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  http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 1 1 . . 5 5 x x 0 0 . . 5 5 5 5 m m m m r r e e d d & & y y e e l l l l o o w w g g r r e e e e n n s s m m d d OSRG0603C1C ver.a.2 features outline dimension bi-color super high brightness of surface mount led water clear flat mold compact package outline (lxwxt) of 1.6mm x 1.5mm x 0.55mm compatible to ir reflow soldering. applications backlighting (switches, keys, etc.)  marker lights (e.g. steps, exit ways, etc.)  yg red back view top view side view anode mark notes: 1. all dimensions are in millimeters ; 2. tolerance is 0.10 mm unless ? otherwise noted. side view absolute maximum rating 5b

directivity va l u e item symbo l red yg unit dc forward current i f 30 30 ma pulse forward current* i fp 100 100 ma reverse voltage v r 5 5 v power dissipation p d 78 78 mw operating temperature topr -40 ~ +85 
storage temperature tstg -40~ +85 
lead soldering temperature tsol 260 
/5sec    *pulse width max 0.1ms, duty ratio max 1/10  electrical -optical charac teristics 5b

v f (v) i r (a) iv(mcd) d(nm) 2 1/2(deg) min. typ. max. max. min. typ. max. min. typ. max. typ. part number color i f =5ma v r =5v i f =5ma red hr ? 1.8 2.1 2.6 10 - 30 - 620 631 640 120 OSRG0603C1C yellow green yg ? 1.8 2.2 2.6 10 - 20 - 565 570 575 120 note: * vf tolerance: 0.05v * dominant wavelength tolerance: 1nm * luminous intensity is nist reading. luminous intensity tolerance:10% led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 1 1 . . 5 5 x x 0 0 . . 5 5 5 5 m m m m r r e e d d & & y y e e l l l l o o w w g g r r e e e e n n s s m m d d OSRG0603C1C recommended soldering temperature ? time profile (reflow soldering) surface mounting condition in automatic mounting of the smd leds on print ed circuit boards, any bending, expanding and pulling forces or shock against the smd leds should be kept min. to prevent them from electrical failures and mechanical damages of the devices. soldering reflow -soldering of the smd leds should conform to the so ldering condition in the individual specifications. -smd leds are designed for reflow soldering. -in the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -we cannot guarantee the leds a fter they have been assembled using the solder dipping method. led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 1 1 . . 5 5 x x 0 0 . . 5 5 5 5 m m m m r r e e d d & & y y e e l l l l o o w w g g r r e e e e n n s s m m d d OSRG0603C1C 3) manual soldering conditions. - lead solder max. 300 for max. 3sec, and only one time. 
 - lead-free solder max. 350 for max. 3sec, and only one time. 
 - there is possibility that the bright ness of leds is decreased, whic h is influenced by heat or ambient atmosphere during reflow. it is recommended to use the nitrogen reflow method. - after leds have been soldered, repair should not be done. as repair is unavoidable, a double-head soldering iron should be used. it should be confirme d beforehand whether the characteristics of the leds will be damaged by repairing or not. - reflow soldering should not be done more than two times. led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 1 1 . . 5 5 x x 0 0 . . 5 5 5 5 m m m m r r e e d d & & y y e e l l l l o o w w g g r r e e e e n n s s m m d d OSRG0603C1C material true green j white/ blue/ yellow green/ yellow/ orange/ red j led & application technologies


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