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december 2016 docid024794 rev 6 1 / 11 this is information on a product in full production. www.st.com bal - nrf02d3 50 ohm nominal input / conjugate match balun to nrf51822 - ceaa/cdab/cfac and nrf51422 - ceaa/cdab/cfac datasheet - production data features ? 50 nominal input / conjugate match to nordic semiconductor chips nrf51422 - ceaa, nrf51422 - cdab, nrf51422 - cfac and nrf51822 - ceaa, nrf51822 - cdab, nrf51822 - cfac ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? small footprint: < 1.2 mm 2 benefit s ? very low profile < 560 m after reflow ? high rf performances ? rf bom and area reduction applications ? 2.45 ghz impedance matched balun filter ? optimized for nordic's chip set nrf51422 - ceaa, nrf51422 - cdab, nrf51422 - cfac and nrf51822 - ceaa, nrf51822 - cdab, nrf51822 - cfac description stmicroelectronics bal - nrf02d3 is an ultraminiature balun. the bal - nrf02d3 integrates matching network and harmonics filter. matching impedance has been customized for the following nordic semiconductor circuits: nrf51422 - ceaa, nrf51422 - cdab, nrf514 22 - cfac and nrf51822 - ceaa, nrf51822 - cdab, nrf51822 - cfac. the bal - nrf02d3 uses stmicroelectronics ipd technology on non - conductive glass substrate which optimize rf performances. the bal - nrf02d3 has been tested and approved by nordic semiconductor in the nrfgo modules. figure 1 : pin coordinates f l i p - c h i p ( 5 b u m p s ) p a c k a g e
application bal - nrf02d3 2 / 11 docid024794 rev 6 1 application figure 2 : application schematic v c c _ n r f p 0 . 1 4 p 0 . 1 3 p 0 . 1 2 p 0 . 0 8 p 0 . 0 9 p 0 . 1 0 p 0 . 1 1 v c c _ n r f c 8 1 0 0 n f c 9 1 . 0 n f p 0 . 1 7 p 0 . 1 8 p 0 . 1 9 p 0 . 1 5 p 0 . 1 6 s w d c l k s w d i o p 0 . 0 4 p 0 . 0 3 p 0 . 0 2 p 0 . 3 0 p 0 . 0 0 p 0 . 0 1 p 0 . 0 5 p 0 . 0 6 p 0 . 0 7 p 0 . 2 0 p 0 . 2 4 p 0 . 2 5 p 0 . 2 9 p 0 . 2 8 p 0 . 2 7 p 0 . 2 6 p 0 . 2 1 c 1 0 4 7 n f p 0 . 2 3 p 0 . 2 2 p 0 . 3 1 c 1 1 2 p f c 2 1 2 p f x 1 1 6 m h z c 1 1 1 0 0 n f v c c _ n r f c 7 1 0 0 n f r 1 1 2 k c 3 2 . 2 n f v d d b 8 v d d h 8 v s s b 1 v d d _ p a e 1 a n t 1 d 1 a n t 2 c 1 v s s b 4 v s s c 8 a v d d a 1 x c 1 a 2 x c 2 a 3 d c c b 9 p 0 . 3 0 d 8 p 0 . 0 0 c 9 p 0 . 0 1 e 9 p 0 . 0 2 d 9 p 0 . 0 3 f 9 p 0 . 0 4 f 8 p 0 . 0 5 h 9 p 0 . 0 6 g 8 p 0 . 0 7 h 7 p 0 . 0 8 j 8 p 0 . 0 9 j 7 p 0 . 1 0 h 6 p 0 . 1 1 j 6 d e c 1 a 4 p 0 . 2 1 a 5 p 0 . 2 2 b 5 p 0 . 2 3 b 6 p 0 . 2 4 a 6 p 0 . 2 5 c 5 p 0 . 2 7 a 8 p 0 . 2 6 a 7 p 0 . 2 9 c 7 p 0 . 2 8 b 7 p 0 . 1 7 g 2 p 0 . 1 8 h 1 p 0 . 1 9 f 2 p 0 . 2 0 g 1 d e c 2 f 1 p 0 . 1 2 j 5 p 0 . 1 3 h 5 p 0 . 1 4 h 4 p 0 . 1 5 j 4 s w d i o / n r e s e t j 2 s w d c l k h 2 p 0 . 1 6 j 3 p 0 . 3 1 e 8 v s s d 7 v s s g 6 v s s g 9 v s s h 3 u 1 n r f 5 1 8 2 2 - c e a a a n t 1 a 3 a n t 2 b 3 v d d _ p a a 2 g n d b 1 s e a 1 b 1 b a l - n r f 0 2 d 3 r f
