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? 2015 microchip technology inc. p age 1 p reliminary edition BM20/ bm 23 bluetoot h ? 4.1 stereo audio module feature s : ? complete, full y certified, embedded 2.4 g h z bluetooth? version 4.1 module ? bluetooth c l ass i c ( b d r/e d r ) ? bluetooth sig c e rtifi ed ? onboard embe d ded bluetooth st a c k ? transparent uar t mode for se a m l ess s e ri al data over uar t int e rface ? easy t o configure wit h windows gui or direc t by mcu ? firmware can be field upgradab l e via uart ? compact surfa c e mount module: 29 x 15 x 2 .5 mm 3 ? ca s t e llat ed surf ac e mount pads fo r easy and r e liable host pc b mounting ? environmentally friendly, roh s compliant ? p e rf e c t for po r tabl e battery ope r ated devices ? internal battery r egu lato r circ u i try ? world w ide regulatory c e rti fi c a t ions ? audio - in / out bm23 support digital audio i 2 s format. BM20 support analog audio output. operational: ? operating voltage: 3.0v t o 4.2 v ? temperature range: \ 2 0c t o 70c ? simple, uar t interface ? integrated cry s t a l , internal volt a ge regulator , and matching circ u i t r y ? multipl e i/o pi n s for contro l and status rf/ana l og: ? frequency: 2.4 0 2 t o 2.480 g h z ? r e c e iv e sensitivity: \ 91 dbm ( 2mbps edr ) ? pow er output: class 2 / +4 dbm max . ? connection distance: >10m (free space and no interference) audio processor ? support 64 kb/s a - law or ? - law pcm format, or cvsd (continuous variable slope delta modulation) for sco channel operation. ? noise suppression ? echo suppression ? sbc and optional aac decoding ? packet loss concealment ? build - in four languages (chinese/ english/ spanish/ french) voice prompts and 20 events for each one (this function can be set up in is20xxs_ ui tool . ) ? support scms - t audio codec ? 20 bit dac and 16 b it adc codec ? 9 8 db snr dac playback peripherals ? built - in lithium - ion battery charger (up to 350ma) ? integrate 3v, 1.8v c onfigurable switching regulator and ldo ? built - in adc for battery monitor and voltage sense. ? a line - in port for external audio input ? t wo led drivers flexible hci interface ? high speed hci - uart (universal asynchronous receiver transmitter) interface ( up to 921600bps ) mac/baseband/hi g her l a yer: ? secure aes128 e n cry p tion ? bluetooth profil es - hfp v1.6 - hsp v1.1 - a2dp v1.2 - avrcp v1.5 - spp v1.0 - pbap v1.0 antenna: ? printed antenna compliance: ? bluetooth sig qd i d : 58996 ? module certified for the united states (fcc) and canada (ic), european economic area (ce), korea (lta), taiwan (ncc) and japan (mic)
? 2015 microchip technology inc. p age 2 p reliminary edition figure 1: general descrip t i o n: stereo module is a fully - certified bluetooth? version 4.1 (bdr/edr) module for designers who want to add bluetooth? wireless audio and voice applications to their products. this bluetooth sig certified module provides a complete wireless solution with bluetooth stack, integrated antenna, and worldwide radio certifications in a compact surface mount package, 29x15x2.5 mm 3 . this stereo module built - in li - ion charger and bm23 contain a digital audio interface. it supports hsp, hfp, spp, a2dp, and avrcp profiles. both aac and sbc codecs are supported for a2dp. note that the customer must connect their own external analog codec/dsp/amplifier and mcu for audio output. applicatio ns: ? bluetooth sound bar ? bluetooth stereo speaker phone
stereo module ? 2015 microchip technology inc. p age 3 p reliminary edition t a ble of cont e n t s 1.0 d evice overview ................................ ................................ ................................ ............................ 4 2.0 a pplication information ................................ ................................ ................................ .......... 10 3.0 e lectrical characteristics ................................ ................................ ................................ .. 1 8 4.0 printed antenna information ................................ ................................ ................................ 2 3 5.0 reference circuit ................................ ................................ ................................ ...................... 2 5 6 .0 certification information ................................ ................................ ................................ ..... 2 7 7 .0 module outline and reflow profile ................................ ................................ .................. 2 9 8 .0 packaging and storage information ................................ ................................ ................ 3 4 appendix ................................ ................................ ................................ ................................ ................. 3 7 t o ou r v alue d cus t omers i t i s ou r int e ntio n t o provid e ou r value d cust o mers with t he best docum e n t ation possible t o ensure successful u s e of your micr o c hip p r oduc t s. t o t his e n d, we will continue to improve our publications to better s u it yo u r n e eds . ou r publicati o n s wil l b e refine d and e nhanced as new volum e s and updates are introduc e d. i f y o u have any qu e stions or comme n t s rega r di n g thi s publicatio n , pleas e co n t ac t th e mar k e ting communica t i ons d e p artment via e - ma i l at docerrors@microchip.co m . w e welcome your feedback. most c u rre n t d a t a sh e et t o ob t ai n t h e mos t up - to - dat e versio n o f thi s da t a s h e et, pl e ase register at our w orldwide w eb site at: h t tp: / /ww w .microchip.com y ou can determine t h e ver s ion of a da t a sheet by examining i t s literature number found on the bott o m o u t s ide corner of any p age. the last charac t er of the literature number is the version numbe r , (e.g., ds3 0 000000a is version a of document ds30 0 00000). e r ra t a a n e r ra t a sheet , desc r ibin g mi n or oper a t iona l di f f e r enc e s fro m the da t a sheet and recommend e d w orkaroun d s, may e x ist for current d evices. as device/documen t a tion issues become known to us, we will pu b lish an erra t a she e t. the e rra t a will s p ecify the revisi on o f silicon and revision o f doc u ment to which it a p plies. t o det e r mine if a n erra t a sheet exis t s for a p artic u l ar device, please check with one of the following: ? microchi p s w orldwide w e b site; h ttp ://ww w .m icrochip.c o m ? y our local microchip sales o f fice ( s ee last p age) when con t acting a sales o f fice, please sp e c ify w h ic h device , revisi o n o f silic o n a n d d a t a sh e et ( i n c lude liter a ture number) you are u s ing. cu s t o mer notifi c ation s y st e m r egister on our web site at w w w . m icroc h ip.c o m to receive t he most cur r ent information on all of our pro d uc t s. abbreviations list: hfp: hands - free profile avrcp: audio video remote control profile a2dp: advanced audio distribution profile pbap: phone book access profile hsp: headset profile spp: serial port profile
stereo module ? 2015 microchip technology inc. p age 4 p reliminary edition 1.0 devic e overview t he stereo module series include BM20 and bm23. the chip integrates bl u etoot h 4. 1 r a di o transceiver , pmu and dsp. f i gur e 1 - 1 and 1 - 2 show s th e application block diagram. figure 1 \ the following depicts an example of bm2 0 module operate as a n independen t system or connected to an mcu . figure 1 \ the following depicts an example of bm23 module connected to an mcu, ex ternal dsp/codec. m c u e e p r o m i c i s 2 0 2 0 s 1 6 m h z c r y s t a l i 2 c u a r t b m 2 0 o p t i o n m i c r o p h o n e a u x _ i n a u d i o o u t p u t m c u e e p r o m i c i s 2 0 2 3 s 1 6 m h z c r y s t a l i 2 c u a r t b m 2 3 m i c r o p h o n e a u x _ i n d s p i 2 s
stereo module ? 2015 microchip technology inc. p age 5 p reliminary edition 1.1 i nterface description bm2 0 pi n diagram is shown in figur e 1 - 3 . th e pi n desc r iption s are shown in table 1 - 1 figure 1 - 3 : bm2 0 p in diagram table 1 \ pin no. pin type name description 1 i/o p0_0 io pin , default pull - high input (note 1) 1. slide switch detector , active low. 2. uart tx_ind , active low. 2 i ean embedded rom/external flash enable h: embedded; l: external flash 3 i p3_0 io pin , default pull - high input (note 1) line - in detector ( default ), active low. 4 i p2_0 io pin , default pull - high input system configuration, h: application l: baseband(ibdk mode) 5 i/o p1_5 io pin , default pull - high input (note 1) 1. nfc detection pin , active low. 2. out_ind_0 3. slide switch detector , active low. 4 . buzzer signal output 6 i/o p0_4 io pin , default pull - high input. (note 1) 1. nfc detection pin , active low. 2. out_ind_0 7 o spkr r - channel analog headphone output 8 o aohpm headphone common mode output/sense input.
