hi-sincerity microelectronics corp. spec. no. : he6109 issued date : 1997.09.05 revised date : 2001.04.27 page no. : 1/4 HA8550S hsmc product specification HA8550S pnp epitaxial planar transistor description the HA8550S is designed for general purpose amplifier applications. features ? high dc current gain (hfe=100~500 at ic=150ma) ? complementary to ha8050s absolute maximum ratings ? maximum temperatures storage temperature ............................................................................................ -55 ~ +150 c junction temperature ................................................................................... +150 c maximum ? maximum power dissipation total power dissipation (ta=25 c) ............................................................................... 625 mw ? maximum voltages and currents (ta=25 c) vcbo collector to base voltage ....................................................................................... -25 v vceo collector to emitter voltage ..................................................................................... -20 v vebo emitter to base voltage ............................................................................................ -5 v ic collector current ...................................................................................................... -700 ma characteristics (ta=25 c) symbol min. typ. max. unit test conditions bvcbo -25 - - v ic=-10ua bvceo -20 - - v ic=-1ma bvebo -5 - - v ie=-10ua icbo - - -1 ua vcb=-20v *vce(sat) - - -0.5 v ic=-0.5a, ib=-50ma vbe(on) - - -1 v vce=-1v, ic=-150ma *hfe1 100 - 500 vce=-1v, ic=-150ma *hfe2 - 170 - vce=-1v, ic=-500ma ft 150 - - mhz vce=-10v, ic=-20ma, f=100mhz cob - - 10 pf vcb=-10v, f=1mhz *pulse test : pulse width 380us, duty cycle 2% classification on hfe rank c d e hfe1 100~200 150~300 250-500
hi-sincerity microelectronics corp. spec. no. : he6109 issued date : 1997.09.05 revised date : 2001.04.27 page no. : 2/4 HA8550S hsmc product specification characteristics curve current gain & collector current 1 10 100 1000 0.001 0.01 0.1 1 10 100 1000 collector current (ma) hfe v ce =1v saturation voltage & collector current 0.01 0.1 1 0.01 0.1 1 10 100 1000 collector current (ma) saturation voltage (v) v ce(sat) @ i c =10i b on voltage & collector current 0.1 1 0.01 0.1 1 10 100 1000 collector current (ma) on voltage (v) v be(on) @ v ce =1v cutoff frequency & collector current 1 10 100 1000 1 10 100 1000 collector current (ma) cutoff frequency (mhz) v ce =10v capacitance & reverse-biased voltage 1 10 100 0.1 1 10 100 reverse-biased voltage (v) capacitance (pf) cob safe operating area 1 10 100 1000 10000 1 10 100 forward voltage (v) collector current-i c (ma) pt=1ms pt=100ms pt=1s
hi-sincerity microelectronics corp. spec. no. : he6109 issued date : 1997.09.05 revised date : 2001.04.27 page no. : 3/4 HA8550S hsmc product specification pd-ta 0 100 200 300 400 500 600 700 0 20 40 60 80 100 120 140 160 ambient temperature-ta( o c) power dissipation-pd(mw)
hi-sincerity microelectronics corp. spec. no. : he6109 issued date : 1997.09.05 revised date : 2001.04.27 page no. : 4/4 HA8550S hsmc product specification to-92 dimension *:typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1704 0.1902 4.33 4.83 g 0.0142 0.0220 0.36 0.56 b 0.1704 0.1902 4.33 4.83 h - *0.1000 - *2.54 c 0.5000 - 12.70 - i - *0.0500 - *1.27 d 0.0142 0.0220 0.36 0.56 1 - *5 - *5 e - *0.0500 - *1.27 2 - *2 - *2 f 0.1323 0.1480 3.36 3.76 3 - *2 - *2 notes : 1.dimension and tolerance based on our spec. dated apr. 25,1996. 2.controlling dimension : millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material : ? lead : 42 alloy ; solder plating ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory : ? head office (hi-sincerity microelectronics corp.) : 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel : 886-2-25212056 fax : 886-2-25632712, 25368454 ? factory 1 : no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel : 886-3-5983621~5 fax : 886-3-5982931 3 1 a d b c i 1 e f 2 3 g h 2 style : pin 1.emitter 2.base 3.collector 3-lead to-92 plastic package hsmc packa g e code : a marking : hsmc logo part number date code product series rank laser mark hsmc logo part number product series ink mark
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