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  1140-4012 Datasheet PDF File

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    A-70475-1140

Molex Electronics Ltd.
Part No. A-70475-1140
Description
File Size 139.28K  /  2 Page

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Amphenol Communications Solutions

Part No. 1140084168
Description 1140084168-Micro SD Normal Open H=1.55 NONE PUSH
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-71395-1140

Molex Electronics Ltd.
Part No. A-71395-1140
Description 2.54mm (.100) Pitch C-Grid垄莽 PCB Connector, Surface Mount, High Profile, Dual Row, Vertical, 40 Circuits

File Size 736.43K  /  6 Page

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Amphenol Communications Solutions

Part No. 77311-401-26LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4017 0011-40-4017

Molex Electronics Ltd.
Part No. 1140-4017 0011-40-4017
Description Insulation Punch

File Size 14.44K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-111401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SAMTEC INC
Part No. MTSW-225-27-S-D-1140 MTSW-240-23-T-D-255
Description 50 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER
80 CONTACT(S), MALE, STRAIGHT BOARD STACKING CONNECTOR, SOLDER

File Size 400.79K  /  2 Page

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Amphenol Communications Solutions

Part No. 54122-111401200LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 40 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Molex, Inc.
Part No. 51140-0305
Description 3.96 W/W RETAINER 511400305 INTERCONNECTION DEVICE

File Size 33.77K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-20LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1140-4015 0011-40-4015

Molex Electronics Ltd.
Part No. 1140-4015 0011-40-4015
Description Insulation Punch

File Size 14.53K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-411401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    11-40-2042 1140-2042 0011-40-2042

Molex Electronics Ltd.
Part No. 11-40-2042 1140-2042 0011-40-2042
Description Terminator Die

File Size 19.91K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-21LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2064 1140-2064 0011-40-2064

Molex Electronics Ltd.
Part No. 11-40-2064 1140-2064 0011-40-2064
Description Terminator Die

File Size 19.42K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-29LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    11-40-2045 1140-2045 0011-40-2045

Molex Electronics Ltd.
Part No. 11-40-2045 1140-2045 0011-40-2045
Description Terminator Die - OVERLAP INSULATION CRIMP

File Size 19.49K  /  1 Page

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Amphenol Communications Solutions

Part No. 54112-811401200LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 40 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    1140-4009 0011-40-4009

Molex Electronics Ltd.
Part No. 1140-4009 0011-40-4009
Description Insulation Punch

File Size 14.47K  /  1 Page

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Amphenol Communications Solutions

Part No. 77311-401-28LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

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