1. 2. 3. material content data sheet sales product name tle82453sa issued 28. august 2013 ma# MA001139948 package pg-dso-36-54 weight* 2111.58 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 22.403 1.06 1.06 10609 10609 leadframe inorganic material phosphorus 7723-14-0 0.388 0.02 184 non noble metal zinc 7440-66-6 1.553 0.07 736 non noble metal iron 7439-89-6 31.066 1.47 14712 non noble metal copper 7440-50-8 1261.410 59.74 61.30 597376 613008 wire non noble metal copper 7440-50-8 7.370 0.35 0.35 3490 3490 encapsulation organic material carbon black 1333-86-4 1.513 0.07 717 plastics epoxy resin - 69.616 3.30 32969 inorganic material silicondioxide 60676-86-0 685.568 32.47 35.84 324670 358356 leadfinish non noble metal tin 7440-31-5 15.044 0.71 0.71 7124 7124 plating noble metal silver 7440-22-4 0.644 0.03 0.03 305 305 solder noble metal silver 7440-22-4 0.225 0.01 107 non noble metal tin 7440-31-5 0.150 0.01 71 non noble metal lead 7439-92-1 14.633 0.69 0.71 6930 7108 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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