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  73644-2017 Datasheet PDF File

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    73644-2110

Molex Electronics Ltd.
Part No. 73644-2110
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
File Size 174.00K  /  4 Page

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Toshiba Electronic Devices & Storage Corporation
Part No. TPD2017FN
Description Intelligent power device (Low side switch) / VDD=6 V / 8ch / SSOP30
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    73644-1207

Molex Electronics Ltd.
Part No. 73644-1207
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 167.28K  /  4 Page

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Amphenol Communications Solutions
Part No. 54242-108201750LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2105

Molex Electronics Ltd.
Part No. 73644-2105
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 75844-201-72LF
Description BERGSTIK
Tech specs 　 　

Official Product Page

    73644-0005

Molex Electronics Ltd.
Part No. 73644-0005
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A
File Size 166.78K  /  4 Page

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Amphenol Communications Solutions
Part No. 54122-110201700LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    73644-2018

Molex Electronics Ltd.
Part No. 73644-2018
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 59202-F40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs 　 　

Official Product Page

    73644-2009

Molex Electronics Ltd.
Part No. 73644-2009
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits
File Size 174.00K  /  4 Page

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Amphenol Communications Solutions
Part No. 59202-G40-20-174LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 40 Positions.
Tech specs 　 　

Official Product Page

    73644-2001

Molex Electronics Ltd.
Part No. 73644-2001
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position A, 72 Circuits
File Size 174.54K  /  4 Page

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Amphenol Communications Solutions
Part No. 54112-109201700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    73644-2101

Molex Electronics Ltd.
Part No. 73644-2101
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 72 Circuits
File Size 163.64K  /  4 Page

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Amphenol Communications Solutions
Part No. 67292-017
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 34 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs 　 　

Official Product Page

    73644-1200

Molex Electronics Ltd.
Part No. 73644-1200
Description 2.00mm (.079) Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B
File Size 167.83K  /  4 Page

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Amphenol Communications Solutions
Part No. 72017-212LF
Description 5 Row Signal Receptacle, 150 Position, Straight, Solder to Board
Tech specs 　 　

Official Product Page

    73644-1201

Molex Electronics Ltd.
Part No. 73644-1201
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
File Size 160.13K  /  4 Page

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Amphenol Communications Solutions
Part No. 90312-017LF
Description Crimp-to-Wire Housing, Single Row, Pol. w/Latch, 17 Position
Tech specs 　 　

Official Product Page

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