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  this is information on a product in full production. march 2013 docid024414 rev 1 1/7 7 STPS3L60U-Y automotive power schottky rectifier datasheet ? production data features ? negligible switching losses ? low forward voltage drop ? avalanche capability specified ? aec-q101 qualified description surface mount power schottky rectifier suited for high frequency dc to dc converters. packaged in smb, this device is in tended for use in low voltage, high frequency inverters and small battery chargers and for applications where there are space constraints. table 1. device summary symbol value i f(av) 3 a v rrm 60 v t j (max) 150 c v f (max) 0.61 v k a smb stps3l60uy www.st.com
characteristics STPS3L60U-Y 2/7 docid024414 rev 1 1 characteristics to evaluate the conduction loss es use the following equation: p = 0.44 x i f(av) + 0.05 x i f 2 (rms) table 2. absolute ratings (1) 1. limiting values, per diode symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) rms forward current 10 a i f(av) average forward current t l = 105 c ?? = 0.5 3a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 100 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 2000 w t stg storage temperature range -65 to + 150 c t j operating junction temperature (2) range 2. condition to avoid thermal runaway for a diode on its own heatsink -40 to + 150 c dv/dt critical rate of rise reverse voltage 10000 v/s table 3. thermal resistance symbol parameter value unit r th (j-l) junction to leads 20 ? c/w table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, ? < 2% reverse leakage current t j = 25 c v r = v rrm - - 150 a t j = 100 c - 4 15 ma t j = 125 c - 14 30 v f (1) forward voltage drop t j = 25 c i f = 3 a - - 0.62 v t j = 100 c - 0.53 0.61 t j = 125 c - 0.51 0.59 t j = 25 c i f = 6 a - - 0.79 t j = 100 c - 0.62 0.71 t j = 125 c - 0.6 0.69 dptot dtj --------------- 1 rth j a ? ?? ------------------------- - ?
docid024414 rev 1 3/7 STPS3L60U-Y characteristics figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( ? ? = 0.5) p (w) f(av) 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 t =tp/t tp i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 i (a) f(av) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 25 50 75 100 125 150 r =80c/w th(j-a) r=r th(j-a) th(j-i) t (c) amb figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) figure 6. relative variation of thermal impedance junction to ambient versus pulse duration 0 1 2 3 4 5 6 7 8 9 10 11 1.e-03 1.e-02 1.e-01 1.e+00 ta=25 c ta=50 c ta=100 c i m t =0.5 i (a) m t(s) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse z/r th(j-a) th(j-a) t (s) p
characteristics STPS3L60U-Y 4/7 docid024414 rev 1 figure 11. thermal resistance junction to ambient versus copper surface under each lead figure 7. reverse leakage current versus reverse voltage applied (typical values) figure 8. junction capacitance versus reverse voltage applied (typical values) 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 45 50 55 60 tj=125c tj=25c tj=100c v (v) r i (ma) r 10 100 1000 1 10 100 f=1mhz vosc=30mv tj=25c v (v) r c(pf) figure 9. forward voltage drop versus forward current (high level) figure 10. forward voltage drop versus forward current (low level) 0 5 10 15 20 25 30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 tj=25c (maximum values) tj=100c (maximum values) tj=100c (maximum values) tj=100c (typical values) tj=100c (typical values) i (a) fm v (v) fm 0 1 2 3 4 5 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 tj=25c (maximum values) tj=100c (maximum values) tj=100c (maximum values) tj=100c (typical values) tj=100c (typical values) i (a) fm v (v) fm 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 smb s(cu)(cm2) r (c/w) th(j-a) copper thickness = 35 m expoxy printed circuit fr4,
docid024414 rev 1 5/7 STPS3L60U-Y package information 2 package information ? epoxy meets ul94,v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions a nd product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. smb dimension definitions figure 13. smb footprint, dimensions in mm (inches) table 5. smb dimension values ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.300) (0.064) (0.086)
ordering information STPS3L60U-Y 6/7 docid024414 rev 1 3 ordering information 4 revision history table 6. ordering information order codes marking package weight base qty delivery mode stps3l60uy g36y smb 0.107 g 2500 tape and reel table 7. document revision history date revision changes 22-mar-2013 1 initial release.
docid024414 rev 1 7/7 STPS3L60U-Y please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not authorized for use in weapons. nor are st products designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2013 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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