bal - nrf02d3 characteristics docid024794 rev 6 3 / 11 2 characteristics table 1: absolute ratings (limiting values) symbol parameter value unit min. typ. max. p in input power rf in - 20 dbm v esd esd ratings human body model (jesd22 - a114 - c), all i/o one at a time while others connected to gnd 2000 - v esd ratings charge device model (jesd22 - c101 - c) 500 - esd ratings machine model, all i/o 200 - t op oper ating temperature (jesd22 - a115 - c), all i/o - 40 - +105 c t stg storage temperature range - 55c +150 c table 2: impedances (tamb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance - matched - ? z in nomi nal input impedance - 50 - ? table 3: rf performances (tamb = 25 c) symbol parameter value unit min. typ. max. f frequency range (bandwidth) 2400 2540 mhz i l insertion loss in bandwidth 1.9 db rl return loss in bandwidth 12 db imb phase imbalance 6 aimb amplitude imbalance 0.15 db 2f0 2nd harmonic s21 attenuation 4880 mhz 44 10 db 3f0 3rd harmonic s21 attenuation 7320 mhz 20 db
characteristics bal - nrf02d3 4 / 11 docid024794 rev 6 2.2 on - board measurements figure 3 : transmission (t amb = 25 c) figure 4 : insertion loss (t amb = 25 c) figure 5 : return loss on se port (t amb = 25 c) figure 6 : return loss on diff port (t amb = 25 c) figure 7 : amplitude imbalance (t amb = 25 c) figure 8 : phase imbalance (t amb = 25 c) 2 . 4 0 2 . 4 4 2 . 4 7 2 . 4 9 2 . 5 0 2 . 4 1 2 . 4 2 2 . 4 3 2 . 4 5 2 . 4 6 2 . 4 8 - 0 - 0 . 5 - 1 . 0 - 1 . 5 - 2 . 0 - 2 . 5 - 3 . 0 d b f ( g h z ) 2 . 4 0 2 . 4 4 2 . 4 7 2 . 4 9 2 . 5 0 - 1 0 - 1 1 - 1 2 - 1 3 - 1 4 - 1 5 2 . 4 1 2 . 4 2 2 . 4 3 2 . 4 5 2 . 4 6 2 . 4 8 d b f ( g h z ) - 1 5 . 0 - 1 7 . 5 - 2 0 . 0 - 2 2 . 5 - 2 5 . 0 2 . 4 0 2 . 4 4 2 . 4 7 2 . 4 9 2 . 5 0 2 . 4 1 2 . 4 2 2 . 4 3 2 . 4 5 2 . 4 6 2 . 4 8 d b f ( g h z ) - 0 - 5 - 1 0 - 1 5 - 2 0 - 2 5 - 3 0 d b 0 1 2 3 4 5 6 7 8 f ( g h z ) d e g r e e s 2 . 4 0 2 . 4 4 2 . 4 7 2 . 4 9 2 . 5 0 1 5 . 0 1 2 . 5 1 0 . 0 7 . 5 5 . 0 2 . 5 0 . 0 - 2 . 5 - 5 . 0 - 7 . 5 - 7 . 5 - 1 0 . 0 - 1 . 0 5 2 . 4 1 2 . 4 2 2 . 4 3 2 . 4 5 2 . 4 6 2 . 4 8 f ( g h z ) d b 2 . 4 0 2 . 4 4 2 . 4 7 2 . 4 9 2 . 5 0 0 . 5 0 . 4 0 . 3 0 . 2 0 . 1 0 . 0 - 0 . 1 - 0 . 2 - 0 . 3 - 0 . 4 - 0 . 5 2 . 4 1 2 . 4 2 2 . 4 3 2 . 4 5 2 . 4 6 2 . 4 8 f ( g h z )
bal - nrf02d3 characteristics docid024794 rev 6 5 / 11 table 4: compatibility matrix (nrf51422) nrf51422 ic revisi on packet/variant build code 1 ceaa a0a 2 ceaa bx0 3 cdab ax0 ceaa cx0 cfac ax0 table 5: compatibility matrix (nrf51822) nrf51822 ic revision packet/variant build code 1 ceaa ba ceaa b0 2 ceaa ca0 ceaa da0 ceaa dx0 3 cdab ax0 ceaa ex0 cfac ax0
package information bal - nrf02d3 6 / 11 docid024794 rev 6 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environm ental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. ? epoxy meets ul94, v0 ? lead - free pa ckage 3.1 flip - chip 5 bumps package information figure 9 : flip - chip 5 bumps package outline
bal - nrf02d3 package i nformation docid024794 rev 6 7 / 11 figure 10 : recommended land pat tern figure 11 : pcb stack - up recommendation 3 5 u m 3 5 u m 3 5 u m 3 5 u m 2 3 0 u m 2 3 0 u m 9 3 0 u m
