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| ? 2012-2015 microchip technology inc. advance information ds40001667d-page 1 mgc3030/3130 introduction microchip?s mgc3x30 are 3d gesture recognition and motion tracking controller chips based on microchip?s patented gestic ? technology. they enable user- command input with natural hand and finger movements. applying the principles of electrical near- field sensing, the mgc3x30 contain all the building blocks to develop robust 3d gesture input sensing systems. implemented as a low-power mixed-signal configurable controller, they provide a large set of smart functional features with integrated signal driver, a frequency adaptive input path for automatic noise suppression and a digital signal processing unit. microchip?s on-chip colibri suite obsoletes processing needs at the host, reduces system power consumption resulting in low software development efforts for short time-to-market success. the mgc3xxx family represents a unique solution that provides gesture information of the human hand in real time. dedicated chip family members add position data, touch or multi touch information to the free space gesture sensing. the mgc3xxx allow the realization of a new generation of user interfaces across various industry markets. applications ? audio products ? notebooks/keyboards/pc peripherals ? home automation ? white goods ? switches/industrial switches ? medical products ? game controllers ? audio control power features ? variety of several power operation modes include: - processing mode: 20 ma @ 3.3v, typical - programmable self wake-up: 110 a @ 3.3v - deep sleep: 9 a @ 3.3v, typical key features ? recognition of 3d hand gestures and x, y, z positional data (MGC3130) ? proximity and touch sensing ? built-in colibri gesture suite (running on chip) ? advanced 3d signal processing unit ? detection range: 0 to 10 cm ? receiver sensitivity: <1 ff ? position rate: 200 positions/sec ? spatial resolution: up to 150 dpi ? carrier frequency: 44 khz to 115 khz ? channels supported: - five receive (rx) channels - one transmit (tx) channel ? on-chip auto calibration ? low noise radiation due to low transmit voltage and slew rate control ? noise susceptibility reduction: - on-chip analog filtering - on-chip digital filtering - automatic frequency hopping ? enables the use of low-cost electrode material including: - printed circuit board - conductive paint - conductive foil - laser direct structuring (lds) - touch panel ito structures ? field upgrade capability ? operating voltage: 3.3v (+/-5%) (single supply) ? temperature range: -20c to +85c peripheral features ?1x i 2 c? interface for configuration and sensor output streaming ? five gesture port pins for individual mapping of gesture to eios note: this data sheet applies to parts mgc3030 and MGC3130. throughout this document the term mgc3x30 will be representative for these two parts. mgc3030/3130 3d tracking and gesture controller data sheet
mgc3030/3130 ds40001667d-page 2 advance information ? 2012-2015 microchip technology inc. table 1: mgc3x30 available packages part number available package pins contact/lead pitch dimensions mgc3030 ssop 28 0.65 7.80x10.50 MGC3130 qfn 28 0.5 5x5 note: all dimensions are in millimeters (mm) unless specified. table 2: mgc3x30 feature overview gesture recognition position tracking raw data streaming multi touch finger tracking wake-up on approach deep sleep gesture port pins rx receive electrodes i 2 c? ports mgc3030 yes no yes no yes yes 5 5 1 MGC3130 yes yes yes no yes yes 5 5 1 ? 2012-2015 microchip technology inc. advance information ds40001667d-page 3 mgc3030/3130 pin diagrams figure 1: 28-pin diagram ( MGC3130) qfn 1 2 3 4 5 6 715 8 9 10 11 12 13 14 16 17 18 19 20 21 26 25 24 23 22 28 27 v caps v inds v ss2 rx0 rx1 rx2 rx3 rx4 v capa v ss 3 v capd eio0 eio1 eio2 eio5/si1 eio4/si0 eio3 nc nc nc is2 eio6/si2 mclr t xd nc v ss 1 v dd eio7/si3 MGC3130 exp-29 mgc3030/3130 ds40001667d-page 4 advance information ? 2012-2015 microchip technology inc. figure 2: 28-pin diagram ( mgc3030) ssop mgc3030 eio0 eio1 eio2 nc is2 nc eio3 nc eio4/si0 eio5/si1 eio6/si2 nc eio7/si3 mclr vcapd v ss 3 vcapa rx2 rx4 rx3 rx0 rx1 v ss 2 vinds vcaps tx d v dd v ss 1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 ? 2012-2015 microchip technology inc. advance information ds40001667d-page 5 mgc3030/3130 table 3: pin summary pin name pin number pin type buffer type description 28-qfn 28-ssop v caps 118p ? reserved: connect to v dd . v inds 219p ? reserved: do not connect. v ss 2 320p ? ground. rx0 4 21 i analog analog input channels: receive electrode connection. rx1 5 22 i analog rx2 6 23 i analog rx3 7 24 i analog rx4 8 25 i analog v capa 926p ? external filter capacitor (4.7 f) connection for internal analog voltage regulator (3v). v ss 3 10 27 p ? common ground reference for analog and digital domain. v capd 11 28 p ? external filter capacitor (4.7 f) connection for internal digital voltage regulator (1.8v). eio0 12 1 i/o st extended io0 (eio0)/transfer status (ts). ts line requires external 10 k ?? pull-up ? eio1 13 2 i/o st extended io1 (eio1)/interface selection pin 1 (is1). eio2 14 3 i/o st extended io2 (eio2)/irq0. is2 15 4 i st interface selection pin 2 (is2). nc 16 5 ?? reserved: do not connect. nc 17 6 ?? reserved: do not connect. nc 18 7 ?? reserved: do not connect. eio3 19 8 i/o st extended io3 (eio3)/irq1. eio4/si0 20 9 i/o st extended io4 (eio4)/serial interface 0 (si0): i 2 c?_sda0. when i 2 c? is used, this line requires an external 1.8 k ?? pull-up. eio5/s11 21 10 i/o st extended io5 (eio5)/serial interface 1 (si1): i 2 c?_scl0. when i 2 c? is used, this line requires an external 1.8 k ?? pull-up. eio6/s12 22 11 i/o st extended io6 (eio6). eio7/s13 23 12 i/o st extended io7 (eio7). mclr 24 13 i/p st master clear (reset) input. this pin is an active-low reset to the device. it requires external 10 k ?? pull-up. t xd 25 15 o analog transmit electrode connection. legend: p = power; st = schmitt trigger input with cmos levels; o = output; i = input; ? = n/a mgc3030/3130 ds40001667d-page 6 advance information ? 2012-2015 microchip technology inc. nc 26 14 ?? reserved: do not connect. v ss 1 27 16 p ? common ground reference for analog and digital domains. v dd 28 17 p ? positive supply for peripheral logic and i/o pins. it requires an external filtering capaci- tor (100 nf). exp 29 ? p ? exposed pad. it should be connected to ground. table 3: pin summary pin name pin number pin type buffer type description 28-qfn 28-ssop legend: p = power; st = schmitt trigger input with cmos levels; o = output; i = input; ? = n/a ? 2012-2015 microchip technology inc. advance information ds40001667d-page 7 mgc3030/3130 table of contents 1.0 theory of operation: electrical near-fie ld (e-field sensing)................................................................ .................................... 8 2.0 feature description ......................................................................................................... ........................................................ 10 3.0 system architecture......................................................................................................... ....................................................... 14 4.0 functional description ...................................................................................................... ....................................................... 17 5.0 interface description ....................................................................................................... ......................................................... 26 6.0 application architecture .................................................................................................... ....................................................... 34 7.0 development support ......................................................................................................... ..................................................... 37 8.0 electrical specifications ................................................................................................... ........................................................ 39 9.0 packaging information ....................................................................................................... ...................................................... 40 the microchip web site ......................................................................................................... .............................................................. 47 customer change notification service ........................................................................................... ..................................................... 47 customer support............................................................................................................... ................................................................. 47 product identification system ................................................................................................. ............................................................ 