stereo module ? 2015 microchip technology inc. p age 6 p reliminary edition pin no. pin type name description 9 o spkl l - channel analog headphone output 10 p vdda positive power supply/reference voltage for codec , no need to add power to this pin . 11 i mic1_p mic 1 mono differential analog positive input 12 i mic1_n mic 1 mono differential analog negative input 13 p mic_bias electric microphone biasing voltage 14 i air r - channel single - ended analog inputs 15 i ail l - channel single - ended analog inputs 16 i rst system reset pin , low: reset 17 p vcc_rf 1.28v rf ldo output , no need to add power to this pin . 18 i/o p0_1 io pin , default pull - high input (note 1) 1. fwd key when class 2 rf ( default) , active low. 2. class1 tx control signal of external rf t / r switch , active high. 19 p vdd_io power output , no need to add power to this pin 20 p adap_in 5v power adaptor input 21 p bat_in 3.3v~4.2v li - ion b attery input 22 - nc no connection 23 p gnd ground pin 24 p sys_pwr system power output bat mode: 3.3~4.2v adapter mode: 4.0v 25 p bk_out 1.8v b uck output , no need to add power to this pin 26 i mfb 1. power key when in off mode 2. uart_rx_ind: mcu use to wakeup bt (note 1) 27 i led1 led driver 1 28 i led2 led driver 2 29 i p2_4 io pin , default pull - high input system configuration, l: boot mode with p2_0 low combination 30 i p0_2 io pin , default pull - high input (note 1) play/pause key ( default ), active low. 31 i/o p0_3 io pin , default pull - high input (note 1) 1. rev key (default) , active low. 2. buzzer signal output 3. out_ind_1 4. class1 rx control signal of ext ernal rf t / r switch , active high. 32 o hci_txd hci - uart tx data 33 i hci_rxd hci - uart rx data 34 i p0_5 io pin , default pull - high input (note 1) volume down ( default ), active low. 35 i p2_7 io pin , default pull - high input (note 1) volume up key (default) , active low.
stereo module ? 2015 microchip technology inc. p age 7 p reliminary edition pin no. pin type name description 36 i p2_4 io pin , default pull - high input system configuration, l: boot mode with p2_0 low combination 37 p gnd ground pin 38 - nc no connection 39 - nc no connection 40 - nc no connection * i: signal input pin * o: signal output pin * i/o: signal input/output pin * p: power pin note 1 : these button or function s can be setup by is20xxs_ ui tool.
stereo module ? 2015 microchip technology inc. p age 8 p reliminary edition bm23 pi n diagram is shown in figur e 1 - 4 . th e pi n desc r iption s are shown in table 1 - 2 figure 1 - 4 : bm23 p in diagram table 1 \ pin no. pin ty pe name descr i pti o n 1 i/o p0_0 io pin , default pull - high input (note 1) uart tx_ind 2 i/o rfs0 i 2 s interface: dac left/right clock 3 i/o tfs0 i 2 s interface: adc left/right clock 4 i/o slk0 i 2 s interface: bit clock 5 i dr0 i 2 s interface: dac digital left/right data 6 o dt0 i 2 s interface: adc digital left/right data 7 i/o p0_4 io pin , default pull - high input 8 i ean embedded rom/external flash enable high: rom mode; low: external flash mode 9 i mic1_p mic 1 mono differential analog positive input 10 i mic1_n mic 1 mono differential analog negative input 11 p mic_bias power output, microphone biasing voltage 12 p vdda power output, reserve for external cap to fine tune audio frequency response, no need to add power to this pin 13 i air stereo analog line in, r - channel 14 i ail stereo analog line in, l - channel
stereo module ? 2015 microchip technology inc. p age 9 p reliminary edition pin no. i/o name description 15 p gnd ground 16 i rst_n system reset pin , active when rising edge. 17 -- nc -- 18 -- nc -- 19 p vddio power output, vddio pin, no need to add power to this pin 20 i/o p1_5 io pin , default pull - high input 21 i/o p0_1 io pin , default pull - high input 22 p adap_in 5v p ower adaptor input 23 p bat_in 3.3~4.2v li - ion b attery input 24 -- nc -- 25 p sys_pwr system power output bat mode: 3.3~4.2v adapter mode: 4.0v 26 p bk_out power output, 1v8 pin, no need to add power to this pin 27 p mfb 1. power key when in off mode 2. uart_rx_ind: mcu use to wakeup bt 28 p led1 led driver 1, 4ma max 29 p led2 led driver 2, 4ma max 30 i p2_4 io pin , default pull - high input system configuration, l: boot mode with p2_0 low combination 31 i/o p0_2 io pin , default pull - high input 32 i/o p0_3 io pin , default pull - high input 33 o hci_txd hci - uart tx data 34 i hci_rxd hci - uart rx data 35 i/o p0_5 io pin , default pull - high input 36 i/o p2_7 io pin , default pull - high input 37 i/o p2_0 io pin , default pull - high input 38 i/o p3_0 io pin , default pull - high input 39 i p2_0 io pin , default pull - high input system configuration, h: application l: baseband(ibdk mode) 40 p gnd ground. 41 -- nc -- 42 -- nc -- 43 -- nc -- * i: signal input pin * o: signal output pin * i/o: signal input/output pin * p: power pin note 1 : these button or function s can be setup by is20xxs_ ui tool.
