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  73644-2016 Datasheet PDF File

For 73644-2016 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    73644-2210 0736442210

Molex Electronics Ltd.
Part No. 73644-2210 0736442210
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits
2.00mm (.079") Pitch HDM垄莽 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position F, 72 Circuits

File Size 174.19K  /  4 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-2R2M=P2
Description Fixed IND 2.2uH 1400mA NONAUTO
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736442000 73644-2000

Molex Electronics Ltd.
Part No. 0736442000 73644-2000
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits

File Size 164.40K  /  4 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-1R0M=P2
Description Fixed IND 1uH 1800mA NONAUTO
Tech specs    

Official Product Page

    0736440106 73644-0106

Molex Electronics Ltd.
Part No. 0736440106 73644-0106
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 72 Circuits

File Size 159.08K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622LPCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
Tech specs    

Official Product Page

    0736441116

Molex Electronics Ltd.
Part No. 0736441116
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits

File Size 167.28K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    DS2016-150

MAXIM - Dallas Semiconductor
Part No. DS2016-150
Description 2k x 8 3V/5V Operation Static RAM

File Size 255.76K  /  9 Page

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Amphenol Communications Solutions

Part No. 67292-016LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    0736440003 SDA-73644-0003

Molex Electronics Ltd.
Part No. 0736440003 SDA-73644-0003
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header

File Size 159.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-809201650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0736440011 SDA-73644-0011

Molex Electronics Ltd.
Part No. 0736440011 SDA-73644-0011
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1621LPLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    0736443112 SDA-73644-3112

Molex Electronics Ltd.
Part No. 0736443112 SDA-73644-3112
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header

File Size 174.33K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127720-162LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    SDA-73644-2208 0736442208

Molex Electronics Ltd.
Part No. SDA-73644-2208 0736442208
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header

File Size 174.00K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622PLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

   
Part No. 2026 2054 2052 2016 2110
Description Interface IC

File Size 394.89K  /  9 Page

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Amphenol Communications Solutions

Part No. 67292-016
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

For 73644-2016 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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