48 to our valued customers it is our intention to provide our valued customers with the best documentation possible to ensure successful use of your micro chip products. to this end, we will continue to improve our publications to better suit your needs. our publications will be refined and enhanced as new volumes and updates are introduced. if you have any questions or comments regar ding this publication, please contact the marketing communications department via e-mail at docerrors@microchip.com . we welcome your feedback. most current data sheet to obtain the most up-to-date version of this data s heet, please register at our worldwide web site at: http://www.microchip.com you can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page . the last character of the literature number is the versi on number, (e.g., ds30000000a is ve rsion a of document ds30000000). errata an errata sheet, describing minor operational differences fr om the data sheet and recommended workarounds, may exist for curren t devices. as device/documentation issues become known to us, we will publish an errata sheet. the errata will specify the revisi on of silicon and revision of document to which it applies. to determine if an errata sheet exists for a particular device, please check with one of the following: ? microchip?s worldwide web site; http://www.microchip.com ? your local microchip sales office (see last page) when contacting a sales office, please specify which device, re vision of silicon and data sheet (include literature number) you are using. customer notification system register on our web site at www.microchip.com to receive the most current information on all of our products. mgc3030/3130 ds40001667d-page 8 advance information ? 2012-2015 microchip technology inc. 1.0 theory of operation: electrical near-field (e-field) sensing microchip?s gestic is a 3d sensor technology which utilizes an electric field (e-field) for advanced proximity sensing. it allows realization of new user interface applications by detection, tracking and classification of a user?s hand gestures in free space. e-fields are generated by electrical charges and propagate three-dimensionally around the surface, carrying the electrical charge. applying direct voltages (dc) to an electrode results in a constant electric field. applying alternating voltages (ac) makes the charges vary over time and thus, the field. when the charge varies sinusoidal with frequency f, the resulting electromagnetic wave is characterized by wavelength = c/f, where c is the wave propagation velocity ? in vacuum, the speed of light. in cases where the wavelength is much larger than the electrode geometry, the magnetic component is practically zero and no wave propagation takes place. the result is quasi-static electrical near field that can be used for sensing conductive objects such as the human body. microchip?s gestic technology uses transmit (tx) frequencies in the range of 100 khz which reflects a wavelength of about three kilometers. with electrode geometries of typically less than fourteen by fourteen centimeters, this wavelength is much larger in comparison. gestic systems work w/o wave propagation. in case a person?s hand or finger intrudes the electrical field, the field becomes distorted. the field lines are drawn to the hand due to the conductivity of the human body itself and shunted to ground. the three- dimensional electric field decreases locally. microchip?s gestic technology uses a minimum number of four receiver (rx) electrodes to detect the e-field variations at different positions to measure the origin of the electric field distortion from the varying signals received. the information is used to calculate the position, track movements (MGC3130) and to classify movement patterns (gestures, mgc3x30). figure 1-1 and figure 1-2 show the influence of an earth-grounded body to the electric field. the proximity of the body causes a compression of the equipotential lines and shifts the rx electrode signal levels to a lower potential which is measured. figure 1-1: equipotential lines of an undistorted e-field figure 1-2: equipotential lines of a distorted e-field ? 2012-2015 microchip technology inc. advance information ds40001667d-page 9 mgc3030/3130 1.1 gestic technology benefits ? gestic e-field sensors are not impacted by ambient influences such as light or sound, which have a negative impact to the majority of other 3d technologies. ? gestic technology allows gesture/position track- ing processing on chip ? no host processing needed. algorithms are included in the colibri gesture suite which runs on chip and is provided my microchip. ? the gestic technology has a high immunity to noise, provides high update rates and resolution, low latency and is also not affected by clothing, surface texture or reflectivity. ? a carrier frequency in the range of 44-115 khz is being used with the benefit of being outside the regulated radio frequency range. in the same manner, gestic is not affected by radio interference. ? usage of thin low-cost materials as electrodes allow low system cost at slim industrial designs. ? the further use of existing capacitive sensor structures such as a touch panel?s ito coating allow additional cost savings and ease the integration of the technology. ? electrodes are invisible to the users? eye since they are implemented underneath the housing surface or integrated into a touch panel?s ito structure. ? gestic works centrically over the full sensing space. thus, it provides full surface coverage without any detection blind spots. ? only one gestic transmitter electrode is used for e-field generations. the benefit is an overall low power consumption and low radiated emc noise. ? since gestic is basically processing raw electrode signals and computes them in real time into pre-processed gestures and x, y, z positional data, it provides a highly flexible user interface technology for any kind of electronic devices. mgc3030/3130 ds40001667d-page 10 advance information ? 2012-2015 microchip technology inc. 2.0 feature description 2.1 gesture definition a hand gesture is the movement of the hand to express an idea or meaning. the gestic ? technology accurately allows sensing of a user?s free space hand motion for contact free position tracking, as well as 3d gesture recognition based on classified movement patterns. 2.2 gestic library mgc3x30 is being provided with a gestic library loader which is stored on the chip?s flash memory. using this loader, a gestic library can be flashed on the mgc3x30 via i 2 c? with (e.g., aurea gui) (see section 7.1 ?aurea software package? ) or an embedded host controller. the gestic library includes: ? colibri suite: digital signal processing (dsp) algorithms and feature implementations. ? system control: mgc3x30 hardware control features such as analog front end (afe) access, interface control and parameters storage. ? library loader: gestic library update through the application host?s interface. 2.2.1 colibri suite the colibri suite combines data acquisition, digital signal processing and interpretation. the colibri suite functional features are illustrated in figure 2-1 and described in the following sections. figure 2-1: colibri suite core elements 2.2.1.1 position tracking (MGC3130) the colibri suite?s position tracking feature provides three-dimensional hand position over time and area. the absolute position data is provided according to the defined origin of the cartesian coordinate system (x, y, z). position tracking data is continuously acquired in parallel to gesture recognition. with a position rate of up to 200 positions/sec., a maximum spatial resolution of 150 dpi is achieved. 2.2.1.2 gesture recognition (mgc3x30) the colibri suite?s gesture recognition model detects and classifies hand movement patterns performed inside the sensing area. using advanced stochastic classification based on hidden markov model (hmm), industry best gesture recognition rate is being achieved. the colibri suite includes a set of predefined hand gestures which contains flick, circular and symbol gestures as the ones outlined below: ? flick gestures figure 2-2: flick gestures a flick gesture is a unidirectional gesture in a quick flicking motion. an example may be a hand movement from west to east within the sensing area, from south to north, etc. ? circular gestures figure 2-3: circle gestures a circular gesture is a round-shaped hand movement defined by direction (clockwise/counterclockwise) without any specific start position of the user?s hand. two types of circular gestures are distinguished by gestic technology: 1. discrete circles discrete circles are recognized after performing a hand movement inside the sensing area. the recognition result (direction: clockwise/ counterclockwise) is provided after the hand movement stops or the hand exits the detection area. the discrete circles are typically used as dedicated application control commands. digital signal processing colibri suite position tracking gesture recognition approach detection ? 2012-2015 microchip technology inc. advance information ds40001667d-page 11 mgc3030/3130 2. airwheel an airwheel is the recognition of continuously- performed circles inside the sensing area and provides information about the rotational movement in real time. it provides continuously counter information which increments/decrements according to the movement?s direction (clockwise/counterclockwise). the airwheel can be adjusted for convenient usage in various applications (e.g., volume control, sensitivity adjustment or light dimming). ?s ensor touch ge stures figure 1: sensor touch gestures a sensor touch is a multi-zone gesture that reports up to five concurrently-performed touches on the system?s electrodes. the sensor touch provides information about touch and tapping: 1. touch the sensor touch indicates an event during which a gestic electrode is touched. this allows distinction between short and long touches. 