stereo module ? 2015 microchip technology inc. p age 10 p reliminary edition 2.0 application information 2 . 1 o peration with external mcu stereo module support uart command set to make an external mcu to control module. here is the connection interface between bm xx and mcu. figure 2 - 1 : i nterface between mcu and bm xx m odule mcu can control module by uart interface and wakeup module by pwr pin. stereo module provide wakeup mcu function by connect to p0_0 pin of module . uart command set document provide all function which module support and ui tool will help you to set up your system support uart command. for more detail description, please reference uart_commandset_v154 document and is20xxs _ui tool. b m x x h c i _ t x d h c i _ r x d m f b p 0 _ 0 m c u u a r t _ t x u a r t _ r x m c u _ w a k e u p b t _ w a k e u p u a r t i n t e r f a c e u a r t i n t e r f a c e
stereo module ? 2015 microchip technology inc. p age 11 p reliminary edition here are some suggestions of uart control signal timing sequence : figure 2 - 2 : p ower o n /o ff s equence
stereo module ? 2015 microchip technology inc. p age 12 p reliminary edition figure 2 - 3 : t iming s equence of rx i ndication after p ower o n figure 2 - 4 : t iming s equence of power off
stereo module ? 2015 microchip technology inc. p age 13 p reliminary edition figure 2 - 5 : t iming sequence of power on (nack) figure 2 - 6 : r eset t iming s equence if module hangs up
stereo module ? 2015 microchip technology inc. p age 14 p reliminary edition figure 2 - 7 : timing sequence of power drop protection bat_in +4v rst_n from reset ic if bts bat use adaptor translates voltage by ldo, we recommend use reset ic to avoid power off suddenly. rest ic spec output pin must be open drain delay time Q 10ms recommend part: tcm809svnb713 or g691l263t73 power 2.9v ~
stereo module ? 2015 microchip technology inc. p age 15 p reliminary edition 2.2 i 2 s signal application for bm23 bm 23 support i 2 s digital audio signal interface to connect your external codec/dsp . it provide 8k hz, 44.1k hz and 48k hz sampling rate; it also support 16 bits and 24bits data format . the i 2 s setting can be set up by ui and dsp tools. . the external codec/dsp needs to be connected to slk0, rfs0, tfs0, dr0, and dt0 (pins 4, 2, 3, 5, and 6 respectively). the i 2 s signal connection between bm 23 and external dsp as below: fig u re 2 - 9 : master mode reference connection fig u re 2 - 10 : s lave mode reference connection note 1: for 002 version chip or module, system should connect line 1 in slave mode figure. and, system not support adc signal from external dsp/codec. note 2: for other version chip or module, system should connect line 2 in slave mode figure. about mast or slave mode setting, you can use dsp configuration tool to set up system. b m 2 3 r f s 0 t f s 0 d r 0 s c l k 0 d a c l r c b c l k a d c d a t d a c d a t d t 0 e x t e r n a l d s p / c o d e c b m 2 3 r f s 0 t f s 0 d r 0 s c l k 0 d a c l r c b c l k a d c d a t d a c d a t d t 0 e x t e r n a l d s p / c o d e c ( * 1 ) ( * 2 )
stereo module ? 2015 microchip technology inc. p age 16 p reliminary edition the clock and data timing as below: fig u re 2 - 11 : t iming for i 2 s modes (both master and slave) fig u re 2 - 12 : t iming for pcm modes (both master and slave) 2.3 r eset (rst_ n) rst is module reset pin which is active low. to reset the module, the rst_n must hold low for at least 63ns. 2.4 s tatus led (led 1 , led2 ) th e status le d provide below status indication: ? standby ? inquiry ? link ? lin k back ? low battery ? page ? battery charging each status indication led flashing sequence and brightness is configurable by ui tool . b n - 1 r f s n / t f s n s c l k n d r n / d t n b n - 2 b 1 b 0 b n - 1 b n - 2 b 1 b 0 l e f t c h a n n e l r i g h t c h a n n e l 1 / f s w o r d l e n g t h b n - 1 r f s 0 / t f s 0 s c l k 0 d r 0 / d t 0 b n - 2 b 1 b 0 b n - 1 b n - 2 b 1 b 0 l e f t c h a n n e l 1 / f s w o r d l e n g t h r i g h t c h a n n e l
stereo module ? 2015 microchip technology inc. p age 17 p reliminary edition 2.5 e xternal configuration stereo module can be configured and firmware programmed using an external configuration and programming tool available from microchip. figure 2 \ 7 shows the configuration and firmware programming interface on bm23. it is recommended to include a pin header on the main pcb for development. configuration and firmware programming modes are entered accordingly to the system configuration i/o pins as shown in table 2 - 1 . pin p2 0 , p24 and ean pin have internal pu ll \ up . figure 2 - 13 : e xternal programming h eader c onnections ( here is the interface connect example of the bm23 ) table 2 - 1 : s ystem configuration s ettings p20 p24 ean operational mode high high high app mode ( normal ope r ation ) low high high test mode (writ e e e p r o m ) low low high writ e flash (firmware pr o g rammi n g if flash build - in in chip )
stereo module ? 2015 microchip technology inc. p age 18 p reliminary edition 3.0 electrical charac t eris t ics table 3 - 1: a bsolute m aximum specification symbol parameter min max unit bat_in input voltage for battery 0 4.3 v ad a p_in input voltage for adaptor 0 7. 0 v t store storage temperature - 65 + 150 oc t operation operation temperature - 20 +70 oc table 3 - 2: r ecommended operating condition symbol parameter min typical max unit bat_in input voltage for battery 3 3.7 4.2 v adap_in input voltage for adaptor 4.5 5 5.5 v t operation operation temperature - 20 +25 +70 oc note: absolute and recommended operating condition tables reflect typical usage for device. table 3 - 3 : i/o and r eset l evel pa r am e ter min. typ. max. un i t s i/o s u ppl y voltage (vdd_io) 2.7 3.0 3.3 v i/o vo l tag e levels v i l i n pu t logic levels low \ 0.3 0.8 v v i h input log i c levels high 2.0 3.6 v v o l output logic l e ve l s low 0.4 v v o h output l o gi c l e ve l s h ig h 2.4 v reset v th, res threshold voltage 1.6 v note: (1) vdd_io voltage is programmable by eeprom parameters. (2) these parameters are characterized but not tested in manufacturing.
stereo module ? 2015 microchip technology inc. p age 19 p reliminary edition table 3 - 4 : b attery charger parameter min typical max unit adap_in input voltage 4.5 5.0 5.5 v supply current to charger only 3 4.5 ma maximum battery fast charge current note: enx2=0 headroom > 0.7v (adap_in=5v) 170 200 240 ma headroom = 0.3v (adap_in=4.5v) 160 180 240 ma maximum battery fast charge current note: enx2=1 headroom > 0.7v (adap_in=5v) 330 350 420 ma headroom = 0.3v (adap_in=4.5v) 180 220 270 ma trickle charge voltage threshold 3 v battery charge termination current, (% of fast charge current) 10 % note: (1) headroom = v adap_in C v bat (2) enx2 is not allowed to be enabled when v adap_in C v bat > 2v (3) these parameters are characterized but not tested in manufacturing. table 3 - 5 : led driver parameter min typical max unit open - drain voltage 3.6 v programmable current range 0 5.25 ma intensity control 16 step c urrent step 0.35 ma p ower down open - drain current 1 a shutdown current 1 a note: (1) test condition: sar_vdd=1.8v, temperature= 25 oc. (2) these parameters are characterized but not tested in manufacturing.
stereo module ? 2015 microchip technology inc. p age 20 p reliminary edition table 3 - 6 : audio codec analogue to digital converter t= 25 o c, v dd =3.0v, 1khz sine wave input, bandwidth = 20 hz ~20khz parameter (condition) min. typ. max. unit resolution 16 bits output sample rate 8 48 khz signal to noise ratio note: 1 (snr @mic or line - in mode) 88 db digital gain - 54 4.85 db digital gain resolution 2~6 db mic boost gain 20 db analog gain 60 db analog gain resolution 2.0 db input full - scale at maximum gain (differential) 4 mv rms input full - scale at minimum gain (differential) 800 mv rms 3db bandwidth 20 khz microphone mode (input impedance) 24 k thd+n (microphone input) @30mvrms input 0.02 % note: (1) f in =1khz, b/w=20~20khz, a - weighted, thd+n < 1%, 150mv pp input (2) these parameters are characterized but not tested in manufacturing.
stereo module ? 2015 microchip technology inc. p age 21 p reliminary edition table 3 - 7: a udio codec digital to analogue c onverter t= 25 o c, v dd =3.0v, 1khz sine wave input, bandwidth = 20 hz ~20khz parameter ( condition ) min. typ. max. unit over - sampling rate 128 f s resolution 16 20 bits output sample rate 8 48 khz signal to noise ratio note: 1 (snr @cap - less mode ) for 48khz 96 db signal to noise ratio note: 1 (snr @single - end mode) for 48khz 98 db digital gain - 54 4.85 db digital gain resolution 2~6 db analog gain - 28 3 db analog gain resolution 1 db output voltage full - scale swing ( avdd=2.8v ) note:3 742.5 mv rms maximum output power ( 16 load ) 34.5 mw maximum output power ( 32 load ) 17.2 mw allowed load resistive 8 16 o.c. capacitive 500 pf thd+n ( 16 load ) 0.05 % signal to noise ratio (snr @ 16 load) 9 6 db note: (1) f in =1khz, b/w=20~20khz, a - weighted, thd+n < 0.01%, 0dbfs signal, load=100k (2) these parameters are characterized but not tested in manufacturing. (3) vdd, avdd are generated by internal ldo table 3 - 8 : transmitter section for bdr and edr parameter min typ max bluetooth specification unit maximum rf transmit power 3 .0 4 .0 - 6 to 4 dbm edr/bdr relative transmit power - 4 - 1.2 1 - 4 to 1 db note: the rf transmit power is calibrated during production using mp tool software and mt8852 bluetooth test equipment. test condition: vcc_rf= 1.28v, temperature=25 oc.
