Part Number Hot Search : 
AU9720 5821BCB P89LPC R1500FPT ARM60 12808 SII75S12 TLWR7601
Product Description
Full Text Search
  amkor Datasheet PDF File

For amkor Found Datasheets File :: 777    Search Time::1.094ms    
Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    CVBGA

Amkor Technology
Part No. CVBGA
OCR Text ...7.04 n/a n/a amkor assures reliable performance by continuously monitoring key indices: ? moisture sensitivity jedec level 2 @ 240 c characterization jedec level 3 @ 260 c 85 c/85% rh, 168 hours ? temp/humidity 85 c/8...
Description ChipArray? Packages

File Size 301.63K  /  2 Page

View it Online

Download Datasheet





    CSSOP

Amkor Technology
Part No. CSSOP
OCR Text amkor.com visit amkor technology online for locations and to view the most current product information ceramic shrink small outline package (cssop) this is a ceramic version of the plastic ssop package. the cssop is a hermetic package con...
Description Ceramic Shrink Small Outline Package

File Size 299.75K  /  1 Page

View it Online

Download Datasheet

    Amkor Technology, Inc.
Part No. CLGA
OCR Text ...nd expanding package offerings, amkor provides a platform from prototype-to-production. * Flexible land grid array lead counts * Variety of body sizes * 50 mil staggered & 100 mil matrix land * Heat plate / heat slug / heat sink * Exceptio...
Description Ceramic Land Grid Array Package

File Size 353.10K  /  1 Page

View it Online

Download Datasheet

    CQFP

Amkor Technology
Part No. CQFP
OCR Text amkor Technology is continuing to service this established industry package. The amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CQFP is a he...
Description Ceramic Quad Flat Pack Package

File Size 328.12K  /  1 Page

View it Online

Download Datasheet

    CABGA CTBGA

Amkor Technology
Part No. CABGA CTBGA
OCR Text ...1 N/A N/A 19 x 19 17.04 N/A N/A amkor assures reliable performance by continuously monitoring key indices: * Moisture sensitivity JEDEC Level 2 @ 240 C characterization JEDEC Level 3 @ 260 C 85 C/85% RH, 168 hours * Temp/humidity 85 C/85%, ...
Description ChipArray㈢ Packages

File Size 297.54K  /  2 Page

View it Online

Download Datasheet

    CMCM

Amkor Technology, Inc.
Part No. CMCM
OCR Text amkor Technology incorporates the latest technology in high-density Ceramic and Plastic IC packaging. The high-speed performance and thermal advantages of the CBGA and PBGA package provide the platform for increased enhancement for mixed se...
Description Ceramic Multi-Chip Module Package

File Size 299.16K  /  1 Page

View it Online

Download Datasheet

    PLCC

Amkor Technology, Inc.
Part No. PLCC
OCR Text amkor's PLCC IC package portfolio provides: * .352" x .352" to 1.152" x 1.152" body size * 20 to 84 lead counts * JEDEC standard compliant * Available with heatspreader option * Fine pitch wire bond capability Multi-Layer PCB Theta JA (C/W...
Description amkor’s PLCC IC package portfolio provides
amkor隆炉s PLCC IC package portfolio provides

File Size 383.33K  /  2 Page

View it Online

Download Datasheet

    CBGA

Amkor Technology, Inc.
Part No. CBGA
OCR Text amkor's CBGAs incorporate the most advanced assembly processes and designs for today and tomorrow's cost/performance applications. This advanced IC package technology allows application and design engineers to optimize innovations while max...
Description From innovative designs and expanding package offerings, amkor provides a platform from prototype-to-production.

File Size 500.26K  /  1 Page

View it Online

Download Datasheet

    CSPNL

Amkor Technology
Part No. CSPNL
OCR Text ... Wafer Level Packaging CSPnlTM amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the acquisition of Unitive, amkor has adop...
Description Wafer Level Packaging

File Size 153.88K  /  2 Page

View it Online

Download Datasheet

    FLATPACK

Amkor Technology
Part No. FLATPACK
OCR Text amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has leads brazed to either the top or bottom of the package. The lid...
Description Ceramic Flat Pack Package

File Size 486.00K  /  1 Page

View it Online

Download Datasheet

For amkor Found Datasheets File :: 777    Search Time::1.094ms    
Page :: | 1 | 2 | <3> | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

▲Up To Search▲

 




Price and Availability




 
Price & Availability of amkor

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
0.10369992256165