2. tap and double tap the tap and double tap signalize short taps and double taps on each system electrode. the tap length and double tap interval are adjustable. - single tap delay: a single tap is detected when touching the surface of an electrode first and after the hand is pulled out of the touch area. the single tap is only detected when the timing between the touch and the release of the touch event is smaller than the adjusted delay. increasing the time allows the user more time to perform the tap. the range for the adjusted delay can be between 0s and 1s. - double tap delay: the double tap is detected when two taps are performed within the adjusted delay. the range for the adjusted delay can be between 0s and 1s. the smaller the selected delay is, the faster the two taps have to be executed. mgc3030/3130 ds40001667d-page 12 advance information ? 2012-2015 microchip technology inc. figure 2-4: sensor touch diagram 2.2.1.3 gesture port figure 2: gesture port the gesture port enables a flexible mapping of colibri suite feature events to certain output signals at dedicated pins of the mgc3x30. the individual feature events can be mapped to one of five eio pins and trigger a variety of signal changes (permanent high, permanent low, toggle, pulse (100 ms), high active, low active). the gesture port simplifies and enhances embedded system integration. it enables host-free integration based on eios. touch touch detected tap tap detected max tap duration 0s-1s double tap double tap detected max double tap duration 0s-1s max tap duration 0s-1s tap detected ? 2012-2015 microchip technology inc. advance information ds40001667d-page 13 mgc3030/3130 2.2.1.4 approach detection figure 3: approach detection approach detection is an embedded power-saving feature of microchip?s colibri suite. it sends mgc3x30 to sleep mode and scans periodically the sensing area to detect the presence of a human hand. utilizing the in-built self wake-up mode, approach detection alternates between sleep and scan phases. during the scan phases, the approach of a human hand can be detected while very low power is consumed. for more details, please see section 4.2.4.3 ?self wake-up mode? . a detected approach of a user exceeding configured threshold criteria will alternate the mgc3x30 from self wake-up to processing mode or even the application host in the overall system. within the approach detection sequence, the following scans are performed: ? approach scan : an approach scan is performed during the scan phase of the mgc3x30?s self wake-up mode. typically, one rx channel is active but more channels can be activated via the gestic library. the time interval (scan interval) between two consecutive approach scans is configurable. for typical applications, the scan cycle is in a range of 20 ms to 150 ms. during the approach scan, the activated rx channels are monitored for signal changes which are caused by, for example, an approaching human hand and exceeding the defined threshold. this allows an autonomous wake-up of the mgc3x30 and host applications at very low-power consumption. ? calibration scan (1) : the approach detection feature includes the possibility to perform additional calibration scans for the continuous adaptation of the electrode system to environmental changes. a calibration scan is performed during the scan phase of the mgc3x30?s self wake-up mode. five rx channels are active to calibrate the sensor signals. the calibration scan is usually performed in configurable intervals from 2s to 1024s. to reduce the power consumption, the number of scans per second can be decreased after a certain time of non-user activity. colibri suite provides a full user flexibility to configure the starting calibration scans rate (calibration start scan interval), non-user activity time-out (calibration transition time) and the calibration scans rate (calibration final scan interval) which will be used afterwards. a typical implementation uses calibration scans every 2s during the first two minutes, and every 10s afterwards, until an approach is detected. the timing sequence of the approach detection feature is illustrated in figure 2-5 . figure 2-5: approach detection sequence current time periodic approach scans calibration scan periodic approach scans calibration scan periodic approach scans calibration scan periodic approach scans scan interval 20ms-150ms calibration start scan interval 2s-10s i sleep = 9a i 5chscan = 20ma i 5chscan : scan phase with 5 active rx channels: calibration scan i sleep : sleep phase calibration final scan interval 2s-1024s calibration transition time (non-user activity timeout) 2s-255s processing mode idle timeout 5s-1024s self wake-up mode mgc3030/3130 ds40001667d-page 14 advance information ? 2012-2015 microchip technology inc. 3.0 system architecture mgc3x30 are mixed-signal configurable controllers. the entire system solution is composed of three main building blocks (see figure 3-1 ): ? mgc3x30 controller ? gestic ? library ? external electrodes 3.1 mgc3x30 controller the mgc3x30 feature the following main building blocks: ? low noise analog front end (afe) ? digital signal processing unit (spu) ? communication interfaces the mgc3x30 provide a transmit signal to generate the e-field, conditions the analog signals from the receiving electrodes and processes these data digitally on the spu. data exchange between the mgc3x30 and the host is conducted via the controller?s communication interface or the gesture port. for details, please refer to section 4.0 ?functional description? . 3.2 gestic ? library the embedded gestic library is optimized to ensure continuous and real-time free-space gesture recognition and motion tracking (MGC3130) concurrently. it is fully-configurable and allows required parameterization for individual application and external electrodes. 3.3 external electrodes electrodes are connected to mgc3x30. an electrode needs to be individually designed following the guide lines from the ?gestic design guide? for optimal e-field distribution and detection of e-field variations inflicted by a user. figure 3-1: mgc3x30 controller system architecture mgc3x30 analog front end communications interfaces gestic ? library external electrodes tx rx 5 signal processing unit to application host ? 2012-2015 microchip technology inc. advance information ds40001667d-page 15 mgc3030/3130 3.3.1 electrode equivalent circuit the hand position tracking and gesture recognition capabilities of a gestic system depends on the electrodes design and their material characteristics. a simplified equivalent circuit model of a generic gestic electrode system is illustrated in figure 3-2 . figure 3-2: electrodes capacitive equivalent circuitry earth grounded ?v t x : tx electrode voltage ?v r x b u f : mgc3x30 rx input voltage ?c h : capacitance between receive electrode and hand (earth ground). the user?s hand can always be considered as earth-grounded due to the comparable large size of the human body. ?c r x t x : capacitance between receive and transmit electrodes ?c r x g : capacitance of the receive (rx) electrode to system ground + input capacitance of the mgc3x30 receiver circuit ?c txg : capacitance of the transmit (tx) electrode to system ground ?e rx : rx electrode ?e tx : tx electrode the rx and tx electrodes in a gestic electrode system build a capacitance voltage divider with the capacitances c rxtx and c rxg which are determined by the electrode design. c txg represents the tx electrode capacitance to system ground driven by the tx signal. the rx electrode measures the potential of the generated e-field. if a conductive object (e.g., a hand) approaches the rx electrode, c h changes its capacitance. this minuscule change in the femtofarad range is detected by the mgc3x30 receiver. the equivalent circuit formula for the earth-grounded circuitry is described in equation 3-1 . equation 3-1: electrodes equivalent circuit a common example of an earth-grounded device is a notebook, even with no ground connection via power supply or ethernet connection. due to its larger form factor, it presents a high earth-ground capacitance in the range of 50 pf and thus, it can be assumed as an earth-grounded gestic system. a brief overview of the typical values of the electrodes capacitances is summarized in tab l e 3 - 1 . c rx tx c tx g c rx g system ground transmitter signal electrode signal c h earth ground e-field to mgc3x30 v tx system ground c r x t x c t x g c rx g s y st em g round transmit ter s ignal el ectro d e s ig na l c h earth g round e - f i e l d t o m gc 3 x 30 v t x s y stem g roun d e rx e tx v rx buf x table 3-1: electrodes capacitances typical values capacity typical value c r x t x 10...30 pf c t x g 10...1000 pf c r x g 10...30 pf c h <1 pf v rxbuf v tx c rxtx c rxtx c rxg c h ++ ---------------------------------------------- - ? = mgc3030/3130 ds40001667d-page 16 advance information ? 2012-2015 microchip technology inc. 3.3.2 standard electrode design the mgc3x30 electrode system is typically a double- layer design with a tx transmit electrode at the bottom layer to shield against device ground and thus, ensure high receive sensitivity. up to five comparably smaller rx electrodes are placed above the tx layer providing the spatial resolution of the gestic system. tx and rx are separated by a thin isolating layer. the rx electrodes are typically arranged in a frame configuration as shown in figure 3-3 . the frame defines the inside sensing area with maximum dimensions of 14x14 centimeters. an optional fifth electrode in the center of the frame may be used to improve the distance measurement and add simple touch functionality. the electrodes? shapes can be designed solid or structured. in addition to the distance and the material between the rx and tx electrodes, the shape structure density also controls the capacitance c r x t x and thus, the sensitivity of the system. figure 3-3: frame shape electrodes note: ideal designs have low c rxtx and c rxg to ensure higher sensitivity of the electrode system. optimal results are achieved with c rxtx and c rxg values being in the same range. south west east center north top layer (lateral rx) top layer (center rx) tx layer ? 