stereo module ? 2015 microchip technology inc. p age 22 p reliminary edition table 3 - 9 : receiver section for bdr and edr modulation min typ max bluetooth specification unit sensitivity at 0.1% ber gfsk - 90 - 70 dbm sensitivity at 0. 0 1% ber /4 dqpsk - 9 1 - 70 dbm 8dpsk - 82 - 70 dbm note: (1) test condition: vcc_rf= 1.28v, temperature=25 oc. (2) these parameters are characterized but not tested in manufacturing. table 3 - 10 : system current consumption of analog a udio o utput system status typ. max. unit system off mode 2 5 ua standby mode 0.8 ma linked mode 0.4 ma sco link 7.8 ma a2dp link (v p - p =200mv; 1k tone signal) 10.7 ma note: use BM20 evb as test platform. test condition: bat_in= 3.8v, link with htc eye cell phone ; distance between cell phone and evb: 30cm . table 3 - 11 : s ystem current c onsumption of digital a udio o utput (i 2 s) system status typ. max. unit system off mode 2 5 ua standby mode 0. 4 ma linked mode 0.4 ma sco link 9.3 ma a2dp link (1k tone signal) 11. 7 ma note: use bm23 evb as test platform test condition: bat_in= 3.8v, link with htc m8 cell phone; distance between cell phone and evb: 30cm ; i 2 s signal link with yamaha yda174 evb
stereo module ? 2015 microchip technology inc. p age 23 p reliminary edition 4.0 p rinted antenna information 4 .1 m odule r adiation p attern th e stereo mod u le contain s a pcb printed antenna. th e pcb printed antenna radiation pattern is shown in fig u re 4 - 2 . fig u re 4 - 1 : a ntenna k eep o ut a rea e xamples figure 4 - 2 : a ntenna 3d radiation pattern @244 1 mhz
stereo module ? 2015 microchip technology inc. p age 24 p reliminary edition 4 . 2 m odule p lacement r ule on the main pcb, th e areas un d e r th e a nt e n n a s h o ul d n o t contain any top, inne r lay e r, or bottom coppe r as shown in figur e 4 \ 1 . a low \ i m pedan c e g r oun d pl a n e will ensure the best radio perfor m a nc e (be s t range, low e st noise). t h e ground p l an e ca n be ext e nde d be y o n d t he min i mu m recommended as need for the main pcb em c noise red u ction . for the best range perfor m a nc e, ke e p all external me t al away fr o m the ceram i c chip antenna at least 1 5 mm. here are some examples of good and poor placement on a carrier board with gnd plane. fig u re 4 - 3 : m odule p lacement e xamples fig u re 4 - 4 : gnd p lane on m ain a pplication b oard s y s t e m g n d p l a n e w o r s e c a s e p o o r c a s e g o o d c a s e a c c e p t a b l e c a s e
stereo module ? 2015 microchip technology inc. p age 25 p reliminary edition 5 .0 reference circuit 5 . 1 bm2 0 reference circuit mic1 board name size title rev date: sheet of p/n main circuit 1.1 BM20 reference circuit b 1 1 thursday , april 16, 2015 xxxx 5f, no.5, industry e. rd. vii, hsinchu science park, hsinchu city 30078, taiwan tel. 886-3-5778385 amp_en jp2 jp 1x8 1 2 3 4 5 6 7 8 rst_n hci_txd hci_rxd tx_ind audio amp enable p0_0 mfb uart_txd uart control (by mcu) uart_rxd reset_n mfb/rx_ind bat_in c19 10u/16v jp5 jp 1x2 1 2 li battery connector bat_in jp3 jp 1x8 1 2 3 4 5 6 7 8 reserve for bluetooth debug hci_txd hci_rxd ean p2_4 p2_0 sw1 sw-tact 1 2 3 4 mfb hci_txd hci_rxd ean p2_0 p2_4 pcb1 BM20 ant1 38 ant2 39 ant3 40 p0_0 1 ean 2 p3_0 3 p2_0 4 p1_5 5 p0_4 6 spkr 7 aohpm 8 spkl 9 vdda 10 mic1_p 11 mic1_n 12 mic_bias 13 air 14 gnd 23 nc 22 bat_in 21 adap_in 20 vdd_io 19 p0_1 18 vcc_rf 17 rst 16 ail 15 gnd 37 p2_4 36 p2_7 35 p0_5 34 hci_rxd 33 hci_txd 32 p0_3 31 p0_2 30 p2_4 29 led2 28 led1 27 mfb 26 bk_out 25 sy s_pwr 24 5v mfb sy s_pwr r1 1k/1% 1 2 5v vdd_io c26 1u/10v p0_0 q4 sts2306 3 1 2 r10 100k 1 2 r12 100k 1 2 r13 10k 1 2 slide switch circuit sy s_pwr slide_sw g d s q3 sts2301 1 3 2 mfb on sw8 sw-1bit 1 2 reset button sw2 sw-tact 1 2 3 4 dp1 dp-4 2 1 rst_n c3 1u/16v 5v q1 mmbt3904 3 2 1 r2 2k 1 2 c93 np-0603 c92 np-0603 5v c18 10u/16v line_r p3_0 line input line_l p2 tsh-3865d 4 3 2 10 1 c15 0.1u/16v r7 0 1 2 r6 0 1 2 r5 np-0603 r8 np-0603 c17 1u/16v c16 1u/16v ail air vbus d- d+ id gnd p3 usbm3121-051-1-bn-r 1 2 3 4 5 6 7 8 9 p0_3 vol+ fwd p0_1 c8 15p/50v sw5 sw-tact 1 2 3 4 c12 15p/50v p2_7 sw7 sw-tact 1 2 3 4 aohpm p0_2 c4 15p/50v play/pause spkr sw3 sw-tact 1 2 3 4 vol- rev spkl p7 pj-2001-5k 1 2 3 4 5 c7 15p/50v sw4 sw-tact 1 2 3 4 c11 15p/50v stereo jack p0_5 sw6 sw-tact 1 2 3 4 led2 led1 led1 led-b 1 2 led2 led-hr 1 2 sy s_pwr backup plug-in reset circuit jp6 jp 1x1 1 nfc c9 1u/16v mic_bias mic_n1 mic_p1 aohpm amp_en p3_0 air p0_0 spkl spkr p0_1 rst_n ail vdd_io bat_in mic_bias c13 2.2u/6.3v r3 1k 1 2 r75 1k 1 2 c72 2.2u/6.3v mic_p1 mic_n1 p0_5 c10 1u/16v r4 2k 1 2 mfb p2_4 p2_7 c14 1u/16v sy s_pwr p0_2 led2 led1 p1 pj-2001-5k 1 2 3 4 5 p0_3
