1 / 3 www.asb.co.kr septem ber 2009 p lerow tm ale0859t3 internally matched lna module the plerow tm ale - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equipment of the mobile wire less (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case a llows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 824 894 gain db 33 34 gain flatness db ? 0.5 ? 0.6 noise figure db 0.60 0.65 output ip3 (1) dbm 38 40 s11/s22 (2) db - 20/ - 18 output p1db dbm 20 21 sw itching time (3) ? sec - supply current ma 200 220 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29~31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured wi th two tones at an output power of 4 dbm/tone separated by 1 mhz. 2) s11, s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage f rom 0 v to v s . pin number function 2 rf in 5 rf out 6 v s other s ground ou t line drawing (unit: mm) s 21 = 33.5 db@824 mhz = 34.5 db@894 mhz nf of 0.60 db over frequency unconditionally stable single 5 v supply high oip3@low current note: 1. the number and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at the lef t side. (recommended footprint) ale0859t3 asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) solder stencil area c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more infor m a tion c o u pl er c o u pl er c o u pl er c o u pl er 2 - stage single type specifications (in pr o duction) typ.@t = 25 ? c, v s = 5 v, freq. = 859 mhz, z o.sys = 50 ohms feature s description
2 / 3 www.asb.co.kr septem ber 2009 p lerow tm ale0859t3 internally matched lna module s - param e ters noise figure oip3 p1db 824~894 mhz +5 v typical performance (measured) s - parameters & k fa c tor
3 / 3 www.asb.co.kr septem ber 2009 p lerow tm ale0859t3 internally matched lna module 1) the tantal or mlc (multi layer ceramic) capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be determined by customer s dc supply status . the c a- pacitor should be placed as close as possible to v s pin and be connected directly to the ground plane for the best electrical perform ance . 2) dc blocking capacitors are always necessarily placed at the input and output port for allowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are inclu d- ed inside the ale module. therefore, c1 & c2 c apacitors may not be necessary, but can be added just in case that the customer wants. the value of c1 & c2 is determined by considering the application fr e- quency. application circuit recommended soldering reflo w process 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) + - ale out in c1 c2 v s tantal or mlc (multi layer c e ramic) c a pacitor in out vs size 25x25 mm (for ale - t series C 10x10 mm) evaluation board layout
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