2012-2015 microchip technology inc. advance information ds40001667d-page 17 mgc3030/3130 4.0 functional description microchip technology?s mgc3x30 configurable controller uses up to five e-field receiving electrodes. featuring a signal processing unit (spu), a wide range of 3d gesture applications are being pre- processed on the mgc3x30, which allows short development cycles, as no host processing is needed. always-on 3d sensing, even for battery-driven mobile devices, is enabled due to the chip?s low-power design and variety of programmable power modes. a self wake-up mode triggers interrupts to the application host reacting to interaction of a user with the device and supporting the host system in overall power reduction. the mgc3x30 offers one enhanced i 2 c? interface in including sda, scl and ts line (eio0) for data exchange with a host controller. gestic ? sensing electrodes are driven by a low-volt- age signal with a frequency in the range of 100 khz, which allows their electrical conductive structure to be made of any low-cost material. even the reuse of exist- ing conductive structures, such as a display?s ito coat- ing, is feasible, making the mgc3x30 an overall, very cost-effective system solution. figure 4-1 provides an overview of the main building blocks of mgc3x30. these blocks will be described in the following sections. figure 4-1: mgc3x30 co ntroller block diagram host signal processing unit (spu) power management unit (pmu) internal clock tx signal generation external electrodes communication control (i2c) mgc3030/ 3130 controller signal conditioning adc signal conditioning adc signal conditioning adc signal conditioning adc signal conditioning adc flash memory gesture port and interface selection reset block voltage reference (vref) txd rx0 rx1 rx2 rx3 rx4 mclr si0 si1 eio1/is1 eio2 eio3 is2 eio0 internal bus low power wake-up hos t s i g nal p rocess i n g u n it ( s p u ) po w e r m anagement u nit ( ( pmu ) ) i nt e rn al clock tx s ig na l g enerat i on ext e rn a l ele ctr ode s c ommunication con tr ol ( i 2 c ) mgc 303 0 / 3130 c ontroller s i g nal con di t i on i n g a d c si g nal con di t i on ing a d c si g nal con di t i on i n g a d c s i g nal con di t i on i n g a d c s ignal con di t i on i n g a d c fla s h mem ory y g esture port a n d int e rf ace s electio n rese t block v oltage re f erence ( ( vref ) ) txd rx 0 rx 1 rx 2 rx 3 rx 4 mc l r s i 0 s i 1 e i o 1 / i s 1 e i o 2 ei o 3 is 2 e i o 0 i nternal bu s l ow powe r w ake - u p p eio6 eio7 mgc3030/3130 ds40001667d-page 18 advance information ? 2012-2015 microchip technology inc. 4.1 reset block the reset block combines all reset sources. it controls the device system?s reset signal (sysrst). the following is a list of device reset sources: ?mclr : master clear reset pin ? swr: software reset available through gestic library loader ? wdtr: watchdog timer reset a simplified block diagram of the reset block is illustrated in figure 4-2 . figure 4-2: system reset block diagram 4.2 power control and clocks 4.2.1 power management unit (pmu) the device requires a 3.3v 5% supply voltage at v dd . according to figure 4-3 , the used power domains are as follows: ? v dd domain : this domain is powered by v dd = 3.3v 5% (typical v dd = 3.3v). v dd is the external power supply for eio, wake-up logic, wdtr and internal regulators. ? v ddc domain : this domain is powered by v ddc = 1.8v. it is generated by an embedded low- impedance and fast linear voltage regulator. the voltage regulator is working under all conditions (also during deep sleep mode) preserving the mgc3x30 data context. v ddc is the internal power supply voltage for digital blocks, reset block and rc oscillators. an external block capacitor, c efcd , is required on v capd pin. ? v dda domain : this domain is powered by v dda = 3.0v. it is generated by an embedded low- impedance and fast linear voltage regulator. during deep sleep mode, the analog voltage regulator is switched off. v dda is the internal analog power supply voltage for the adcs and the signal conditioning. an external block capacitor, c efca , is required on v capa pin. ? v ddm domain : this domain is powered by v ddm = 3.3v. v ddm is the internal power supply voltage for the internal flash memory. v ddm is directly powered through v dd =3.3v. figure 4-3: powe r scheme block diagram mclr glitch filter deep sleep wdtr software reset (swr) wdt time-out sysrst spu digital peripherals reset block internal osc. vddc domain analog voltage regulator digital voltage regulator flash memory wakeup logic wdtr eio vddm domain v ss2 v dd v ss1 v capa v ss3 adc signal conditioning blocks vdda domain v capd vdd domain v caps ? 2012-2015 microchip technology inc. advance information ds40001667d-page 19 mgc3030/3130 4.2.2 power supervisors during the power-up sequence, the system is kept under reset condition for approximately 200 s (reset delay: t rstdly ) after the v dd =1.5v voltage is reached (1.2v minimum). during this delay, the system reset will remain low and the v dd should reach typically 2v. when the reset delay is elapsed, the system reset is released (high) and the system starts the power-up/ time-out (t pwrt ) sequence. the system start depends on the used v dd voltage. the power-up/time-out period (t pwrt ) after reset takes 36 lso cycles. (see table 4-3 ). the system starts when (see figure 4-4 ): ? power-up/time-out period (t pwrt ) is elapsed ?v dd = 3.3v is already reached before the end of t pwrt timing the power-up sequence begins by increasing the voltage on the v dd pin (from 0v). if the slope of the v dd rise time is faster than 4.5 v/ms, the system starts correctly. if the slope is less than 4.5 v/ms, the mclr pin must be held low, by external circuitry, until a valid operating v dd level is reached. figure 4-4: power supervisors mclr 1.5v v dd time 3.3v t1: t rstdly : reset delay typically 200 s, 120 s minimum t2: t pwrt : power-up time-out 2v t1 t2 mgc3030/3130 ds40001667d-page 20 advance information ? 2012-2015 microchip technology inc. 4.2.3 clocks the mgc3x30 is embedding two internal oscillators, high speed and low speed. the high-speed oscillator (hso) is factory-trimmed, achieving high accuracy. ? high-speed oscillator (hso) : the mgc3x30 is clocked by an internal hso running at 22.5 mhz 10% and consuming very low power. this clock is used to generate the tx signal, to trigger the adc conversions and to run the spu. during deep sleep mode, the hso clock is switched off. ? low-speed oscillator (lso) : this low-speed and ultra-low-power oscillator is typically 32 khz with a tolerance of 10 khz. it is used during power-saving modes. 4.2.4 operation modes mgc3x30 offers three operation modes that allow the user to balance power consumption with device functionality. in all of the modes described in this section, power saving is configured by gestic library messages. 4.2.4.1 processing mode in this mode, all power domains are enabled and the spu is running continuously. all peripheral digital blocks are active. gesture recognition and position tracking require the processing operation mode. 4.2.4.2 deep sleep mode during the deep sleep mode, v ddm and v dda are turned off, and v ddc is still powered to retain the data of the spu. the mode includes the following characteristics: ? the spu is halted ? the high-speed oscillator is shut down ? the low-speed oscillator is running ? the watchdog is switched off ? host interface pins are active for wake-up this leads to the lowest possible power consumption of mgc3x30. the mgc3x30 will resume from deep sleep if one of the following events occurs: ? external interrupt (irq0) or i 2 c0 start bit detection ? on mclr reset the deep sleep mode can be enabled by gestic library messages. 4.2.4.3 self wake-up mode the self wake-up mode is a low-power mode allowing an autonomous wake-up of the mgc3x30 and application host. in this mode, the mgc3x30 is automatically and periodically alternating between sleep and scan phases. the mgc3x30?s fast wake-up, typically below 1 ms, allows to perform scans in very efficient periods and to maximize the sleep phase. the periodic wake-up sequence is triggered by a programmable wake-up timer running at lso frequency and which can be adjusted by the approach detection feature. the mgc3x30 enters the self wake-up mode by a gestic library message or by a non-activity time-out. non-activity means no user detection within the sensing area. the mgc3x30 will resume from self wake-up on one of the following events: ? wake-up timer overflow event ? external interrupt (irq0) or i 2 c0 start bit detection ? on mclr or wdtr ? 