stereo module ? 2015 microchip technology inc. p age 26 p reliminary edition 5 . 2 bm2 3 r eference circuit slk0 dr0 adap_in c20 0.1u/16v dt0 ean p0_0 system configuration line in detection p2_0 p2_4 pwr/mfb/uart_rx_ind system configuration system configuration p3_0 gpio description mfb receive frame synchronization transmit frame synchronization bat_in p0_4 serial clock p1 pj-3894d-s125 2 3 4 1 ail air d2 spe0572 2 1 stereo aux line input *p30 low active line in detect serial data receive d1 spe0572 2 1 d3 spe0572 2 1 bat_in p3_0 c8 470p/50v c12 470p/50v c11 0.1u/16v c9 10u/16v c10 10u/16v r9 10k 1 2 r12 10k 1 2 r10 1k 1 2 r11 1k 1 2 serial data transmit adap_in amp_en jp2 jp 1x8 1 2 3 4 5 6 7 8 hci_txd hci_rxd c17 1u/16v dr0 slk0 r2 33 1 2 tfs0 rfs0 dt0 rst_n c18 1u/16v mic_bias mic_n1 mic_p1 rfs0 dp1 dp-4 2 1 p0_0 c5 10u/16v codec_vo audio amp enable p2 dc-jack 1 2 3 i2s interface mic_n1 mic_p1 p0_4 c1 2.2u/6.3v r7 1k 1 2 r6 1k 1 2 c2 2.2u/6.3v c4 220p/50v r8 2k 1 2 mic_bias battery connector mfb jp3 jp 1x8 1 2 3 4 5 6 7 8 p0_0 dc power source c16 0.1u/16v uart_tx_ind(flash) tp1 tp-4 1 led tx_ind c3 0.047u/25v tp3 tp-4 1 c7 4.7u/10v mic_bias c6 0.047u/25v jp1 jp 1x8 1 2 3 4 5 6 7 8 mic input sy s_pwr rst_n adap_in r3 33 1 2 r1 33 1 2 r5 33 1 2 r4 33 1 2 mfb/rx_ind reset_n jp4 sjp 1x2 2 1 3 4 uart_rxd uart control (by mcu) pcb1 fp-bm23 p0_0 1 rfs0 2 tfs0 3 slk0 4 dr0 5 dt0 6 p0_4 7 ean 8 mic1_p 9 mic1_n 10 mic_bias 11 vdda 12 air 13 ail 14 gnd 15 sys_pwr 25 amb_det 24 bat_in 23 adap_in 22 p0_1 21 p1_5 20 vdd_io 19 nc 18 nc 17 rst 16 gnd 40 p2_0 39 p3_0 38 p2_0 37 p2_7 36 p0_5 35 hci_rxd 34 hci_txd 33 p0_3 32 p0_2 31 p2_4 30 led2 29 led1 28 mfb 27 bk_out 26 mfb p2_0 p3_0 hci_txd hci_rxd p2_4 led2 led1 tp2 tp-4 1 bat_in reserve for bluetooth debug led2 c13 0.1u/16v red blue led1 led-b 1 2 led2 led-hr 1 2 sy s_pwr board name size title rev date: sheet of p/n reference circuit of bm23 1.0 reference circuit of bm23 b 2 2 friday , march 13, 2015 xxxx 5f, no.5, industry e. rd. vii, hsinchu science park, hsinchu city 30078, taiwan tel. 886-3-5778385 led1 uart_txd ean p2_0 p2_4 hci_rxd ean p0_4 hci_txd tp4 tp-4 1 audio amp enable(rom) air ail tfs0
stereo module ? 2015 microchip technology inc. p age 27 p reliminary edition 6 .0 certification i nformation 6.1 bqtf i nformation fig u re 6 - 1 : bm 15/BM20/bm23/bm25 qdid data
stereo module ? 2015 microchip technology inc. p age 28 p reliminary edition 6.2 r egulatory a pproval b m23 h as got these countr ies regulatory approval : ? uni t e d states ; fcc id: a8tbm23spkxyc2a ? canada ; ic id: 12246a - bm23spkxyc2 ? europe ? japan ; ? korea ; certification no.: msip - crm - s9s - bm23spkxy ? taiwan ; ncc no.: ccal15lp0270t3 BM20 has got these contries regulatory approval ? ce: BM20spkxynbz ? united states: fcc: a8tBM20spkxynbz ? canada:ic id : 12246a - BM20spks1 ? hvin:BM20spks1 ? japan: 202 - smd048 ? korea kcc: msp - crm - mcp - BM20spks1nbc ? taiwan ncc: ccan15lp0460t2 ? china srrc: cmiit id:2015dj7134 for more information, please reference appendix.
stereo module ? 2015 microchip technology inc. p age 29 p reliminary edition 7 .0 module outline and reflow profile 7.1 m odule d imension and pcb f oot p rint figure 7 - 1 : bm2 0 outline dimension
stereo module ? 2015 microchip technology inc. p age 30 p reliminary edition pcb dimension: x : 15. 0 mm y : 29. 0 mm tolerances: 0.25 mm fig u re 7 - 2 : bm23 outline dimension pcb dimension: x : 15. 0 mm y : 29. 0 mm tolerances: 0.25 mm
stereo module ? 2015 microchip technology inc. p age 3 1 p reliminary edition figure 7 - 3 : BM20 pcb f oot print note: the keep out area is reserved for rf performance check.
stereo module ? 2015 microchip technology inc. p age 32 p reliminary edition figure 7 - 4 : bm23 pcb f oot print note: the keep out area is reserved for rf performance check.
stereo module ? 2015 microchip technology inc. p age 33 p reliminary edition 7. 2 r eflow profile fig u re 7 - 5 : r eflow profile soldering recommendations stereo modu le was assembled using standard le a d \f r ee reflow profile ipc/jedec j \ st d\020. th e module can b e soldered t o th e main pcb using st a ndard le a de d and l e a d \free solder refl o w profiles. t o avoid da ma gin g of th e m o dule , th e r e com m end a tions a re listed as follows : ? refer to micr oc hi p t e chnolog y a p plication not e an233 solder reflow r e comme n datio n (ds00233) for th e solder ing reflow r e commend a tions ? do not exce e d peak tempera t ure (t p ) o f 250 de g ree c slope: 1~2 /sec max. (217 to peak) ramp down rate : max. 3 /sec. preheat: 150~200 25 217 peak: 260 +5/ - 0 60 ~ 180 sec. 60 ~150sec 20~40 sec. time (sec)
stereo module ? 2015 microchip technology inc. p age 34 p reliminary edition ? refe r t o the s o ld er paste da t a sheet for specific refl o w profile r e commend a tions ? use n o \ clea n flu x solder p a ste ? do not wash as moisture can b e trapp e d u n de r th e shield ? use only one flow. i f th e p cb requires mult i pl e flo w s, apply the module on the final flow. 8 .0 packaging and storage information the module is packaged into trays (see following page) of sixty three (63) modules in a 7 x 9 format. these trays are then sealed into bags. ten sealed bags are then placed in a box of 630 pieces with a dimension of 36 * 16 * 9.5 cm 3 . the shelf life of each m odule in a sealed bag is 12 months at <40c and <90% relative humidity. after a bag is opened, devices that will be subjected to reflow solder or other high temperature processes must be mounted within 168 hours (7 days) at factory conditions of <30c and <60% relative humidity.
