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  73644-2016 Datasheet PDF File

For 73644-2016 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0736440204

Molex Electronics Ltd.
Part No. 0736440204
Description MOLEX Connector

File Size 166.97K  /  4 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-2R2M=P2
Description Fixed IND 2.2uH 1400mA NONAUTO
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0736440205

Molex Electronics Ltd.
Part No. 0736440205
Description MOLEX Connector

File Size 166.97K  /  4 Page

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Murata Manufacturing Co Ltd

Part No. DFE2016CKA-1R0M=P2
Description Fixed IND 1uH 1800mA NONAUTO
Tech specs    

Official Product Page

    0736440206

Molex Electronics Ltd.
Part No. 0736440206
Description MOLEX Connector

File Size 166.97K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622LPCLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
Tech specs    

Official Product Page

    0736442217

Molex Electronics Ltd.
Part No. 0736442217
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 174.55K  /  4 Page

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Amphenol Communications Solutions

Part No. 68020-162HLF
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0736442216

Molex Electronics Ltd.
Part No. 0736442216
Description 2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 174.55K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-016LF
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

    0736440006

Molex Electronics Ltd.
Part No. 0736440006
Description 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location

File Size 166.79K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-809201650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    0736446216 73644-6216

Molex Electronics Ltd.
http://
Part No. 0736446216 73644-6216
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits

File Size 182.38K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1621LPLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    0736440013

Molex Electronics Ltd.
Part No. 0736440013
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position G, 72 Circuits

File Size 159.09K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127720-162LF
Description Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
Tech specs    

Official Product Page

    0736440016

Molex Electronics Ltd.
Part No. 0736440016
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits

File Size 167.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 10127820-1622PLF
Description Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
Tech specs    

Official Product Page

    0736440017

Molex Electronics Ltd.
Part No. 0736440017
Description 2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits

File Size 167.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 67292-016
Description BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
Tech specs    

Official Product Page

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