2012-2015 microchip technology inc. advance information ds40001667d-page 21 mgc3030/3130 4.2.4.4 mgc3x30 power profile the mgc3x30 power profile is illustrated in figure 4-5 . figure 4-5: mgc3x3 0 power profile mgc3x30 current consumption for the different operation modes are summarized in tab l e 4 - 1 . the self wake-up mode current consumption depends on the number of active channels during self wake-up mode, approach scan and calibration scan repetition period. changing these parameters results in different current consumption values. wake-up irq from host or i2c tm start detected approach detected no user interaction (time-out) t i i ds (1) =9a i peak (1) = 20ma i sw1 (1) = 200a deep sleep self wake-up self wake-up processing i peak : processing mode with 5 rx channels i sw1 : self wake-up with 150 ms approach scan and 10s calibration scan i sw2 : self wake-up with 150 ms approach scan and without calibration scan i ds : deep sleep (1) these are preliminary values @ 3.3v, typical i sw2 (1) = 110a table 4-1: current consumption overview mode current consumption conditions processing mode 20 ma v dd = 3.3v 5 rx channels activated self wake-up mode 110 a v dd = 3.3v no calibration scan 1 rx channel active 200 a v dd = 3.3v calibration scan each 10s 1 rx channel active deep sleep mode 9 a v dd = 3.3v note: in processing mode, there are always five rx channels activated. choosing only four rx channels in aurea does not have an impact on the current consumption during processing mode. mgc3030/3130 ds40001667d-page 22 advance information ? 2012-2015 microchip technology inc. figure 4-6 and figure 4-7 describe the self wake-up mode current consumption according to the approach scan and calibration scan period change. figure 4-6: current cons umption for varying time intervals between approach scans and calibration scans figure 4-7: current cons umption for a fixed time interval between approach scans of 20 ms 0.11 0.77 0.57 1.21 0.20 0.86 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 0 50 100 150 200 current consumption [ma] time interval between approach scans[ms] calibration scan every 1024s calibration scan every 2s calibration scan every 10s 1.21 1.07 0.99 0.95 0.92 0.90 0.88 0.87 0.86 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 0246810 12 current consumption (ma) time interval between calibration scans (s) ? 2012-2015 microchip technology inc. advance information ds40001667d-page 23 mgc3030/3130 4.2.4.5 operation modes summary table 4-2 summarizes the mgc3x30 operation modes. 4.2.5 power-up/down sequence figure 4-8 represents the power-up sequence timings after a reset or deep sleep state. figure 4-8: power-up sequence timings table 4-2: operation modes summary mode entry exit comments processing i 2 c?0/irq0/approach/ mclr /wdtr/sw reset gestic ? library message/non- activity time-out/wdtr - processing mode with up to five electrodes continuously running - full positioning and gesture recognition capabilities self wake-up time-out/gestic ? library message i 2 c?0/irq0/wake-up timer/ mclr /wdtr - scan phase with a configurable number of rx active channels, wake-up timer is used to resume the system - approach detection capability - fast wake-up time - very low-power consumption deep sleep gestic ? library message i 2 c?0/irq0/mclr - spu halted, analog voltage regulator off, watchdog off - no positioning or gesture detection - extreme low-power consumption - needs trigger from application host to switch into self wake-up or processing mode lso spu clk spu halted spu running power-up processing operation hso enable vref enable reset or deep sleep t pwrt t hso t spuclk mgc3030/3130 ds40001667d-page 24 advance information ? 2012-2015 microchip technology inc. power-up phases ? reset or deep sleep: the system is kept in reset or is in deep sleep mode ? power-up: phase when the system starts up after reset/deep sleep has been released ? processing operation: processing mode is started ? power-up time-out signal references ? lso: low-speed oscillator clock ? hso: high-speed oscillator clock ?v ref enable: voltage reference enable signal ? hso enable: high-speed oscillator enable signal figure 4-9 illustrates the power-down sequence timings. figure 4-9: power-down sequence timings table 4-3: power-up time-out (t pwrt ) signal symbol delay in lso cycles after reset after deep sleep v ref enable t vref 00 hso enable t hso 22 spu clk t spuclk 30 8 power-up time-out t pwrt 36 10 lso spu clk spu halted spu running hso enable vref enable processing operation power down request deep sleep lso s p u c l k s pu halte d s pu runni ng h so en abl e vref e n able p rocess i n g o p erat i o n power d ow n request d ee p s l ee p ? 2012-2015 microchip technology inc. advance information ds40001667d-page 25 mgc3030/3130 power-down phases ? processing operation: processing mode is activated ? request: request to enter deep sleep mode ? power-down: power-down state (all analog signals are down) ? deep sleep: deep sleep mode has been entered signal references ? lso: low-speed oscillator clock ? hso: high-speed oscillator clock ?v ref enable: voltage reference enable signal ? hso enable: high-speed oscillator enable signal 4.3 transmit signal generation the tx signal generation block provides a bandwidth limited square wave signal for the transmit electrode. frequency hopping adjusts automatically the tx carrier frequency in the range of 44-115 khz, depending on the environmental noise conditions. gestic library automatically selects the lowest noise working frequency in case the sensor signal is compromised. frequencies can be enabled/disabled via the gestic library. 4.4 receive (rx) channels there are five identical rx channels that can be used for five respective receive electrodes. four receive electrodes are required for position tracking and gesture recognition. a fifth electrode can be used for touch detection and to improve distance measurement. each channel has its own analog signal conditioning stage, followed by a dedicated adc. for specific features such as approach detection, individual rx channels can be activated or deactivated via the gestic library. according to the electrode characteristics, the channels have to be parameterized. the signal conditioning block contains analog filtering and amplification as shown in figure 4-10 . figure 4-10: signal conditioning block for individual electrode characteristics, the rx channels can be configured as follows: ? signal matching : the received signal is sampled at a sampling rate, equal to twice the tx frequency providing a high and low adc sample. the signal matching block adjusts the received signal towards the same value of high and low adc samples. the offset can be adjusted accordingly. ? the matched signal output is amplified using a programmable gain amplifier to achieve a better sensitivity. 4.5 analog-to-digital converter (adc) as outlined in section 4.4 ?receive (rx) channels? , each rx channel features a dedicated adc with a trigger derived from the internal clock. adc samples are synchronous with twice the tx transmit frequency. 4.6 signal processing unit (spu) the mgc3x30 features a signal processing unit (spu) to control the hardware blocks and process the advanced dsp algorithms included in the gestic library. it provides filtered sensor data, continuous position information and recognized gestures to the application host. the host combines the information and controls its application. 4.7 parameters storage the mgc3x30 provides an embedded 32 kbytes flash memory which is dedicated for the gestic library and storage of the individual configuration parameters. these parameters have to be set according to the individual electrode design and application. the gestic library and parameters are loaded into mgc3x30 with the provided software tools or, alternatively, via gestic library messages by the application host. for more details on the mgc3x30 tools, please refer to section 7.0 ?development support? . rx gain v dda /2 signal conditioning block rx input signal matching buffer mgc3030/3130 ds40001667d-page 26 advance information ? 2012-2015 microchip technology inc. 5.0 interface description the mgc3x30 supports an i 2 c? interface with slave mode and the gesture port (five configurable eois). 5.1 interface selection the mgc3x30 interface selection pin, is2, is used to select the i 2 c slave address. there are two different addresses. 5.2 extended input output (eio) the mgc3x30 provides input/output pins with extended features. these pins are controlled by gestic ? library and listed in table 5-2 . 5.3 interrupt requests mgc3x30 irq0 and irq1 interrupt lines are used by the host to wake-up the mgc3x30 from deep sleep and self wake-up modes. if a wake-up event is detected on irq0 or irq1 lines, the mgc3x30 switches to the processing mode. 5.4 gesture port the mgc3x30 provides five output pins which can be used to output the colibri suite features events. these pins are controlled by gestic library to signal that an event occurred. the host does not need to monitor the i 2 c bus to get gestic library events, but only has to monitor the gesture port pins. this feature is used in parallel to i 2 c communication. the colibri suite gesture port feature mapping is illustrated in figure 5-1 . table 5-1: mgc3x30 interface selection pins is2 is1 mode (address) 00 i 2 c?0 slave address 1 (0x42) 10 i 2 c?0 slave address 2 (0x43) table 5-2: mgc3x30 extended ios functions pin multiplexed functions eio0 ts eio1 is1/gesture port eio2 irq0/gesture port eio3 irq1/sync/gesture port eio4 sda0 eio5 scl0 eio6 gesture port eio7 gesture port ? 