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Molex Electronics Ltd.
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| Part No. |
0736440116 73644-0116
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits
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| File Size |
166.79K /
4 Page |
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it Online |
Download Datasheet
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Murata Manufacturing Co Ltd |
| Part No. |
DFE2016CKA-2R2M=P2
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| Description |
Fixed IND 2.2uH 1400mA NONAUTO
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736440117 73644-0117
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits
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| File Size |
159.09K /
4 Page |
View
it Online |
Download Datasheet |
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Murata Manufacturing Co Ltd |
| Part No. |
DFE2016CKA-1R0M=P2
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| Description |
Fixed IND 1uH 1800mA NONAUTO
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443000 73644-3000
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 144 Circuits
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| File Size |
164.67K /
4 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10127820-1622LPCLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, LCP, GW Compatible, With Pegs, Tape and Reel with cap.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443001 73644-3001
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position A, 144 Circuits
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| File Size |
174.87K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68020-162HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 62 Positions, 2.54mm (0.100in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67292-016LF
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Official Product Page
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Molex Electronics Ltd.
http://
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| Part No. |
0736446217 73644-6217
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position N/A, 144 Circuits
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| File Size |
179.64K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
54122-809201650LF
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| Description |
BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443003 73644-3003
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position B, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position B, 144 Circuits
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| File Size |
164.13K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10127820-1621LPLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, LCP, GW Compatible, Tray Packing, With Pegs.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127720-162LF
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| Description |
Minitek® Pwr 3.0, Dual Row, Right Angle Through Hole Header, 16 Positions, Gold Flash plating, Non GW Compatible LCP, With Pegs, Tray Packing.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10127820-1622PLF
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| Description |
Minitek® Pwr 4.2, Dual Row, Vertical Through Hole Header, 80u\\ Min Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0736443008 73644-3008
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position E, 144 Circuits
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| File Size |
174.33K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
67292-016
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| Description |
BergStik® 2.54mm, Board To Board, Vertical 2 Row Guide Pin Header 32 Positions 2.54mm Pitch 3.81um (150u\\.) Tin-Lead Mating plating.
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Official Product Page
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