s m d s c h o t t k y b a r r i e r r e c t i f i e r s CDBZ2240-HF thru. cdbz2260-hf company reserves the right to improve product design , functions and reliability without notice. maximum ratings (at t a=25c unless otherwise noted) v 40 v rrm c t j operating junction temperature range peak surge forward current (8.3ms single half sine-wave) parameter symbol cdb z22 40-h f unit a 40 i fsm a 2.0 i f(a v) a verage forward current repetitive peak reverse voltage -55 to +150 60 cdb z22 60-h f c t stg storage temperature range -55 to +150 reverse v oltage: 40 ~ 60 v olts forward current: 2.0 amp rohs device halogen free d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) s o d - 1 2 3 ( z 2 ) 0 . 0 6 3 ( 1 . 6 0 ) t y p . r 0 . 0 1 2 ( 0 . 3 0 ) 0 . 0 8 3 ( 2 . 1 0 ) 0 . 1 4 2 ( 3 . 6 0 ) 0 . 1 2 6 ( 3 . 2 0 ) 0 . 0 4 6 ( 1 . 1 6 ) 0 . 0 3 4 ( 0 . 8 6 ) 0 . 0 3 5 ( 0 . 9 0 ) 0 . 0 2 0 ( 0 . 5 0 ) 0 . 0 3 5 ( 0 . 9 0 ) 0 . 0 2 0 ( 0 . 5 0 ) 0 . 0 6 7 ( 1 . 7 0 ) 0 . 0 0 2 ( 0 . 0 5 ) 0 . 0 1 8 ( 0 . 4 5 ) 0 . 0 1 6 ( 0 . 4 1 ) 0 . 0 9 8 ( 2 . 5 0 ) 0 . 0 8 3 ( 2 . 1 0 ) features - low power loss, high ef ficiency . - high current capability , low vf . mechanical data - case: packed with frp substrate and epoxy underfilled. - t erminals: pure t in plated (lead-free), solderable per mil-std-750, method 2026. - lead less chip form, no lead damage. - plastic package has underwriters laboratory flammability classification 94v -0 . - w eight : 0.012 grams. 2 1 -55 to +125 circuit diagram page 1 rev :b qw -jb055 comchip t echnology co., l td.
ma parameter conditions min. t yp. max . unit v r = 4v , f = 1.0 mhz electrical characteristics (at t a=25c unless otherwise noted) c/w thermal resistance junction to ambient (note 2) 75 i rrm v f symbol r ja v c/w junction to lead (note 3) 15 r jl v r = max. v rrm , t a = 25c 0.40 0.2 0.03 1 15 pf notes : (1) pulse test width pw=300usec , 1% duty cycle. repetitive peak reverse current (note 1) i f = 0.5 a junction capacitance c j (2) mounted on p .c. board with 0.2 x 0.2"(5.0 x5.0mm) copper pad areas. - - - - - - - - - (3) mounted on p .c. board with recommend pad areas. forward voltage (note 1) junction to ambient (note 3) 135 r ja - - junction to lead (note 2) 17 r jl - - cdb z224 0-hf cdb z226 0-hf 0.43 - 0.70 comchip t echnology co., l td. page 2 s m d s c h o t t k y b a r r i e r r e c t i f i e r s company reserves the right to improve product design , functions and reliability without notice. cdb z224 0-hf i f = 1.0 a i f = 2.0 a v f cdb z226 0-hf 0.47 0.36 0.58 0.48 - - - - 0.50 - - - v v v v v i f = 0.5 a i f = 1.0 a i f = 2.0 a rev :b qw -jb055
