQR-10 KM4132G271BTQR-8 KM4132G271BQR-8 KM4132G271BTQR-7 KM4132G271BQR-10
OCR Text ...rch 1998) * Added Reverse Type Package in ODERING INFORMATION and PIN CONFIGURATION. * Removed KM4132G271B-H/12 product(-H : 100MHz @ CL =2, -12 : 83MHz @ CL=3). * Changed the Current values of ICC1, ICC3N, ICC4, ICC5, ICC6, ICC7 in DC CHA...
Description 128K x 32bit x 2 Banks Synchronous Graphic RAM LVTTL

File Size 1,032.84K  /  51 Page

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    Excelics Semiconductor
Part No. EIC6472-8
OCR Text ... scl ? hermetic metal flange package ? 100% tested for dc, rf, and r th description the eic6472-8 is a high power, highly linear, single stage mfet amplifier in a flange mount package. this amplifier features excelics? uni...
Description Internally Matched Power FET

File Size 182.62K  /  4 Page

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    NEC Corp.
NEC[NEC]
Part No. NE8500295-8 NE8500295-6 NE8500295-4 NE85002 NE8500200 NE8500200-RG NE8500200-WB NE8500200-WB-A
OCR Text ...recessed gate chip used in `95' package. The device incorporates Ti-Al gate and silicon dioxide glassivation. To reduce the thermal resistan...8 33.8 min 8.0 min 5.9 0.2 33.8 min 33.8 min 33.5 min 10.5 min 9.5 min 8.0 min 3.5...
Description 2 W C-BAND POWER GaAs FET N-CHANNEL GaAs MES FET
C BAND, GaAs, N-CHANNEL, RF POWER, MESFET

File Size 47.52K  /  8 Page

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    Intersil, Corp.
http://
Part No. HS1-80C86RH-8 HS9-80C86RH-8 HS9-80C86RH-Q HS1-80C86RH-Q
OCR Text ...mperature range screening level package hs1-80c86rh-8 -35 o c to +125 o c intersil class b equivalent 40 lead braze seal dip hs1-80c86rh-q -35 o c to +125 o c intersil class s equivalent 40 lead braze seal dip hs9-80c86rh-8 -35 o c to +125 ...
Description Radiation Hardened 16-Bit CMOS Microprocessor 16-BIT, 5 MHz, MICROPROCESSOR, CDFP42

File Size 246.37K  /  37 Page

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    Mitsubishi Electric Corporation
Part No. MH8S72DBFD-8
OCR Text ...sop on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. th...8 synchronous drams in tsop package , industry standard resistered buffer in tssop package and in...
Description 603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

File Size 956.83K  /  56 Page

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    Mitsubishi Electric Corporation
Part No. MH8S72BBFD-8
OCR Text ...sop on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. this...8 synchronous drams in tsop package , industry standard resistered buffer in tssop package and indus...
Description 603,979,776-BIT ( 8,388,608-WORD BY 72-BIT ) Synchronous DYNAMIC RAM

File Size 746.05K  /  56 Page

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    Mitsubishi Electric Corporation
Part No. MH32S72AQJA-8 MH32S72AQJA-7
OCR Text ...sop on a card edge dual in-line package provides any application where high densities and large of quantities memory are required. th...8/full page(programmable) burst write / single write(programmable) auto precharge / all bank prechar...
Description ER 3C 3#16S SKT RECP
ER 3C 3#16S PIN RECP

File Size 929.60K  /  56 Page

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