stereo module ? 2015 microchip technology inc. p age 35 p reliminary edition 8 . 1 o rdering i nformation
stereo module ? 2015 microchip technology inc. p age 36 p reliminary edition table 5 - 1: module o rdering i nformation part number description BM20spks1nbc bluetooth 4.1 b d r/edr, class 2 surface mount module with integrated antenna and shield bm23spk s 1nb 9 bluetooth 4.1 b d r/edr, class 2 surface mount module with integrated antenna and shield note : the m odule can only be purchased through a microchip representative. go to http://www.microchip.com/ for current pricing and a list of distributors carrying microchip products. appendix
stereo module ? 2015 microchip technology inc. p age 37 p reliminary edition a .1 united states th e mod u le has recei v ed f e deral c o mm u nications commission (fcc) cfr47 telecommuni c ations, part 15 subpa r t c intentional radiators m odular appr o val in accord a n ce with part 15.212 modular transmitter appr o val. modular approval allows th e en d user t o integr a t e the module int o a finished pr o duct without obtaining su bs equen t and separate fcc approvals for int e ntional radiation, provided n o ch a nge s or mod i fications are mad e t o t he module ci r cu i try . changes or modifications coul d void t he users authority t o operate the e quip m ent. t h e end user must comply with all of th e instructions provided b y th e grantee, which ind i cat e installation and / or operating conditions necessary for comp l ianc e . th e finished produc t is required t o compl y with all applicab le f c c equi p me n t authorizations regulations, require m e nt s and equ i pm e n t functions not associated with the tr a n smitter mod u le portion. for example , c o mplianc e m u st b e d e monstrated t o regulations for other transmitter compon e nt s within t he host prod u ct ; t o requirements for unintentional radiators ( p ar t 15 sub p art b uninte n tional radiators), suc h as digit a l devices, c o mpute r perip h erals, radio receivers, etc.; and t o additional authorization require m e nt s for th e no n \ tr ansmitte r functions on the transm i tte r module (i .e . , verification, or declaration o f conformity) ( e .g. , trans m itter modu l e s may also con t ain d i gita l logic f unctions) as appropriate. a .1.1 labeling a n d u s e r inf o rmation require m ents th e m o dul e has b e e n labe l ed wi t h i t s own fcc i d n u mber , and if th e f c c i d is not visible when th e module is installed inside another devi c e, then t he outside of the finished p r oduc t int o w hic h t he module is in s t alled must also display a la b el referring t o the enclo s ed module. t h is exterior l a be l ca n use wording as f o llows: contains tr a n smitter modul e fcc id: a8tbm23spkxyc2a or contains fcc id: a8tbm23spkxyc2a thi s dev i c e complies with part 15 of t he fcc rules. operation is subject t o the following tw o conditions: (1) this dev i c e may n o t c a use harmful interference, and ( 2 ) thi s devi c e must accept any int e rferenc e rec e ived, i n clud ing interfer e nc e that may ca use undesired operation a users ma n u al for t he finished product should include the follo w i ng statement:
stereo module ? 2015 microchip technology inc. p age 38 p reliminary edition thi s equipm e n t has be e n tes t ed and f o un d t o c o mp l y wit h t he l i mits for a class b digita l device, pur s u ant t o part 15 of th e fcc ru l es. t h ese limit s are designe d t o provide reasonable protection against harmful i nterfe r enc e in a residential installation. t h i s equi p me n t generates, uses and ca n r a diate radio freque n c y en er g y, and if not installed a n d us e d in accordance with t he instructions, may cause h a rmfu l i nterfe r enc e t o radio co m m unicat i ons. however, th e re is n o guarantee th a t int e rferenc e will not occur i n a particular installation. i f thi s equ i pm e n t does cause harmful int e rferenc e t o ra di o or television r e ception, w hic h ca n b e dete r m ined b y tu r nin g th e e q u i pme n t off and on, the user is encouraged t o tr y t o correct the i n terference b y one or more of t he f ollowing me a sures: ? reorien t or r e l o c a t e th e r eceiving ant e nna. ? increase th e separation between the e quip m en t and receiver. ? connec t t he equi p me n t into an outlet on a circu i t dif f erent from that t o which th e receiver is c o nnecte d . ? consult t he dealer or an experienced radio/tv t e ch n i cia n for help. additional in f ormation on l a belin g and user information requir e m e nt s for part 1 5 devices ca n b e found in kdb pub l ication 784748 available at the fcc offic e of e n gineer i n g and te c hnolo g y ( o e t) laboratory division knowledge database (kdb) http://apps.fcc.gov/oetcf/kdb/index.cf m . 3.1.2 r f e x posu r e all transm i tt e r s regulat e d b y fcc m u st compl y wit h r f e xp os u re r equirements. kdb 447498 genera l rf exposure g u i danc e provides guida n c e i n d e term i n ing whether proposed or ex i s tin g transm i tting facilities, operations or d e vice s com p ly wit h l i mit s for hum a n e x pos u re t o ra d i o frequ e nc y (rf ) fields adopted b y the f e deral c o mm u nications commission (fcc). from t he fcc gra n t : o ut p u t power listed is cond u c t ed . thi s gra n t is valid only whe n th e m o dul e is sold t o oem integrators and m u st b e installed b y t he oem or oem i n te g ra t ors. thi s transm i tte r i s restricted for use with the sp e c ific a n tenn a (s ) tested in this application for c ertification a n d must not b e c o\ l o cated or operating i n conjunction wit h any other ant e nn a or transm i tters withi n a host device , except in accordance wit h fcc mu l t i\ transm i tte r produ c t procedures. 3.1.3 h e lp f ul we b sites federal com m unications commission (fcc): http:/ / www.fcc.gov fcc offic e of eng i neeri n g a n d te c h n ology ( o e t) labo r atory division knowledge d a t a b ase (kd b ): htt p ://apps.fcc . gov/oetcf/kdb/in de x . c f m
stereo module ? 2015 microchip technology inc. p age 39 p reliminary edition th e host dev i ce, otherwise the a .2 canada th e bm23 mod u le has bee n certifi e d for use in canada unde r in d ust r y canada (i c ) radio standards specific a t ion (rss ) r s s\210 a n d rss \ ge n . modular approval permit s th e install a t i on of a module in a host devic e without t he n ee d t o recertify th e device. a .2.1 labeling a n d u s e r inf o rmation require m ents labeling r e quirements for th e host de v ic e (from section 3.2.1, r s s\ g e n , issue 3, december 2010): t he host device s h a l l b e prop e rly labeled t o identif y t he module within t he host d e vice. th e indu s tr y canada certi f icatio n l a be l of a module s h a l l b e c l earl y visible at all ti mes when i n stalled in host dev i c e must b e labeled t o dis p lay th e ind u stry canada ce r tification num ber of the modu l e , p r eced e d b y the words contains t r ans m i tte r module, or th e word contains, or similar wording expres s in g th e same meaning , as f ollows: contains tra n smitter module ic: 12246a - bm23spkxyc2 use r manua l notic e for license\ e x em p t radi o apparatus (from s e ction 7.1.3 r ss \ gen , issue 3, december 2 0 10): use r m a nual s for lic e n s e \ ex e mp t ra di o apparatus shall con t a i n the following or equivalent n o tic e in a con s picuou s l o cation in th e us e r manual or alternatively on t he devi c e or both: this device complies with industry canada license\exempt rss standard(s). operation is transmitter a nt e n n a (from section 7 . 1 . 2 rs s \ g e n , is s u e 3, december 2010): u s e r manuals for transmitters shall display the following notic e in a c o nspicuou s l o cation:
