revisions ltr description date (yr-mo-da) approved a update boilerplate paragraphs to current mil-prf-38535 requirements. - ro 09-12-15 c. saffle rev sheet rev sheet rev status rev a a a a a a a a a of sheets sheet 1 2 3 4 5 6 7 8 9 pmic n/a prepared by rick c. officer defense supply center columbus columbus, ohio 43218-3990 http://www.dscc.dla.mil standard microcircuit drawing this drawing is available for use by all departments and agencies of the department of defense checked by charles e. besore approved by michael a. frye microcircuit, linear, quad, operational amplifier, monolithic silicon drawing approval date 93-09-14 amsc n/a revision level a size a cage code 67268 5962-93083 sheet 1 of 9 dscc form 2233 apr 97 5962-e069-10
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents two product assurance class levels consisting of high reliability (device classes q and m) and space application (device class v). a choice of case outli nes and lead finishes are available and are reflected in the part or identifying number (pin). when availabl e, a choice of radiation hardness assuranc e (rha) levels is reflected in the pin. 1.2 pin . the pin is as shown in the following example: 5962 - 93083 01 m c a federal stock class designator rha designator (see 1.2.1) device type (see 1.2.2) device class designator case outline (see 1.2.4) lead finish (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 rha designator . device classes q and v rha marked devices meet the mil-prf-38535 specified rha levels and are marked with the appropriate rha designator. device class m rha marked devices meet the mil-prf-38535, appendix a specified rha levels and are marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function 01 op-09 quad operational amplifier 1.2.3 device class designator . the device class designator is a single letter identifying the product assurance level as follows: device class device requirements documentation m vendor self-certification to the r equirements for mil-std-883 compliant, non- jan class level b microcircuits in accordance with mil-prf-38535, appendix a q or v certification and qua lification to mil-prf-38535 1.2.4 case outline(s) . the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style c gdip1-t14 or cdip2-t14 14 dual in line 1.2.5 lead finish . the lead finish is as specified in mil-prf-38535 for device classes q and v or mil-prf-38535, appendix a for device class m.
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 3 dscc form 2234 apr 97 1.3 absolute maximum ratings . 1 / supply voltage (v s ) ....................................................................................................... ? 22 v dc differential i nput volt age ............................................................................................... ? 30 v dc input voltage (v in ) ........................................................................................................ supply voltage output short circ uit durati on .......................................................................................... co ntinuous power dissipation (p d ) .................................................................................................. 800 mw storage temperatur e range ........................................................................................... -65 ? c to +150 ? c junction temperature range (t j ) ................................................................................... -65 ? c to +150 ? c lead temperatur e (soldering, 60 seconds) .................................................................... +300 ? c thermal resistance, junction-to-case ( ? jc ) ................................................................... see mil-std-1835 thermal resistance, junction-to-ambient ( ? ja ) .............................................................. 91 ? c/w 1.4 recommended operating conditions . supply voltage (v s ) ................................................................................................... ? 15 v dc ambient operating temperature range (t a ) ............................................................... -55 ? c to +125 ? c 2. applicable documents 2.1 government specificat ion, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of thes e documents are those cited in t he solicitation or contract. department of defense specification mil-prf-38535 - integrated circuits, manufacturing, general specification for. department of defense standards mil-std-883 - test met hod standard microcircuits. mil-std-1835 - interface standard electronic component case outlines. department of defense handbooks mil-hdbk-103 - list of standard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. ______ 1 / permanent damage may occur if any one absolute maximum rati ng is exceeded. functional operational is not implied, and device reliability may be impaired by exposure to high than recommended voltages for extended periods of time.