2012-2015 microchip technology inc. advance information ds40001667d-page 27 mgc3030/3130 figure 5-1: gesture port mapping the colibri suite can generate up to twelve event outputs which can be mapped to any eio (1, 2, 3, 6 or 7). it is also possible to map more than one event output by one eio. eventoutput1..12 to eios gesture selection [0:2] electrode selection [0:2] gesture wake-up after approach detection action selection [0:2] eventinput selection [0:1] sensor touch flick west -> east flick east -> west flick north -> south flick south -> north circle clockwise circle counter-clockwise permanent high permanent low sensor touch selection [0:1] touch tap double tap colibri suite events mgc3x30 pins events mapping high active low active toggle pulse (100ms) eio1,2,3,6,7 eventoutput 1 eventoutput 12 ... airwheel clockwise airwheel counter-clockwise mgc3030/3130 ds40001667d-page 28 advance information ? 2012-2015 microchip technology inc. table 5-3: colibri suite events gesture port mapping parameter description gesture selection selects the gestures which will be used as event. gesture selection can be: ? flick west/east ? flick east/west ? flick north/south ? flick south/north ?circle clockwise ? circle counterclockwise ? airwheel clockwise ? airwheel counterclockwise sensor touch selection selects the sensor touch which will be used as event. sensor touch selection can be: ?touch ?tap ? double tap electrode selection selects the electrode which will be used for sensor touch. electrode selection can be: ?west ?east ?north ?south ?center event input selection selects the event which will trigger an event output on the eios. event input selection can be: ?gesture ? sensor touch ? wake-up after approach detection action selection selects the signal format which will be output on the eios. see figure 5-2 and ta b l e 5 - 4 . action selection can be: ? permanent high ? permanent low ? toggle ?pulse ? high active ? low active ? 2012-2015 microchip technology inc. advance information ds40001667d-page 29 mgc3030/3130 figure 5-2: gest ure port action permanent high toggle event event event event pulse (100ms) event permanent low event high active touch detected touch released low active touch detected touch released tale 5-4: gesture port mapping eent action peranent high peranent low toggle pulse high actie low actie gesture x x x x touch xx x x single tap x x x x double tap x x x x approach xx airwheel x mgc3030/3130 ds40001667d-page 30 advance information ? 2012-2015 microchip technology inc. 5.5 communication interfaces 5.5.1 i 2 c? the mgc3x30 offer an i 2 c? interface for communicating with an application host. the i 2 c0 port offers: ? slave mode ? up to 400 khz ? 7-bit addressing mode ? hardware state machine for basic protocol handling ? support for repeated start and clock stretching (byte mode) ? no multi-master support i 2 c? hardware interface a summary of the hardware interface pins is shown below in tab l e 5 - 5 . ?scl pin - the scl (serial clock) pin is electrically open-drain and requires a pull-up resistor of typically 1.8 k ? (for a maximum bus load capacitance of 200 pf), from scl to v dd . - scl idle state is high. ?sda pin - the sda (serial data) pin is electrically open-drain and requires a pull-up resistor of typically 1.8 k ? (for a maximum bus load capacitance of 200 pf), from sda to v dd . - sda idle state is high. - master write data is latched in on scl rising edges. - master read data is latched out on scl falling edges to ensure it is valid during the subsequent scl high time. i 2 c? addressing : the mgc3x30 device id 7-bit address is: 0x42 ( 0b1000010 ) or 0x43 ( 0b1000011 ) depending on the interface selection pin configuration (is2+is1). please refer to table 5-6 . i 2 c? master read bit timin g master read is to receive position data, gesture reports and command responses from the mgc3x30. the timing diagram is shown in figure 5-4 . ? address bits are latched into the mgc3x30 on the rising edges of scl. ? data bits are latched out of the mgc3x30 on the rising edges of scl. ? ack bit: - mgc3x30 presents the ack bit on the ninth clock for address acknowledgment -i 2 c master presents the ack bit on the ninth clock for data acknowledgment ?the i 2 c master must monitor the scl pin prior to asserting another clock pulse, as the mgc3x30 may be holding off the i 2 c master by stretching the clock. i 2 c? communication steps 1. scl and sda lines are idle high. 2. i 2 c master presents start bit to the mgc3x30 by taking sda high-to-low, followed by taking scl high-to-low. 3. i 2 c master presents 7-bit address, followed by a r/w = 1 (read mode) bit to the mgc3x30 on sda, at the rising edge of eight master clock (scl) cycles. 4. mgc3x30 compares the received address to its device id. if they match, the mgc3x30 acknowledges (ack) the master sent address by presenting a low on sda, followed by a low- high-low on scl. 5. i 2 c master monitors scl, as the mgc3x30 may be clock stretching, holding scl low to indicate that the i 2 c master should wait. table 5-5: i 2 c? pin description mgc3x30 pin multiplexed functions scl serial clock to master i 2 c? sda serial data to master i 2 c? table 5-6: i 2 c? device id address device id address, 7-bit a6 a5 a4 a3 a2 a1 a0 100001 is2 table 5-7: i 2 c? device write id address (0x84 or 0x86) i 2 c? device write id address a7 a6 a5 a4 a3 a2 a1 a0 100001 is2 0 table 5-8: i 2 c? device read id address (0x85 or 0x87) i 2 c? device read id address a7 a6 a5 a4 a3 a2 a1 a0 100001 is2 1 ? 2012-2015 microchip technology inc. advance information ds40001667d-page 31 mgc3030/3130 6. i 2 c master receives eight data bits (msb first) presented on sda by the mgc3x30, at eight sequential i 2 c master clock (scl) cycles. the data is latched out on scl falling edges to ensure it is valid during the subsequent scl high time. 7. if data transfer is not complete, then: -i 2 c master acknowledges (ack) reception of the eight data bits by presenting a low on sda, followed by a low-high-low on scl. - go to step 5. 8. if data transfer is complete, then: -i 2 c master acknowledges (ack) reception of the eight data bits and a completed data transfer by presenting a high on sda, followed by a low-high-low on scl. i 2 c? master write bit timin g i 2 c master write is to send supported commands to the mgc3x30. the timing diagram is shown in figure 5-5 . ? address bits are latched into the mgc3x30 on the rising edges of scl. ? data bits are latched into the mgc3x30 on the rising edges of scl. ? ack bit: - mgc3x30 presents the ack bit on the ninth clock for address acknowledgment -i 2 c master presents the ack bit on the ninth clock for data acknowledgment ? the master must monitor the scl pin prior to asserting another clock pulse, as the mgc3x30 may be holding off the master by stretching the clock. i 2 c? communication steps 1. scl and sda lines are idle high. 2. i 2 c master presents start bit to the mgc3x30 by taking sda high-to-low, followed by taking scl high-to-low. 3. i 2 c master presents 7-bit address, followed by a r/w = 0 (write mode) bit to the mgc3x30 on sda, at the rising edge of eight master clock (scl) cycles. 4. mgc3x30 compares the received address to its device id. if they match, the mgc3x30 acknowledges (ack) the i 2 c master sent address by presenting a low on sda, followed by a low-high-low on scl. 5. i 2 c master monitors scl, as the mgc3x30 may be clock stretching, holding scl low to indicate the i 2 c master should wait. 6. i 2 c master presents eight data bits (msb first) to the mgc3x30 on sda, at the rising edge of eight master clock (scl) cycles. 7. mgc3x30 acknowledges (ack) receipt of the eight data bits by presenting a low on sda, followed by a low-high-low on scl. 8. if data transfer is not complete, then go to step 5. 9. master presents a stop bit to the mgc3x30 by taking scl low-high, followed by taking sda low-to-high. 5.5.2 transfer status line mgc3x30 requires a dedicated transfer status line (ts) which features a data transfer status function. it is used by both i 2 c master and slave to control data flow. the ts (transfer status) line is electrically open-drain and requires a pull-up resistor of typically 10 k ? , from ts to v dd . ts idle state is high. the mgc3x30 (i 2 c slave) uses this line to inform the host controller (i 2 c master) that there is data available which can be transferred. the host controller uses the ts line to indicate that data is being transferred and prevents mgc3x30 from updating its data buffer. table 5-9 shows how the ts line is used in the different states of communication. mgc3030/3130 ds40001667d-page 32 advance information ? 2012-2015 microchip technology inc. mgc3x30 can update the i 2 c buffer only when the ts is released by both chips and a data transfer can only be started when mgc3x30 pulls the ts low. this procedure secures that: ? the host is always informed when new sensor data is available ? buffer updates in mgc3x30 are always completed before data is sent to the i 2 c bus figure 5-3 shows the complete communication protocol. figure 5-3: mgc3x30 communication protocol in addition to the standard i 2 c interface, the communication between mgc3x30 and the host controller requires a proper handling of the transfer status. table 5-9: usage of transfer status line mgc3x30 host controller ts line status released (h) released (h) high host finished reading data (transfer end). no more data to be transferred to the host. mgc3x30 is allowed to update the data buffer. asserted (l) released (h) low data from mgc3x30 is available to be sent, but the host has not yet started reading. if the host is busy and did not start reading before the next data update (5 ms), the mgc3x30 will assert the ts line high while updating the data buffer. asserted (l) asserted (l) low host starts reading. mgc3x30 data buffer will not be updated until the end of transfer (host releases ts high). released (h) asserted (l) low mgc3x30 is ready to update the data buffer, but the host is still reading the previous data. mgc3x30 is allowed to update the data only when the host releases the ts high. transfer status (ts) i 2 c tm bus MGC3130 related transfer MGC3130 related transfer ts line pulled low by master when transfer is started ts line released by master and MGC3130 when transfer is finished ts line pulled by MGC3130 to request a data transfer MGC3130 buffer can be updated non MGC3130 related transfer or bus idle ts line pulled low by master when transfer is started MGC3130 buffer can be updated ts line pulled by MGC3130 to request a data transfer ts line released by master and MGC3130 when transfer is finished note 1: the stop condition after an i 2 c? data transmission is generated by the host controller (i 2 c? master) after the data transfer is completed. thus, it is recommended to verify the amount of bytes to be read in the message header (size field). 