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AMPAL NDUCTOR 12808 38641 EMK13H D371A STD175 LRS1383F
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  amkor Datasheet PDF File

For amkor Found Datasheets File :: 777    Search Time::1.344ms    
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    PSVFBGA

Amkor Technology
Part No. PSVFBGA
OCR Text ... technology and infrastructure, amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw many new milestones, from publication of JEDEC mechanical and electrical standards ...
Description Package on Package (PoP) Family

File Size 242.15K  /  2 Page

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    CERPAK

Amkor Technology
Part No. CERPAK
OCR Text amkor Technology continues to service this established industry package. The amkor Technology CerPak capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CerPak is a he...
Description Ceramic Pack

File Size 284.60K  /  1 Page

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    POWERSOP2

Amkor Technology
Part No. POWERSOP2
OCR Text ...) Packages: (PSOP / PSSOP) This amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP(c) (PSOP) improves Theta JA up to 50% over a standard SOIC ...
Description Exceptional performance through the innovative design of PSOPs offer

File Size 311.04K  /  2 Page

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    MCMPBGA

Amkor Technology
Part No. MCMPBGA
OCR Text ...ule Plastic Ball Grid Array) by amkor incorporates the latest technology in high-density plastic IC packaging. The high-speed performance and thermal advantages of the PBGA package provide the platform to mix semiconductor technologies such...
Description Innovative designs and expanding package offerings provide a platform from prototype-to-production

File Size 120.34K  /  2 Page

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    CERDIP CDIP

Amkor Technology, Inc.
Part No. CERDIP CDIP
OCR Text amkor Technology is committed to continuing to service this long established standard industry package. The amkor Technology CDIP capability provides a wide range of lead counts and body sizes. The CDIP is a hermetic package consisting of t...
Description Ceramic Dual-Inline Package

File Size 369.27K  /  1 Page

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    PBGA

Amkor Technology, Inc.
Part No. PBGA
OCR Text ...Plastic Ball Grid Array (PBGA): amkor's PBGAs incorporate the most advanced assembly processes and designs for today's and tomorrow's cost/performance applications. This advanced IC package technology allows application and design engineers...
Description Innovative designs and expanding package offerings provide a platform from prototype-to-production

File Size 290.61K  /  2 Page

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    MQFPPOWERQUAD2

Amkor Technology
Part No. MQFPPOWERQUAD2
OCR Text ...many other applications. VISIT amkor TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS185H Rev Date: 05'06 data sheet Cross-sections MQFP PowerQuad(R) 2 Mold Compound Gold Wire ...
Description Exceptional thermal and electrical performance by design include the following

File Size 90.38K  /  2 Page

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    LQFPPOWERQUAD4

Amkor Technology
Part No. LQFPPOWERQUAD4
OCR Text ...owerQuad(R) 4 (PQ4) is the same amkor patented, advanced IC packaging technology used in MQFP PQ4s but applied to Low Profile 1.4 mm QFPs (LQFP). Improved power dissipation is achieved by using an exposed copper heatslug. This large copper ...
Description LQFP PowerQuad? 4 Packages
LQFP PowerQuad㈢ 4 Packages

File Size 133.00K  /  2 Page

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    LQFPPOWERQUAD2

Amkor Technology
Part No. LQFPPOWERQUAD2
OCR Text ...owerQuad(R) 2 (PQ2) is the same amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging provides extraordinary gains in power dissipation and spe...
Description LQFP PowerQuad? 2 Packages
LQFP PowerQuad㈢ 2 Packages

File Size 130.58K  /  2 Page

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    AN-5061

Fairchild Semiconductor
Part No. AN-5061
OCR Text ... the "Surface Mount Assembly of amkor's MicroLeadFrame (MLF) Packages" application note by amkor Technology. This paper is available at: http://www.amkor.com/products/notes_papers/MLFAppNote.pdf When placing capacitors, try to reduce an...
Description Layout Guidelines

File Size 126.02K  /  4 Page

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