package information bal - nrf02d3 8 / 11 docid024794 rev 6 3.2 flip - chip 5 bumps packing information figure 12 : marking figure 13 : flip chip tape and reel specifications more packing information is available in the application note: ? an2348 flip - chip: package description and recommendations for use ? an4315: bal - nrf02d3 matched balun with inte grated harmonics filter for nordic semiconductor ultralow power transceivers x y x w z w d o t , s t l o g o e c o p a c k g r a d e x x = m a r k i n g z = m a n u f a c t u r i n g l o c a t i o n y w w = d a t e c o d e
bal - nrf02d3 package information docid024794 rev 6 9 / 11 figure 14 : footprint - 3 mils stencil - non solder mask defined figure 15 : footprint - 3 mils stencil - solder mask defined figure 16 : footprint - 5 mils stencil - non solder mask defined figure 17 : footprint - 5 mils stencil - solder mask defined * d e p e n d i n g o n p a s t e , i t c a n g o d o w n t o 2 7 0 m c o p p e r p a d d i a m e t e r : 2 2 0 m r e c o m m e n d e d 1 8 0 m m i n i m u m 2 6 0 m m a x i m u m s o l d e r m a s k o p e n i n g : 3 2 0 m r e c o m m e n d e d 3 0 0 m m i n i m u m 3 4 0 m m a x i m u m s o l d e r s t e n c i l o p e n i n g : 3 3 0 m r e c o m m e n d e d * c o p p e r p a d d i a m e t e r : 2 2 0 m r e c o m m e n d e d 1 8 0 m m i n i m u m 2 6 0 m m a x i m u m s o l d e r m a s k o p e n i n g : 3 2 0 m r e c o m m e n d e d 3 0 0 m m i n i m u m s o l d e r s t e n c i l o p e n i n g : 2 2 0 m r e c o m m e n d e d * d e p e n d i n g o n p a s t e , i t c a n g o d o w n t o 2 7 0 m c o p p e r p a d d i a m e t e r : 2 2 0 m r e c o m m e n d e d 1 8 0 m m i n i m u m 2 6 0 m m a x i m u m s o l d e r m a s k o p e n i n g : 3 2 0 m r e c o m m e n d e d 3 0 0 m m i n i m u m s o l d e r s t e n c i l o p e n i n g : 3 3 0 m r e c o m m e n d e d * c o p p e r p a d d i a m e t e r : 2 2 0 m r e c o m m e n d e d 1 8 0 m m i n i m u m 2 6 0 m m a x i m u m s o l d e r m a s k o p e n i n g : 3 2 0 m r e c o m m e n d e d 3 0 0 m m i n i m u m 3 4 0 m m a x i m u m s o l d e r s t e n c i l o p e n i n g : 2 2 0 m r e c o m m e n d e d
ordering information bal - nrf02d3 10 / 11 docid024794 rev 6 4 ordering information table 6: ordering information order code marking package weight base qty. delivery mode bal - nrf02d3 sk flip - chip 5 bumps 1.58 mg 5000 tape and reel 5 revision history table 7: document revision history date revision changes 02 - jul - 2013 1 initial release. 30 - aug - 2013 2 updated table 1 . 13 - oct - 2014 3 updated figure 9 . 25 - mar - 2015 4 updated cover page, added table 4 and table 5 . 15 - ju n - 2015 5 updated table 1 . 07 - dec - 2016 6 updated table 1: "absolute ratings (limiting values)" .
bal - nrf02d3 docid024794 rev 6 11 / 11 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) reserve the right to make changes, corrections, enhancements, modifications , and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of or der acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and s t assumes no liability for application assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information se t forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces informa tion previously supplied in any prior versions of this document. ? 2016 stmicroelectronics C all rights reserved

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