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 4 dscc form 2234 apr 97 3. requirements 3.1 item requirements . the individual item requirements for device classes q and v shall be in accordance with mil-prf-38535 and as specified herein or as modified in th e device manufacturer's qualit y management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described herein. the individual item requirements for device class m shall be in accordance with mil-prf-38535, appendix a for non-jan class level b devices and as specified herein. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil-prf-38535 and herein for device classes q and v or mil-prf-38535, appendix a and herein for device class m. 3.2.1 case outline . the case outline shall be in accordance with 1.2.4 herein. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 1. 3.3 electrical performance characteri stics and postirradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and pos tirradiation parameter limits are as specified in table i and shall apply over th e full ambient operating temperature range. 3.4 electrical test requirements . the electrical test requirem ents shall be the subgrou ps specified in table ii. the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 her ein. in addition, the manufacturer's pin may also be marked. for packages where marking of the entire smd pin is not feasible due to space limitat ions, the manufacturer has the option of not marking the "5962-" on the device. for rha produc t using this option, the rha des ignator shall still be marked. marking for device classes q and v shall be in accordance with mil-prf-38535. marking for device class m shall be in accordance with mil-prf-38535, appendix a. 3.5.1 certification/compliance mark . the certification mark for device classes q and v shall be a "qml" or "q" as required in mil-prf-38535. the compliance mark for device class m s hall be a "c" as required in mil-prf-38535, appendix a. 3.6 certificate of compliance . for device classes q and v, a certificate of compliance shall be required from a qml-38535 listed manufacturer in order to supply to the requirements of th is drawing (see 6.6.1 herein). for device class m, a certifica te of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in mil-hdbk-103 (see 6.6.2 herein). the certificate of compliance submitted to dscc-va prior to lis ting as an approved source of supply for this drawing shall affirm that the manufacturer' s product meets, for device classes q and v, the requirements of mil-prf-38535 and herein or for device class m, the requirem ents of mil-prf-38535, appendix a and herein. 3.7 certificat e of conformance . a certificate of conformance as required fo r device classes q and v in mil-prf-38535 or for device class m in mil-prf-38535, appendix a shall be provided wi th each lot of microcircuits delivered to this drawing. 3.8 notification of change for device class m . for device class m, notification to dscc-va of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 verification and review for device class m . for device class m, dscc, dscc's agent, and the acquiring activity retain the option to review the manufacturer's fac ility and applicable required documentation. offsho re documentation shall be made available onshore at the option of the reviewer. 3.10 microcircuit group assignment for device class m . device class m devices covere d by this drawing shall be in microcircuit group number 49 (s ee mil-prf-38535, appendix a).
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 5 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions 1 / -55 ? c ? t a ?? +125 ? c group a subgroups device type limits 2 / unit unless otherwise specified min max input offset voltage v os r s = 10 k ? 1 01 0.5 mv 2,3 1.0 input offset current i os 1 01 20 na 2,3 40 input bias current i b 1 01 -300 +300 na 2,3 -375 +375 common mode rejection ratio cmrr v cm = ? 12 v, r s = 10 k ? 1,2,3 01 100 db power supply rejection ratio psrr v s = ? 5, ? 15 v, r s = 10 k ? 1,2,3 01 32 ? v/v output voltage swing v o r l = 2 k ? 4,5,6 01 -11 +11 v large signal voltage gain a vo v o = ? 10 v, r l = 2 k ? 4 01 100 v/mv 5,6 50 power dissipation p d v o = 0 v, all four amplifiers 1 01 180 mw 2,3 200 channel separation cs 4 01 100 db input offset voltage match ? v os 1 01 0.75 mv 2,3 1 common mode rejection match ? cmr v cm = ? 12 v 1,2,3 01 94 db rise time 3 / t r a vcl = 1, v in = 50 mv, measured at 10% to 90% 9 01 145 ns overshoot os 9 01 25 % slew rate 3 / sr a vcl = 1, v out = 10 v, measured at 10% to 90%, r l ? 2 k ? 9 01 0.7 v/ ? s 1 / unless otherwise specified, v s = ? 15 v, r s = 50 ? , and v cm = 0 v. 2 / the algebraic convention, whereby the most negative value is minimum and the most positive is a maximum, is used in this table. negative current shall be defined as conventional current flow out of a device terminal. 3 / if not tested, shall be guaranteed to t he limits specified in table i herein.
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 6 dscc form 2234 apr 97 device type 01 case outline c terminal number terminal symbol 1 -input a 2 +input a 3 output a 4 output b 5 +input b 6 -input b 7 -v 8 -input c 9 +input c 10 output c 11 +v 12 output d 13 +input d 14 -input d figure 1. terminal connections .
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 7 dscc form 2234 apr 97 4. verification 4.1 sampling and inspection . for device classes q and v, sampling and inspection procedures shall be in accordance with mil-prf-38535 or as modified in the device manufacturer's q uality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or functi on as described herein. for device class m, sampling and inspection procedures shall be in accordance with mil-prf-38535, appendix a. 4.2 screening . for device classes q and v, screening shall be in accordance with mil-prf-38535, and shall be conducted on all devices prior to qualification and technology conform ance inspection. for device class m, screening shall be in accordance with method 5004 of mil-std-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 additional criteria for device class m . a. burn-in test, method 1015 of mil-std-883. (1) test condition a, b, c, or d. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, bi ases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of mil-std-883. (2) t a = +125 ? c, minimum. b. interim and final electrical test parameter s shall be as specified in table ii herein. 4.2.2 additional criteria for device classes q and v . a. the burn-in test duration, test cond ition and test temperature, or approved alte rnatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-3853 5. the burn-in test circuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb) in accordance with mil-prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, bi ases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of mil-std-883. b. interim and final electrical test parameter s shall be as specified in table ii herein. c. additional screening for device class v beyond the requ irements of device class q shall be as specified in mil-prf-38535, appendix b. 4.3 qualification inspection for device classes q and v . qualification inspection for device classes q and v shall be in accordance with mil-prf-38535. inspections to be performed sh all be those specified in mil-prf-38535 and herein for groups a, b, c, d, and e inspecti ons (see 4.4.1 through 4.4.4). 4.4 conformance inspection . technology conformance inspection for classes q and v shall be in accordance with mil-prf-38535 including groups a, b, c, d, and e inspections and as specified herein. quality conformance inspection for device class m shall be in accordance with mil-prf-38535, append ix a and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mi l-std-883 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection . a. tests shall be as spec ified in table ii herein. b. subgroups 7, 8, 10, and 11 in table i, method 5005 of mil-std- 883 shall be omitted.