stereo module ? 2015 microchip technology inc. p age 40 p reliminary edition unde r industry canada r e gulations, this radio tran s m itter may only operate using an ant e nn a of a typ e and m a xim um ( or lesser) gain approv e d for t he transmitter b y ind u stry c a nada. t o r e d uc e potential radio interfe r enc e to other users, the a n tenn a type and it s gain should b e so chosen that t he equivalent i s otropically r a diated power ( e .i.r. p . ) is n o t more than that necessary for successful c o mm u nicatio n. conformm e nt la rgl em entation d'industrie can a da, le prs e n t m e tt e ur radio peu t f o nctionner a v ec u n e a nt en n e d 'u n t y p e e t d 'u n gain maximal ( ou infrieu r ) approuv pour l ' metteu r par ind u strie c a nada. dans le bu t de rduire l e s ri s que s d e brouillage radiolectrique l'intention de s autres utilisateurs, il faut choisir l e ty p e d ' ant e nne e t son g a i n d e sorte q u e la puissance is o t rope rayonne quivalente (p.i.r .e . ) n e dpasse pas l 'int e nsit ncessaire l'tablissement d ' u n e com m unication s atisfaisante. th e above n o tic e may b e a ffixed t o the devic e inste a d of displayed in t he user manual. use r ma n u als for transm i t ters equ i ppe d wit h det a ch a bl e antennas shall also con t ain the foll o wing notic e in a c o nspicuou s l o cation: thi s radio transmitter (id e ntif y th e dev i c e b y certif i cation n u mbe r , or model num ber if category ii ) has bee n approved b y i n dust r y canada t o o p era t e with th e a nt e n n a types listed b e low wit h th e maxim um p e rmissible gain and required ant e nn a impedan c e for e a c h a nt e n n a t y p e i ndicated. a n tenna types not included i n t h i s list , ha v in g a gain gr e a te r than th e maxim um ga i n indic a te d for that type , are strictly prohi b ited for use wit h thi s dev i ce. conformm e nt la rgl em entation d'industrie can a da, le prs e n t m e tt e ur radio peu t f o nctionner a v ec u n e a nt en n e d 'u n t y p e e t d 'u n gain maximal ( ou infrieu r ) approuv pour l ' metteu r par ind u strie c a nada. dans le bu t de rduire l e s ri s que s d e brouillage radiolectrique l'intention de s autres utilisateurs, il faut choisir l e ty p e d ' ant e nne e t son g a i n d e sorte q u e la puissance is o t rope rayonne quivalente (p.i.r .e . ) n e dpasse pas l 'int e nsit ncessaire l'tablissement d ' u n e com m unication s atisfaisante. imm e diatel y following t he above notice , th e ma n u facturer shall p r ovide a list of all antenna types approved for use with the transmitter, i ndicating t he maxim um p e rmissible antenna ga i n (i n dbi) and required i mpe danc e for e a ch. a .2.2 osu r e all transm i tt e r s regulat e d b y i c must c o mpl y with r f exposure r e quirements listed in rs s \102 \ radio frequ e nc y (rf) exposure c o mplianc e of radiocommunication apparatus (al l f r eque n c y bands ) . a.2.3 we b sites industr y canada: h t tp:// w ww.ic . gc . ca/
stereo module ? 2015 microchip technology inc. p age 41 p reliminary edition a .3 europe th e bm23 mod u le is an r & t t e dir e ctive assessed radio module that is ce mar k ed and has bee n manuf a c tur e d and tes t ed with th e int e ntio n of bein g integr a t ed i nt o a final product. th e bm23 m o dul e has b e e n tes t ed t o r&t te dir e ctive 1999/5/ec essential require m ents for healt h and safet y ( ar t i c le (3. 1 (a ) ) , el e ctromag n e t i c compatibility (e m c ) (art i cl e 3. 1 ( b )) , and ra d i o (a r t icle 3.2) and are summar i zed in table 3 \ 1: e u ro p e a n compliance t estin g . a not i fie d body op i n ion has also been issued. th e r& t t e compliance a s sociation pr o v ide s gu i dance on modular devices in d o cum e n t technical guidance note 01 available at http://www.rtteca.c o m /html / download_area.htm . note: t o ma i n tain co n forma n ce t o th e testi n g li s ted in t ab le a. 3\1: eu r op e a n compliance testing , the module s h a l l b e installed i n accordance wit h t he i n stallation inst r uction s in th i s dat a sheet and shall not b e modified. whe n i nt e gratin g a radio module int o a comp l e te d produc t the i nt e g ra t or becomes th e m a nufacturerof th e final p r oduc t and is therefore responsible for d e monstrating compliance o f th e final product wit h th e essential r e quir e ment s of t he r&t te directive. a.3.1 abeling a n d u s e r inf o rmation require m ents th e l a be l on the final product which c o ntain s the bm23 mod u le must follow c e marking r e quirem e nts. th e r& t t e compliance a s sociation technical g u i da n ce note 01 provides gui da nc e on final produc t ce marking. a.3.2 antenna require m ents from r & tt e compliance association docum e n t technical guidance note 01 : provided th e integrator in s t alling a n assessed radio module wit h an integral or specific a n t e nna and installed in conforman c e with th e ra di o module manufacturers installation instructions requires n o furthe r evalu a tion u nde r articl e 3.2 of t he r & tt e dir e ctive a n d do e s not require furthe r involvement of an r&t te dir e ctive notifi e d b o d y for th e final prod u ct . [ s e cti on 2.2.4] th e europe a n compliance testing list e d in table 3\1 was perfor m ed using th e i nt e g ral cer a mi c ch i p antenna. table a . 3\ 1 : e u rop e an co mpl iance testing certificatio n standa r ds article la bo ratory r epo r t nu m ber date safety e n 6095 0\ 2\ 9\1 \ 9\ \ \
stereo module ? 2015 microchip technology inc. p age 42 p reliminary edition a.3.3 h e lp f ul we b sites a doc u me n t that ca n b e u s e d as a starting point i n u nderstand i n g th e use of short ran g e devices (srd) in europe is the european radi o communications committee (erc) reco m m e ndation 70 \ 0 3 e , which c a n b e downloaded from th e european rad i o communications office ( e r o ) at: http://www.ero.dk/ . additional h e lpfu l web sites are: ? radi o and te l ecom m unications term i n al e q uip m en t (r&tte ) : http://ec. e u r opa.eu/enterprise/rtte/index_e n . htm ? european conference of p os t al and te l e com m un i ca t ion s administrations (ce pt ) : http://www.cept.org ? european te l ecom m unications standards institute (etsi ) : http://www.etsi.org ? european r a di o commun i cations office (ero ) : http://www.ero.dk ? th e radi o and te l ecommunications te r m inal equ i p m en t compliance associati o n (r&tte ca): http://www.rtteca.com/
stereo module ? 2015 microchip technology inc. p age 43 p reliminary edition a.4 japan th e bm23 mod u le has recei v ed t y p e certi f icatio n and is labeled wit h i t s own techn i cal conformity mark and certification nu mber as requi re d t o conform t o th e te c h n i ca l standards regulated b y t he ministry of internal affairs and c o mmun i cati o n s ( m ic) of j a pa n p u rsuant t o the radi o ac t of japan. integr a t ion o f thi s module int o a final p r oduc t does not require additional radio ce r tificatio n provided installation ins t r ucti o n s are followed and n o modifications of th e m o dul e are all o wed. additi o n al test i n g may b e required: ? i f t he host p r oduc t is sub j ec t t o e l ectrical appliance s afe t y (f or ex a mple , powered from a n ac mains) , th e host product may require product safety el e c tr i c al a ppliance and material ( p s e) testin g . t h e i nt e g ra t or sh o u ld contact their conformance l a boratory t o dete r m ine if this t e sting is requir e d. ? ther e is an v oluntary electromagnetic compatibility (e m c ) test f o r th e host product administered b y vcci: http://www.vcci. j p / vcci_e/index.html a.4.1 labeling a n d u s e r inf o rmation require m ents th e l a be l on the final product which c o ntain s the bm23 mod u le must follow japan mark i n g require m e nt s . t he integrator of th e m o dul e should r efer t o th e l a belin g requirements for j a pan available at the ministr y of internal af f airs and com m unications ( m ic) website. th e bm23 m o dul e is labe l ed with i t s o wn t e c h nica l conformity mark and certification number. t h e final produc t in w hic h thi s mod u le is bein g used mu s t ha v e a label referring t o th e type certifi e d module inside: contains tra n smitter mod u le with certif i c ate nu m ber: a.4.2 h e lp f ul we b sites ministry of i n ternal affairs and com m u n ications ( m i c ) : http://www.tele.soumu.go.jp/e/index.htm association of radio i ndu s tries and businesses ( a ri b): http://ww w .arib.or.jp/english/