comchip t echnology co., l td. page 3 s m d s c h o t t k y b a r r i e r r e c t i f i e r s company reserves the right to improve product design , functions and reliability without notice. ra ting and characteristic cur ves ( CDBZ2240-HF thru. cdbz2260-hf) percent of rated peak reverse v oltage, (%) 60 40 0 fig.4 - t ypical reverse characteristics 0.001 0.01 10 100 a v e r a g e f o r w a r d c u r r e n t , ( a ) forward v oltage, (v) fig.2 - t ypical forward characteristics 0.001 i n s t a n t a n e o u s f o r w a r d c u r r e n t , ( a ) case t emperature, (c) 0 1.6 2.8 0 25 175 0.8 2.0 100 1.2 20 80 2.4 number of cycles at 60hz fig.3 - max. non-repetitive forward peak forward surge current 0 10 50 1 10 100 40 20 p e a k f o r w a r d s u r g e c u r r e n t , ( a ) 30 8.3ms single half sine-wave 50 75 100 125 150 0.4 fig.1 - forward current derating curve i n s t a n t a n e o u s r e v e r s e l e a k a g e c u r r e n t , ( m a ) 0.1 1 reverse v oltage, (v) fig.5 - t ypical junction capacitance 10 400 0.1 10 100 100 j u n c t i o n c a p a c i t a n c e , ( p f ) 1 t j =25c f=1.0mhz vsig=50mvp-p resistive or inductive load p . c . b . mounted on 0.2 x 0.2"(5.0 x 5.0 mm ) copper p ad areas t j =100c t j =25c CDBZ2240-HF cdbz2260-hf 0 0.01 0.1 1 10 0.2 0.1 0.3 0.5 0.4 0.6 0.8 0.7 t a =25c cdbz2260-hf CDBZ2240-HF rev :b qw -jb055
b c d d d 2 d 1 e f p p 0 p 1 s y m b o l w w 1 ( m m ) ( i n c h ) 0 . 0 8 7 0 . 0 0 4 0 . 1 4 4 0 . 0 0 4 0 . 0 5 0 0 . 0 0 4 0 . 0 5 9 0 . 0 0 4 7 . 0 0 8 0 . 0 7 9 1 . 9 6 9 m i n . 0 . 5 1 2 0 . 0 2 0 s y m b o l ( m m ) ( i n c h ) 0 . 0 6 9 0 . 0 0 4 0 . 2 1 7 0 . 0 0 2 0 . 3 1 5 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 4 0 . 4 7 2 0 . 0 1 2 0 . 5 6 7 m a x . 2 . 2 0 0 . 1 0 3 . 6 5 0 . 1 0 8 . 0 0 0 . 1 0 1 . 5 0 0 . 1 0 5 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 5 0 . 0 m i n . 1 3 . 0 0 . 5 0 1 . 2 8 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 1 2 . 0 0 0 . 3 0 1 4 . 4 m a x . 1 7 8 2 . 0 0 reel t aping specification o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d w 1 t c direction of feed i n d e x h o l e d e f b w p p 0 p 1 a a d 2 s o d - 1 2 3 ( z 2 ) s o d - 1 2 3 ( z 2 ) comchip t echnology co., l td. page 4 s m d s c h o t t k y b a r r i e r r e c t i f i e r s company reserves the right to improve product design , functions and reliability without notice. rev :b qw -jb055
comchip t echnology co., l td. page 5 s m d s c h o t t k y b a r r i e r r e c t i f i e r s company reserves the right to improve product design , functions and reliability without notice. standard packaging c a s e t y p e 3 , 0 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k s o d - 1 2 3 ( z 2 ) suggested p ad layout marking code no tes : 1. dim ens ion s in inc hes an d ( mil lim ete r) 2. the layout is just for reference. 0.026 (0.67) 0.022 (0.57) 0.038 (0.96) 0.034 (0.86) 0.1 1 1 (2.83) 0.107 (2.73) 0.168 (4.26) ref . 0.067 (1.70) 0.063 (1.60) part number CDBZ2240-HF marking code l4. cdbz2260-hf l6. l . v oltage class halogen free cathode mark amps class rev :b qw -jb055
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