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 8 dscc form 2234 apr 97 table ii. electrical test requirements . test requirements subgroups (in accordance with mil-std-883, method 5005, table i) subgroups (in accordance with mil-prf-38535, table iii) device class m device class q device class v interim electrical parameters (see 4.2) 1 1 1 final electrical parameters (see 4.2) 1,2,3,4,5,6 1 / 1,2,3,4,5,6 1 / 1,2,3,4,5,6 1 / group a test requirements (see 4.4) 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,2,3,4,5,6,9 group c end-point electrical parameters (see 4.4) 1 1 1 group d end-point electrical parameters (see 4.4) 1 1 1,2,3 group e end-point electrical parameters (see 4.4) --- --- --- 1 / pda applies to subgroup 1. 4.4.2 group c inspection . the group c inspection end-point electrical param eters shall be as specified in table ii herein. 4.4.2.1 additional criteria for device class m . steady-state life test conditi ons, method 1005 of mil-std-883: a. test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquirin g activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of mil-std-883. b. t a = +125 ? c, minimum. c. test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. 4.4.2.2 additional criteria for device classes q and v . the steady-state life te st duration, test conditi on and test temperature, or approved alternatives shall be as spec ified in the device manufacturer's qm plan in accordance with mil-prf-38535. the test circuit shall be maintained under document revision level control by the device manufacturer's trb in accordance with mil-prf-38535 and shall be made available to the acquiring or prep aring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of mil-std-883. 4.4.3 group d inspection . the group d inspection end-point electrical param eters shall be as specified in table ii herein. 4.4.4 group e inspection . group e inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. end-point electrical parameters shall be as specified in table ii herein. b. for device classes q and v, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in mil-prf-38535 for the rha level being tested. for device class m, the devices shall be subjected to radiation hardness assured tests as specified in mil- prf-38535, appendix a for the rha level being tested. all device classes must meet the postirradiation end-point electrical parameter limits as defined in table i at t a = +25 ? c ? 5 ? c, after exposure, to the subgroups specified in table ii herein.
standard microcircuit drawing size a 5962-93083 defense supply center columbus columbus, ohio 43218-3990 revision level a sheet 9 dscc form 2234 apr 97 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38535 for device classes q and v or mil-prf-38535, appendix a for device class m. 6. notes 6.1 intended use . microcircuits conforming to this drawing are inte nded for use for government microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.1.1 replaceability . microcircuits covered by this drawing will replac e the same generic device covered by a contractor prepared specification or drawing. 6.1.2 substitutability . device class q devices will replace device class m devices. 6.2 configurati on control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be a ccomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users should inform defens e supply center columbus (dscc) when a system application requires configuration control an d which smd's are applicable to that system. dscc will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectronic devices (fsc 5962) should contact dscc-va, telephone (614) 692-0544. 6.4 comments . comments on this drawing should be directed to dscc-va, columbus, ohio 43218-3990, or telephone (614) 692-0547. 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defined in mil-prf-38535 and mil-hdbk-1331. 6.6 sources of supply . 6.6.1 sources of supply for device classes q and v . sources of supply for device clas ses q and v are listed in qml-38535. the vendors listed in qml-38535 have submitt ed a certificate of compliance (see 3.6 herein) to dscc-va and have agreed to this drawing. 6.6.2 approved sources of supply for device class m . approved sources of supply for class m are listed in mil-hdbk-103. the vendors listed in mil-hdbk-103 have agreed to this drawin g and a certificate of complia nce (see 3.6 herein) has been submitted to and accepted by dscc-va.
standard microcircuit drawing bulletin date: 09-12-15 approved sources of supply for smd 5962-93083 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38535 during th e next revision. mil-hdbk-103 and qml-38535 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been subm itted to and accepted by dscc-va. this information bulletin is superseded by the next dated revision of mil-hdbk-103 and qml-38535. dscc maintains an online database of all current sources of supply at http://www.dscc.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-9308301mca 3 / op-09ay/883 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. 3 / not available from an approved source of supply. the last known supplier is listed below. vendor cage vendor name number and address 24355 (4) analog devices route 1 industrial park p.o. box 9106 norwood, ma 02062 point of contact: 7910 triad center drive greensboro, nc 27409-9605 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin.
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