2: transfer status is only needed for data transfer from mgc3x30 to the host controller. writing to mgc3x30 does not require the additional ts signal. ? 2012-2015 microchip technology inc. advance information ds40001667d-page 33 mgc3030/3130 figure 5-4: i 2 c? master read bit timing diagram figure 5-5: i 2 c? master write bit timing diagram 3 12 456789 3 12 456789 3 12 456789 a7 a6 a5 a4 a3 a2 a1 1 d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 address r/w ack ack ack data data address bits latched in data bits valid out data bits valid out scl may be stretched scl may be stretched s p start bit stop bit sda scl 3 12 456789 3 12 456789 3 12 456789 a7 a6 a5 a4 a3 a2 a1 0 d7 d6 d5 d4 d3 d2 d1 d0 d7 d6 d5 d4 d3 d2 d1 d0 address r/w ack ack ack data data address bits latched in data bits valid out data bits valid out scl may be stretched scl may be stretched s p start bit stop bit sda scl mgc3030/3130 ds40001667d-page 34 advance information ? 2012-2015 microchip technology inc. 6.0 application architecture the standard mgc3x30 implementation is a single- zone design. this configuration is based on one mgc3x30 connected to an application host via i 2 c? with mgc3x30 being slave and application host being master. a total of three lines are needed for the i 2 c interface (see figure 6-1 ). data reporting and flow-control scenarios are described below for i 2 c communication: ?sda ?scl ? eio0 (transfer status line) is toggled indicating that new data is available and checking whether the host has already started data reading or not. figure 6-1: application circuitry 6.1 esd considerations the mgc3x30 provides electrostatic discharge (esd) voltage protection up to 2 kv (hbm). additional esd countermeasures may be implemented individually to meet application-specific requirements. 6.2 power noise considerations mgc3x30 filtering capacitors are included in the reference design schematic (please refer to figure 6-2 ). 6.3 irradiated high-frequency noise in order to suppress irradiated high-frequency signals, the five rx channels of the chip are connected to the electrodes via serial 10 k ?? resistors, as close as possible to mgc3x30. the 10 k ? resistor and the mgc3x30 input capacitance are building a low-pass filter with a corner frequency of 3 mhz. an additional ferrite bead is recommended to suppress the coupling of rf noise to the tx channel (e.g., 600 ? at 100 mhz). an additional ferrite bead is recommended to suppress the coupling of rf noise to the tx channel (e.g., 600 ? at 100 mhz). 6.4 reference schematic (3.3v ?? v dd ? 3.465v) the reference application schematic for the mgc3x30 is depicted below in figure 6-2 . mgc3x30 host controller sda0 scl0 eio0 mclr sda scl gpio gpio sda scl ts vcc 1.8k 10k 1.8k mclr 10k x ? 2012-2015 microchip technology inc. advance information ds40001667d-page 35 mgc3030/3130 figure 6-2: reference schematic for mgc3x30 mgc3x30 vdd vss1 vss3 vdd 100 nf 4.7 f 4.7 f is2 mclr si0 si1 eio0 sda scl gpio/irq host vdd 1.8 k o 1.8 k o reset 10 k o vdd txd rx0 rx1 rx2 rx3 rx4 vdd vinds vcaps vcapa vcapd exp 1 vss1 nc nc nc vss2 eio7 eio1 eio6 nc north electrode south electrode east electrode westelectrode center electrode is1 is2 r9 (10 k o ) c1 c3 c2 r1 r2 r3 10 k o 10 k o 10 k o 10 k o is1 is2 vdd vdd r6 r8 r5 (n.p) r7 (n.p) r10 (10 k o ) r11 (10 k o ) r12 (10 k o ) r13 (10 k o ) vdd 10 k o r4 eio2 eio3 n.p: not populated gesture port eio7 eio1 eio6 eio2 eio3 interface selection 1 exposed pad on qfn housing only (MGC3130) note : r5 and r7 are not populated mgc3030/3130 ds40001667d-page 36 advance information ? 2012-2015 microchip technology inc. 6.5 layout recommendation this section will provide a brief description of layout hints for a proper system design. the pcb layout requirements for mgc3x30 follow the general rules for a mixed signal design. in addition, there are certain requirements to be considered for the sensor signals and electrode feeding lines. the chip should be placed as close as possible to the electrodes to keep their feeding lines as short as possible. furthermore, it is recommended to keep mgc3x30 away from electrical and thermal sources within the system. analog and digital signals should be separated from each other during pcb layout in order to minimize crosstalk. the individual electrode feeding lines should be kept as far as possible apart from each other. v dd lines should be routed as wide as possible. mgc3x30 requires a proper ground connection on all v ss pins, including the exposed pad (pin 29). table 6-1: bill of materials label qty value description r1, r4, r5, r6, r7, r8 3 10 k ? res thick film 10 k ???? c1 1 100 nf capacitor ? ceramic, 0.1 f, 10%, 6.3v c2 1 4.7 f capacitor ? ceramic, 4.7 f, 10%, 6.3v c3 1 4.7 f capacitor ? ceramic, 4.7 f, 10%, 6.3v r2, r3 2 1.8 k ? res thick film 1.8 k ???? r9, r10, r11, r12, r13 5 10 k ? res thick film 10 k ???? ? 2012-2015 microchip technology inc. advance information ds40001667d-page 37 mgc3030/3130 7.0 development support microchip provides software and hardware development tools for the mgc3x30: ? software: - aurea software package - mgc3030/3130 software development kit - mgc3030/3130 host reference code ?schematics: - gestic ? hardware references ? evaluation and development kits: - MGC3130 hillstar development kit (dm160218) - mgc3030 woodstar development kit (dm160226) 7.1 aurea software package the aurea evaluation software demonstrates microchip?s gestic technology and its features and applications. aurea provides visualization of the mgc3x30 generated data and access to gestic library controls and configuration parameters. that contains the following: ? visualization of hand position and user gestures ? visualization of sensor data ? real-time control of sensor features ? mgc3x30 gestic library update ? analog front end parameterization ? colibri parameterization ? electrode capacitance measurement ? logging of sensor values and storage in a log file 7.2 mgc3030/3130 software development kit microchip provides a standard c reference code with a software development kit. the code will support developers to integrate the mgc3x30 solution into the target application. 7.3 mgc3030/3130 pic18 host reference code microchip provides a reference code for pic18f14k50, including gestic library i 2 c? code and basic message decoding. 7.4 gestic hardware references the gestic hardware references package contains the pcb layouts (gerber files) for the mgc development kits (hillstar and woodstar) and a collection of electrode reference designs fitting both kits. in addition, the package includes designs, parameter files and host code of various demonstrators which represent complete systems for embedded or pc-based applications. new designs will be added to the package once they are available. the gestic hardware reference package can be downloaded from microchip?s web site via www.microchip.com/ gesticresources . mgc3030/3130 ds40001667d-page 38 advance information ? 2012-2015 microchip technology inc. 7.5 evaluation and demonstration kits a variety of demonstration, development and evaluation boards allow quick application development on fully-functional systems. the demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various gestic MGC3130 applications. the first development board is the hillstar development kit. it is designed to support an easy integration of microchip?s MGC3130 3d tracking and gesture controller into the customer?s applications. it provides MGC3130 system hardware modules and a set of electrode reference designs which can be used by customers to develop their own gestic system. aurea visualization and control software provides full support of the hillstar development kit and an easy parameterization of the customer?s applications. the woodstar development kit is a development platform to support an easy integration of microchip's mgc3030. it provides mgc3030 system hardware modules and a set of electrode reference designs which can be used by customers to develop their own gestic system. aurea visualization and control software provides full support of the woodstar development kit and an easy parameterization of the customer?s applications. woodstar and hillstar offer the same interface (hardware as well as software). the electrodes, the i 2 c-to-usb bridge as well as aurea software can both be used for hillstar and woodstar development kit. for the complete list of demonstration, development and evaluation kits, please refer to the microchip web site ( http://www.microchip.com/gesticgettingstarted ). 