stereo module ? 2015 microchip technology inc. p age 44 p reliminary edition a.5 korea the bm23 mo d u le has recei v ed cer t ifi c a t ion of confo r mity i n a cco r d ance with th e radio waves act . i n tegration of this module i n t o a final product does not require additional radio certification provided in st allation inst r u ctions are followed and n o modificati o n s of th e m o dule are allowed. a.5.1 labeli n g a n d user inf o rmation r e quire m ents the l a bel on the final pro d uct which c o nt ai ns the bm23 mo d u le must follow k c marking r e quirem e nts. the i nt e gra t or of th e mo d u le should re f er t o th e lab e ling r e quir em ents for kor e a available on t h e korea communicat i ons commission ( kcc) website. the bm23 m odule is la b e l ed with i t s o wn kc mark. the final pr o duct requires th e kc mark and certif i c ate n u mber of th e module: ( msip - crm - s9s - bm23spkxy ) a.5.2 h e lp f ul we b sites korea com m unications commission (kcc ) : h ttp://w w w.kcc.go.kr national r a d i o research a ge nc y (rra ) : htt p ://rra.go.kr
stereo module ? 2015 microchip technology inc. p age 45 p reliminary edition a.6 taiwan the bm23 mo d u le has recei v ed c o mpliance approval in accordance with the teleco m m u n i c ations a ct . customers seeking t o use t h e co m p liance approval in their pro d uct should contact mic r ochip techn o logy sales or distribution partners t o obtain a l e t t er of authorit y . installation ins t ru ct io n s are followed and no modif i cations of th e m odule are all o wed. integr a t ion o f this module int o a final p r oduct does no t require additional radio ce r t ification provided a.6.1 labeli n g a n d user inf o rmation r e quire m ents the bm23 m odule is la b e l ed with i t s o wn ncc mark and certif i c a t e n u m b er as below: th e users m anual should contain bel o w warning ( f or r f devic e ) in trad i t ional chinese: ? ! ????Ck ?l ?JC???l?C?S? ? ????l?????O? ? ??l ?l?C???w??_??? lF?_Fr ??Ko?_r^m? ? ? ? ? ? I ? o ? l C ? I W t ? CO ? _ a.6.2 h e lp f ul we b sites national com m unications commission (ncc): http:/ / www.ncc.go v . tw ccal15lp0270t3
w o rldwid e sale s an d service americas cor p orat e o f fice 2355 w est c handler blvd. chandle r , az 85224 - 6 199 t e l: 480 - 792 - 7200 fax: 480 - 792 - 7 2 77 t e chnical supp o rt: http://ww w .microchip.com/ s u pport w eb ad d r ess: ww w .microc h ip.com atl a n t a duluth, ga t e l: 678 - 957 - 9614 fax: 678 - 957 - 1 4 55 au s tin , tx t e l: 512 - 257 - 3370 bo s ton w estborough, ma t e l: 774 - 760 - 0087 fax: 774 - 760 - 0 0 88 chi c ago i t asca, il t e l: 630 - 285 - 0071 fax: 630 - 285 - 0 0 75 cleveland indepen d ence , oh t e l: 216 - 447 - 0464 fax: 216 - 447 - 0 6 43 dallas addison, tx t e l: 972 - 818 - 7423 fax: 972 - 818 - 2 9 24 detr oit novi, mi t e l: 248 - 848 - 4000 ho us t o n , tx t e l: 281 - 894 - 5983 in d i ana p olis noblesville, in t e l: 317 - 773 - 8323 fax: 317 - 773 - 5 4 53 l os an ge les mission v iejo, c a t e l: 949 - 462 - 9523 fax: 949 - 462 - 9 6 08 new y o rk, n y t e l: 631 - 435 - 6000 san jose, ca t e l: 408 - 735 - 9 1 10 ca na d a - t o r o n to t e l: 905 - 673 - 0699 fax: 905 - 673 - 6 5 09 asia/ p acific asia pac i fic office suit e s 37 0 7 - 14, 3 7 th floor t ower 6, the gateway harbour cit y , kowloon hong ko n g t e l : 85 2 - 2943 - 5100 fax: 852 - 2401 - 3431 australia - s y dn e y t e l : 61 - 2 - 9 8 68 - 6733 fax: 61 - 2 - 986 8 - 6755 china - beijing t e l : 86 - 10 - 8 569 - 7000 fax: 86 - 10 - 85 2 8 - 2104 c h in a - che n g du t e l : 86 - 28 - 8 665 - 55 1 1 fax: 86 - 28 - 86 6 5 - 7889 c h in a - ch o ng q ing t e l : 86 - 23 - 8 980 - 9588 fax: 86 - 23 - 89 8 0 - 9500 c h in a - han g z h ou t el: 86 - 571 - 8792 - 8 1 15 fax: 86 - 571 - 8 7 92 - 8 1 1 6 c h in a - ho ng k o n g sar t e l : 85 2 - 2943 - 5100 fax: 852 - 2401 - 3431 china - nanjing t e l : 86 - 25 - 8 473 - 2460 fax: 86 - 25 - 84 7 3 - 2470 c hi n a - q in g dao t e l : 86 - 532 - 8502 - 73 5 5 fax: 86 - 532 - 8 5 02 - 7205 c h in a - s h an g hai t e l : 86 - 21 - 5 407 - 5533 fax: 86 - 21 - 54 0 7 - 5066 c h in a - s h eny a ng t e l : 86 - 24 - 2 334 - 2829 fax: 86 - 24 - 23 3 4 - 2393 china - s henzh e n t el: 86 - 755 - 8864 - 22 0 0 fax: 86 - 755 - 8 2 03 - 1760 c h in a - w u han t e l : 86 - 27 - 5 980 - 5300 fax: 86 - 27 - 59 8 0 - 5 1 18 c h in a - xi a n t e l : 86 - 29 - 8 833 - 7252 fax: 86 - 29 - 88 3 3 - 7256 c h in a - x i a men t el: 86 - 592 - 2388138 fax: 86 - 592 - 2 3 88130 c h in a - zh u hai t el : 8 6 - 75 6 - 3 210 0 40 fax : 86 - 75 6 - 321 0 049 as i a/ p a c ific in d ia - b a n g alore t e l : 9 1 - 80 - 3090 - 44 4 4 fax: 91 - 80 - 3 0 90 - 4123 in d ia - n ew delhi t e l : 9 1 - 1 1 - 4160 - 8 6 31 fax: 91 - 1 1 - 4 160 - 86 3 2 in d ia - p u ne t e l : 9 1 - 20 - 3019 - 15 0 0 ja p an - osaka t e l : 8 1 - 6 - 6 152 - 7160 fax: 81 - 6 - 61 5 2 - 9310 ja p an - t okyo t e l : 8 1 - 3 - 6 880 - 37 7 0 fax: 81 - 3 - 68 8 0 - 3771 k o r e a - da e g u t e l : 8 2 - 53 - 744 - 4301 fax: 82 - 53 - 7 4 4 - 4302 k o r e a - se o u l t e l : 8 2 - 2 - 5 54 - 7200 fax: 82 - 2 - 55 8 - 5932 or 82 - 2 - 558 - 5934 malaysi a - k u al a l u m p ur t e l : 6 0 - 3 - 6 201 - 9857 fax: 60 - 3 - 62 0 1 - 9859 malaysi a - pen a ng t e l : 6 0 - 4 - 2 27 - 8870 fax: 60 - 4 - 22 7 - 4068 phili p pi n es - m a nila t e l : 6 3 - 2 - 6 34 - 9065 fax: 63 - 2 - 63 4 - 9069 singapore t e l : 6 5 - 6334 - 8870 fax: 65 - 6334 - 8850 t a iwa n - h s i n c hu t e l : 8 8 6 - 3 - 5778 - 366 fax: 886 - 3 - 5 7 70 - 955 t a iwa n - k a o h siung t e l : 8 8 6 - 7 - 213 - 7830 t a iwa n - t a ip e i t e l : 8 8 6 - 2 - 2508 - 86 0 0 fax: 886 - 2 - 2 5 08 - 0102 t h aila nd - b a n g kok t e l : 6 6 - 2 - 6 94 - 1351 fax: 66 - 2 - 69 4 - 1350 europe austria - w els t e l : 4 3 - 7242 - 2244 - 39 f a x : 43 - 7242 - 2244 - 3 9 3 de n mar k - co pe n h agen t e l : 4 5 - 4450 - 2828 f a x : 45 - 4485 - 2829 france - paris t e l : 3 3 - 1 - 6 9 - 53 - 63 - 20 f a x : 33 - 1 - 6 9 - 30 - 9 0 - 79 germany - dusseld o rf t e l : 4 9 - 2129 - 3766400 germany - munich t e l : 4 9 - 89 - 627 - 14 4 - 0 f a x : 49 - 89 - 6 27 - 144 - 44 germa ny - pf or z h eim t e l : 4 9 - 7231 - 424750 i t al y - m i lan t e l : 3 9 - 0331 - 7426 1 1 f a x : 39 - 0331 - 466781 i t al y - v eni ce t e l : 3 9 - 049 - 7625286 net h erlan d s - drunen t e l : 3 1 - 416 - 690399 f a x : 31 - 416 - 690340 poland - w arsaw t e l : 4 8 - 22 - 3325737 s p ain - m a d rid t e l : 3 4 - 91 - 708 - 08 - 90 f a x : 34 - 91 - 7 08 - 08 - 91 sweden - s t ockholm t e l : 4 6 - 8 - 5 090 - 46 5 4 u k - w o kin g ham t e l : 4 4 - 1 18 - 921 - 5 800 f a x : 44 - 1 18 - 921 - 5 8 20 p age 46 ? ? 201 5 microchip technol o gy inc.

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