7.6 gestic library update the mgc3x30 devices are manufactured with a built- in library loader (bootloader) only. there will be no gestic library on it. the library loader contains the i 2 c interface and basic device programming operations so that a gestic library can be uploaded to the mgc3x30 flash memory. the latest gestic library can be found in the package 'aurea software package? which can be downloaded from the gestic homepage. there are several ways to upload the library to the mgc3x30: 1. upload via aurea visualization and control software: the aurea graphical user interface (gui) can be used to perform the update. for this option, usb connectivity to a pc with aurea graphical user interface (gui) will be needed (e.g., using i 2 c?-to-usb bridge of hillstar development kit or woodstar development kit). please refer to ?aurea graphical user interface? (ds40001681), MGC3130 hillstar development kit user?s guide (ds40001721) and mgc3030 woodstar development kit user?s guide (ds40001777) for additional information. 2. upload via embedded host controller: this option will require an embedded host controller which performs the upload using the gestic i 2 c com- mands. the gestic library is hereby stored in the host?s memory. please refer to ?mgc3030/ 3130 gestic library interface description? (ds40001718) for more details. 3. microchip programming center pre-pro- grammed mgc3x30 parts can be ordered through microchip programming center. please go to www.microchipdirect.com/programming/ for further information. 4. quick time programming (qtp): for larger quantities of pre-programmed parts with unique part number, please see your local microchip sales office. ? 2012-2015 microchip technology inc. advance information ds40001667d-page 39 mgc3030/3130 8.0 electrical specifications 8.1 absolute maximum ratings (?) ambient temperature under bias................................................................................................. ........ -20c to +85c storage temperature ............................................................................................................ ............ -55c to +125c voltage on pins with respect to v ss on v dd pin ........................................................................................................................... . -0.3v to +3.465v on all other pins .............................................................................................................. -0.3v to (v dd + 0.3v) ? notice: stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. ? notice: this device is sensitive to esd damage and must be handled appropriately. failure to properly handle and protect the device in an application may cause partial to complete failure of the device. ? notice: -20c temperature operation is characterized but not tested. mgc3030/3130 ds40001667d-page 40 advance information ? 2012-2015 microchip technology inc. 9.0 packaging information 9.1 package marking information 28-lead qfn (5x5x0.9 mm) example pin 1 pin 1 MGC3130 mq 1318017 3 e 28-lead ssop (5.30 mm) example mgc3030 ss 1318017 3 e legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec ? designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e ? 2012-2015 microchip technology inc. advance information ds40001667d-page 41 mgc3030/3130 9.2 package details the following sections give the technical details of the packages. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging mgc3030/3130 ds40001667d-page 42 advance information ? 2012-2015 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging ? 2012-2015 microchip technology inc. advance information ds40001667d-page 43 mgc3030/3130 28-lead plastic quad flat, no lead package (mq) ? 5x5 mm body [qfn] land pattern with 0.55 mm contact length note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging microchip technology drawing c04-2140a mgc3030/3130 ds40001667d-page 44 advance information ? 2012-2015 microchip technology inc. ! " # $ % !" # $% &" ' ()"&'"!&) & #*&& & # ' !! #+#&"# '#% ! &"!! #% ! &"!!! & $ # '' !# , ' ! #& +- . /01 / !' ! & $ & " !**&"&& ! +21 % ' !("!" *&"&& (%%' & " ! ! $ % 2& '!&" & 3 # * !( ! ! & 3 % & & # & && 144*** ' '4 3 5&! 66 ++ ' !6'&! 7 78 9 7"') % ! 7 : & ./0 8 ; & < < # # 3 3 !! . . :. & #%% . < < 8 =#& + : : # # 3 =#& + . . , . 8 6 & . 2&6 & 6 .. . . 2& & 6 .+2 6 #3 !! < . 2& > > :> 6 #=#& ) < ,: l l1 c a2 a1 a e e1 d n 1 2 note 1 b e * 0 ,/ ? 2012-2015 microchip technology inc. advance information ds40001667d-page 45 mgc3030/3130 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging mgc3030/3130 ds40001667d-page 46 advance information ? 2012-2015 microchip technology inc. appendix a: data sheet revision history revision a (11/2012) initial release of this data sheet. revision b (08/2013) updated the power features section; updated table 1; updated section 2, feature description; updated sec- tion 4.2.2; updated figures 4-4, 4-5 and 4-6; updated equation 4-1, table 4-1; updated figures 4-9, 5-1 and 5-2; updated section 6, interface description, updated figures 7-1 and 7-2; added section 7-3, irradiated high-frequency noise; updated tables 7-1 and 7-2; updated section 8, development support; updated the packaging information section; other minor correc- tions. revision c (11/2013) updated figure 1 and table 1; updated section 2, feature description; updated section 4, functional description; updated section 6, interface description; updated figure 7-1 and 7-2; updated section 8, development support; other minor corrections. revision d (1/2015) updated packaging marking section; updated 6.6.1, 5.1, 4.5, 8.5, 8.6, 4.2 sections; updated figures 2-2, 4-9, 4-10, 6-1, 6-2, 7-1; other minor corrections. ? 2012-2015 microchip technology inc. advance information ds40001667d-page 47 mgc3030/3130 the microchip web site microchip provides online support via our web site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faq), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives customer change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com . under ?support?, click on ?customer change notification? and follow the registration instructions. customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://www.microchip.com/support mgc3030/3130 ds40001667d-page 48 advance information ? 2012-2015 microchip technology inc. product identification system to order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office . part no. x /xx xxx pattern package temperature range device device: mgc3030,MGC3130 tape and reel option: blank = standard packaging (tube or tray) t = tape and reel (1) temperature range: i= -40 ? c to +85 ? c (industrial) package: (2) mq = qfn ss = ssop pattern: qtp, sqtp, code or special requirements (blank otherwise) examples: a) MGC3130 - i/mq industrial temperature, qfn package note 1: tape and reel identifier only appears in the catalog part number description. this identifier is used for ordering purposes and is not printed on the device package. check with your microchip sales office for package availability with the tape and reel option. 2: for other small form-factor package availability and marking information, please visit www.microchip.com/packaging or contact your local sales office. [x] (1) tape and reel option - ? 2012-2015 microchip technology inc. advance information ds40001667d-page 49 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, flexpwr, jukeblox, k ee l oq , k ee l oq logo, kleer, lancheck, medialb, most, most logo, mplab, optolyzer, pic, picstart, pic 32 logo, righttouch, spynic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. the embedded control solutions company and mtouch are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, ecan, in-circuit serial programming, icsp, inter-chip connectivity, kleernet, kleernet logo, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, multitrak, netdetach, omniscient code generation, picdem, picdem.net, pickit, pictail, righttouch logo, real ice, sqi, serial quad i/o, total endurance, tsharc, usbcheck, varisense, viewspan, wiperlock, wireless dna, and zena are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of mi crochip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. gestic is a registered trademarks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2012-2015, microchip technology incorporated, printed in the u.s.a., all rights reserved. isbn: 978-1-63276-969-5 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outsi de the operating specifications c ontained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == ds40001667d-page 50 advance information ? 2012-2015 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 austin, tx tel: 512-257-3370 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit novi, mi tel: 248-848-4000 houston, tx tel: 281-894-5983 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 new york, ny tel: 631-435-6000 san jose, ca tel: 408-735-9110 canada - toronto tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2943-5100 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-8792-8115 fax: 86-571-8792-8116 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-3019-1500 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7830 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - dusseldorf tel: 49-2129-3766400 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 germany - pforzheim tel: 49-7231-424750 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 italy - venice tel: 39-049-7625286 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 poland - warsaw tel: 48-22-3325737 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 sweden - stockholm tel: 46-8-5090-4654 uk - wokingham tel: 44-118-921-5800 fax: 44-118-921-5820 worldwide sales and service 03/25/14 |
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